DE60105030D1 - Überbrückungskondensator-verfahren zum erreichen eines gewünschten elektrischen impedanzwerts zwischen parallelen planaren leitern einer elektrischen stromverteilungsstruktur, und zugehörige elektrische stromverteilungsstrukturen - Google Patents

Überbrückungskondensator-verfahren zum erreichen eines gewünschten elektrischen impedanzwerts zwischen parallelen planaren leitern einer elektrischen stromverteilungsstruktur, und zugehörige elektrische stromverteilungsstrukturen

Info

Publication number
DE60105030D1
DE60105030D1 DE60105030T DE60105030T DE60105030D1 DE 60105030 D1 DE60105030 D1 DE 60105030D1 DE 60105030 T DE60105030 T DE 60105030T DE 60105030 T DE60105030 T DE 60105030T DE 60105030 D1 DE60105030 D1 DE 60105030D1
Authority
DE
Germany
Prior art keywords
power distribution
distribution structure
electrical power
capacitors
capacitor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60105030T
Other languages
English (en)
Other versions
DE60105030T2 (de
Inventor
Istvan Novak
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sun Microsystems Inc
Original Assignee
Sun Microsystems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sun Microsystems Inc filed Critical Sun Microsystems Inc
Application granted granted Critical
Publication of DE60105030D1 publication Critical patent/DE60105030D1/de
Publication of DE60105030T2 publication Critical patent/DE60105030T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/30—Circuit design
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10446—Mounted on an edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Electromagnetism (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Evolutionary Computation (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Amplifiers (AREA)
  • Measuring Instrument Details And Bridges, And Automatic Balancing Devices (AREA)
  • Power Conversion In General (AREA)
  • Structure Of Printed Boards (AREA)
  • Control Of Motors That Do Not Use Commutators (AREA)
  • Filters And Equalizers (AREA)
DE60105030T 2000-06-19 2001-06-14 Überbrückungskondensator-verfahren zum erreichen eines gewünschten elektrischen impedanzwerts zwischen parallelen planaren leitern einer elektrischen stromverteilungsstruktur, und zugehörige elektrische stromverteilungsstrukturen Expired - Fee Related DE60105030T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US596863 1990-10-12
US09/596,863 US6727774B1 (en) 2000-06-19 2000-06-19 Bypass capacitor methods for achieving a desired value of electrical impedance between parallel planar conductors of an electrical power distribution structure, and associated electrical power distribution structures
PCT/US2001/019380 WO2001099479A2 (en) 2000-06-19 2001-06-14 Bypass capacitor methods for achieving a desired value of electrical impedance between parallel planar conductors of an electrical power distribution structure, and associated electrical power distribution structures

Publications (2)

Publication Number Publication Date
DE60105030D1 true DE60105030D1 (de) 2004-09-23
DE60105030T2 DE60105030T2 (de) 2005-08-18

Family

ID=24389033

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60105030T Expired - Fee Related DE60105030T2 (de) 2000-06-19 2001-06-14 Überbrückungskondensator-verfahren zum erreichen eines gewünschten elektrischen impedanzwerts zwischen parallelen planaren leitern einer elektrischen stromverteilungsstruktur, und zugehörige elektrische stromverteilungsstrukturen

Country Status (7)

Country Link
US (1) US6727774B1 (de)
EP (1) EP1295516B1 (de)
JP (1) JP2004501515A (de)
AT (1) ATE274287T1 (de)
AU (1) AU2001269879A1 (de)
DE (1) DE60105030T2 (de)
WO (1) WO2001099479A2 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2504222C (en) 2002-10-22 2012-05-22 Jason A. Sullivan Robust customizable computer processing system
BR0315570A (pt) 2002-10-22 2005-08-23 Jason A Sullivan Módulo de controle de processamento não-periféricos possuindo propriedades aperfeiçoadas de dissipação de calor
WO2004038527A2 (en) 2002-10-22 2004-05-06 Isys Technologies Systems and methods for providing a dynamically modular processing unit
US7282647B2 (en) * 2002-12-23 2007-10-16 Intel Corporation Apparatus for improving coupling across plane discontinuities on circuit boards
DE10305520A1 (de) * 2003-02-11 2004-08-19 Robert Bosch Gmbh Vorrichtung und Verfahren zur Dämpfung von Hohlraumresonanzen in einer mehrschichtigen Trägereinrichtung
US20070083841A1 (en) * 2005-10-06 2007-04-12 Lantz John E Assessing bypass capacitor locations in printed circuit board design
US7705691B2 (en) * 2005-10-18 2010-04-27 Agency For Science, Technology & Research Capacitor interconnection
US7886431B2 (en) * 2006-06-06 2011-02-15 Teraspeed Consulting Group Llc Power distribution system for integrated circuits
US7773390B2 (en) * 2006-06-06 2010-08-10 Teraspeed Consulting Group Llc Power distribution system for integrated circuits
US20070279882A1 (en) * 2006-06-06 2007-12-06 Samtec, Inc. Power distribution system for integrated circuits
US20120002455A1 (en) * 2010-06-07 2012-01-05 Sullivan Jason A Miniturization techniques, systems, and apparatus relatng to power supplies, memory, interconnections, and leds
US8952503B2 (en) 2013-01-29 2015-02-10 International Business Machines Corporation Organic module EMI shielding structures and methods
CN113224237B (zh) * 2020-02-05 2022-07-29 联芯集成电路制造(厦门)有限公司 电容器结构的制作方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3209284A (en) 1963-06-05 1965-09-28 Charles O Hast Termination for strip transmission lines
US3678417A (en) 1971-07-14 1972-07-18 Collins Radio Co Planar r. f. load resistor for microstrip or stripline
US4371746A (en) 1978-01-05 1983-02-01 Peptek, Incorporated Edge terminations for impedance planes
JPS60134440A (ja) 1983-12-23 1985-07-17 Hitachi Ltd 半導体集積回路装置
US5114912A (en) 1991-05-13 1992-05-19 The United States Of America As Represented By The Secretary Of Commerce Two-dimensional, Josephson-array, voltage-tunable, high-frequency oscillator
US5266036A (en) 1992-06-02 1993-11-30 Hewlett-Packard Company Reduction of radio frequency emissions through terminating geometrically induced transmission lines in computer products
JP3089443B2 (ja) 1992-07-24 2000-09-18 本田技研工業株式会社 非放射性誘電体線路
US5598131A (en) 1995-11-16 1997-01-28 Emc Technology, Inc. AC coupled termination
JP3036629B2 (ja) * 1996-10-07 2000-04-24 富士ゼロックス株式会社 プリント配線基板装置
US5708400A (en) 1996-10-30 1998-01-13 Hewlett-Packard Company AC coupled termination of a printed circuit board power plane in its characteristic impedance
US5818315A (en) 1996-12-31 1998-10-06 Lucent Technologies Inc. Signal trace impedance control using a grid-like ground plane
JP3055136B2 (ja) * 1998-03-16 2000-06-26 日本電気株式会社 プリント回路基板
US6104258A (en) 1998-05-19 2000-08-15 Sun Microsystems, Inc. System and method for edge termination of parallel conductive planes in an electrical interconnecting apparatus
US6532439B2 (en) * 1998-06-18 2003-03-11 Sun Microsystems, Inc. Method for determining the desired decoupling components for power distribution systems

Also Published As

Publication number Publication date
AU2001269879A1 (en) 2002-01-02
WO2001099479A2 (en) 2001-12-27
WO2001099479A3 (en) 2002-03-28
DE60105030T2 (de) 2005-08-18
JP2004501515A (ja) 2004-01-15
US6727774B1 (en) 2004-04-27
ATE274287T1 (de) 2004-09-15
EP1295516A2 (de) 2003-03-26
EP1295516B1 (de) 2004-08-18

Similar Documents

Publication Publication Date Title
WO2002041673A3 (en) Adding electrical resistance in series with bypass capacitors to achieve a desired value of electrical impedance between conductors of an electrical power distribution structure
DE60105030D1 (de) Überbrückungskondensator-verfahren zum erreichen eines gewünschten elektrischen impedanzwerts zwischen parallelen planaren leitern einer elektrischen stromverteilungsstruktur, und zugehörige elektrische stromverteilungsstrukturen
CN106970268A (zh) 基于并联电容的单相架空输电线路相电压自校准方法
Haga et al. Equivalent-circuit expression of environmental noise electric fields in intrabody Communication channels
JP4500451B2 (ja) 容量測定システムのための測定方法
Murphy et al. High frequency performance of multilayer capacitors
He et al. Modelling strategy for film capacitors in emi filters
Younan et al. An exponentially tapered transmission line antenna
Desnica et al. Comparative characteristics of thick-film integrated LC filters
CN108344927A (zh) 一种电力电缆局部放电监测装置及方法
Yin et al. Modelling on-chip circular double-spiral stacked inductors for RFICs
Olsen et al. Improving the high-frequency attenuation of shunt capacitor, low-pass filters
CN109408865A (zh) 一种非固态铝电解电容等效电路模型及参数辨识方法
Morsey et al. A new broadband transmission line model for accurate simulation of dispersive interconnects
Wu et al. Modeling of integrated EMI filter with flexible multi-layer (FML) foils
Żukociński et al. Lossy inverters and their influence on coupled resonator filter characteristics
Zumel et al. Comparative study of flex-foil technology in HF planar transformer windings
Zhao et al. Wideband modeling of integrated power passive structures: the series resonator
CN206193259U (zh) 一种基于智能监测电法仪的信号调理电路
Holmberg et al. Wide-band lumped circuit model of the terminal and internal electromagnetic response of a coil with a coaxial insulation system
CN117371278A (zh) 一种架空多导体传输线瞬态串扰的快速分析方法
Condon et al. Tuning of resonant modal transformer models
Liu et al. Precise General Modeling of Windings for Wireless Power Transfer
Cyr et al. ARIES: using annular ring embedded resistors to set capacitor ESR in power distribution networks
Horng Extending the three-dimensional spectral-domain approach to hybrid microwave integrated circuits with passive and active lumped elements

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee