DE60028816D1 - Herstellung von unipolaren Komponenten - Google Patents

Herstellung von unipolaren Komponenten

Info

Publication number
DE60028816D1
DE60028816D1 DE60028816T DE60028816T DE60028816D1 DE 60028816 D1 DE60028816 D1 DE 60028816D1 DE 60028816 T DE60028816 T DE 60028816T DE 60028816 T DE60028816 T DE 60028816T DE 60028816 D1 DE60028816 D1 DE 60028816D1
Authority
DE
Germany
Prior art keywords
production
unipolar components
unipolar
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60028816T
Other languages
English (en)
Other versions
DE60028816T2 (de
Inventor
Frederic Lanois
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics SA
Original Assignee
STMicroelectronics SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics SA filed Critical STMicroelectronics SA
Application granted granted Critical
Publication of DE60028816D1 publication Critical patent/DE60028816D1/de
Publication of DE60028816T2 publication Critical patent/DE60028816T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66083—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by variation of the electric current supplied or the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. two-terminal devices
    • H01L29/6609—Diodes
    • H01L29/66143—Schottky diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
    • H01L29/0607—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration
    • H01L29/0611—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices
    • H01L29/0615—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE]
    • H01L29/0619—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE] with a supplementary region doped oppositely to or in rectifying contact with the semiconductor containing or contacting region, e.g. guard rings with PN or Schottky junction
    • H01L29/0623—Buried supplementary region, e.g. buried guard ring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
    • H01L29/861—Diodes
    • H01L29/872—Schottky diodes

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrodes Of Semiconductors (AREA)
DE60028816T 1999-12-22 2000-12-21 Herstellung von unipolaren Komponenten Expired - Fee Related DE60028816T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR9916291 1999-12-22
FR9916291A FR2803094B1 (fr) 1999-12-22 1999-12-22 Fabrication de composants unipolaires
PCT/FR2000/003655 WO2001047028A1 (fr) 1999-12-22 2000-12-21 Fabrication de composants unipolaires

Publications (2)

Publication Number Publication Date
DE60028816D1 true DE60028816D1 (de) 2006-07-27
DE60028816T2 DE60028816T2 (de) 2007-01-18

Family

ID=9553668

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60028816T Expired - Fee Related DE60028816T2 (de) 1999-12-22 2000-12-21 Herstellung von unipolaren Komponenten

Country Status (6)

Country Link
US (2) US6903413B2 (de)
EP (1) EP1240672B1 (de)
JP (1) JP2003535455A (de)
DE (1) DE60028816T2 (de)
FR (1) FR2803094B1 (de)
WO (1) WO2001047028A1 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6351009B1 (en) * 1999-03-01 2002-02-26 Fairchild Semiconductor Corporation MOS-gated device having a buried gate and process for forming same
US20060157745A1 (en) * 2005-01-18 2006-07-20 Stmicroelectronics S.A. Vertical unipolar component with a low leakage current
JP5351519B2 (ja) * 2005-12-27 2013-11-27 パワー・インテグレーションズ・インコーポレーテッド 高速回復整流器構造体の装置および方法
US8080848B2 (en) 2006-05-11 2011-12-20 Fairchild Semiconductor Corporation High voltage semiconductor device with lateral series capacitive structure
US20080296636A1 (en) * 2007-05-31 2008-12-04 Darwish Mohamed N Devices and integrated circuits including lateral floating capacitively coupled structures
JP2007311822A (ja) * 2007-07-23 2007-11-29 Toshiba Corp ショットキーバリヤダイオード
US8193565B2 (en) 2008-04-18 2012-06-05 Fairchild Semiconductor Corporation Multi-level lateral floating coupled capacitor transistor structures
US7943989B2 (en) * 2008-12-31 2011-05-17 Alpha And Omega Semiconductor Incorporated Nano-tube MOSFET technology and devices
US8624302B2 (en) * 2010-02-05 2014-01-07 Fairchild Semiconductor Corporation Structure and method for post oxidation silicon trench bottom shaping
US8704296B2 (en) 2012-02-29 2014-04-22 Fairchild Semiconductor Corporation Trench junction field-effect transistor
CN108063166A (zh) * 2016-11-09 2018-05-22 朱江 一种沟槽结构肖特基半导体装置及其制备方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1558506A (en) * 1976-08-09 1980-01-03 Mullard Ltd Semiconductor devices having a rectifying metalto-semicondductor junction
JPS57181172A (en) * 1981-04-30 1982-11-08 Toshiba Corp Schottky barrier diode and manufacture thereof
CA2064146C (en) * 1991-03-28 1997-08-12 Hisashi Ariyoshi Schottky barrier diode and a method of manufacturing thereof
JP2809253B2 (ja) * 1992-10-02 1998-10-08 富士電機株式会社 注入制御型ショットキーバリア整流素子
JP3272242B2 (ja) * 1995-06-09 2002-04-08 三洋電機株式会社 半導体装置
US5895951A (en) * 1996-04-05 1999-04-20 Megamos Corporation MOSFET structure and fabrication process implemented by forming deep and narrow doping regions through doping trenches
DE19631872C2 (de) * 1996-08-07 2003-04-17 Daimler Chrysler Ag Vertikales Halbleiterbauelement
SE9704149D0 (sv) * 1997-11-13 1997-11-13 Abb Research Ltd A semiconductor device of SiC and a transistor of SiC having an insulated gate
DE19815907C1 (de) * 1998-04-08 1999-05-27 Siemens Ag Durch Feldeffekt steuerbares Halbleiterbauelement
WO2001088997A2 (en) * 2000-05-13 2001-11-22 Koninklijke Philips Electronics N.V. Trench-gate semiconductor device and method of making the same
US6656797B2 (en) * 2001-12-31 2003-12-02 General Semiconductor, Inc. High voltage power MOSFET having a voltage sustaining region that includes doped columns formed by trench etching and ion implantation

Also Published As

Publication number Publication date
FR2803094A1 (fr) 2001-06-29
US20050202636A1 (en) 2005-09-15
US20030057442A1 (en) 2003-03-27
FR2803094B1 (fr) 2003-07-25
JP2003535455A (ja) 2003-11-25
EP1240672B1 (de) 2006-06-14
US7220644B2 (en) 2007-05-22
DE60028816T2 (de) 2007-01-18
US6903413B2 (en) 2005-06-07
EP1240672A1 (de) 2002-09-18
WO2001047028A1 (fr) 2001-06-28

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee