DE60021663D1 - Passivierungsätzmittel für metallpartikel - Google Patents

Passivierungsätzmittel für metallpartikel

Info

Publication number
DE60021663D1
DE60021663D1 DE60021663T DE60021663T DE60021663D1 DE 60021663 D1 DE60021663 D1 DE 60021663D1 DE 60021663 T DE60021663 T DE 60021663T DE 60021663 T DE60021663 T DE 60021663T DE 60021663 D1 DE60021663 D1 DE 60021663D1
Authority
DE
Germany
Prior art keywords
metal particles
passivating
equipment
passivating equipment
particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60021663T
Other languages
English (en)
Other versions
DE60021663T2 (de
Inventor
L Schulz
J Curtis
S Ginley
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Midwest Research Institute
Original Assignee
Midwest Research Institute
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Midwest Research Institute filed Critical Midwest Research Institute
Application granted granted Critical
Publication of DE60021663D1 publication Critical patent/DE60021663D1/de
Publication of DE60021663T2 publication Critical patent/DE60021663T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
    • H01L21/02071—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers the processing being a delineation, e.g. RIE, of conductive layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/14—Treatment of metallic powder
    • B22F1/145—Chemical treatment, e.g. passivation or decarburisation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/02—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using non-aqueous solutions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
    • C23G5/02—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents
    • C23G5/024—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents containing hydrocarbons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/45—Ohmic electrodes
    • H01L29/456—Ohmic electrodes on silicon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0224—Electrodes
    • H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Organic Chemistry (AREA)
  • Electromagnetism (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Sustainable Energy (AREA)
  • Ceramic Engineering (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Photovoltaic Devices (AREA)
  • Weting (AREA)
  • ing And Chemical Polishing (AREA)
DE60021663T 1999-01-21 2000-01-21 Passivierungsätzmittel für metallpartikel Expired - Lifetime DE60021663T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11656199P 1999-01-21 1999-01-21
US116561P 1999-01-21
PCT/US2000/001742 WO2000043573A1 (en) 1999-01-21 2000-01-21 Passivating etchants for metallic particles

Publications (2)

Publication Number Publication Date
DE60021663D1 true DE60021663D1 (de) 2005-09-08
DE60021663T2 DE60021663T2 (de) 2006-05-24

Family

ID=22367947

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60021663T Expired - Lifetime DE60021663T2 (de) 1999-01-21 2000-01-21 Passivierungsätzmittel für metallpartikel

Country Status (5)

Country Link
US (1) US6436305B1 (de)
EP (1) EP1066416B9 (de)
AU (1) AU2627100A (de)
DE (1) DE60021663T2 (de)
WO (1) WO2000043573A1 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030148024A1 (en) 2001-10-05 2003-08-07 Kodas Toivo T. Low viscosity precursor compositons and methods for the depositon of conductive electronic features
AU2001253780A1 (en) * 2000-10-25 2002-05-06 Midwest Research Institute Improved passivating etchants for metallic particles
US7338711B1 (en) 2002-08-12 2008-03-04 Quantum Logic Devices, Inc. Enhanced nanocomposite combustion accelerant and methods for making the same
AU2004262253A1 (en) * 2003-03-06 2005-02-10 Rensselaer Polytechnic Institute Rapid generation of nanoparticles from bulk solids at room temperature
US20080003364A1 (en) 2006-06-28 2008-01-03 Ginley David S Metal Inks
US20090101206A1 (en) * 2007-10-17 2009-04-23 Quantum Solar System Corp Process for manufacturing a photovoltaic or a light emitting polymer device
US8759144B2 (en) * 2007-11-02 2014-06-24 Alliance For Sustainable Energy, Llc Fabrication of contacts for silicon solar cells including printing burn through layers
US20120132272A1 (en) 2010-11-19 2012-05-31 Alliance For Sustainable Energy, Llc. Solution processed metal oxide thin film hole transport layers for high performance organic solar cells
CA2925436C (en) 2013-03-07 2021-10-26 Alliance For Sustainable Energy, Llc Methods for producing thin film charge selective transport layers

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4410569A (en) * 1980-06-13 1983-10-18 Minnesota Mining And Manufacturing Company Palladium (II) bis(hexafluoroacetylacetonate), adducts derived therefrom and uses thereof
US5273775A (en) * 1990-09-12 1993-12-28 Air Products And Chemicals, Inc. Process for selectively depositing copper aluminum alloy onto a substrate
JP2868890B2 (ja) * 1990-11-20 1999-03-10 大同ほくさん株式会社 アルミニウム粉末加圧成形品の製法
US5098516A (en) * 1990-12-31 1992-03-24 Air Products And Chemicals, Inc. Processes for the chemical vapor deposition of copper and etching of copper
US5387315A (en) * 1992-10-27 1995-02-07 Micron Technology, Inc. Process for deposition and etching of copper in multi-layer structures
WO1998046617A1 (en) * 1997-04-17 1998-10-22 The President And Fellows Of Harvard College Liquid precursor for formation of metal oxides

Also Published As

Publication number Publication date
WO2000043573A8 (en) 2000-11-02
DE60021663T2 (de) 2006-05-24
EP1066416A4 (de) 2002-01-16
AU2627100A (en) 2000-08-07
EP1066416B1 (de) 2005-08-03
WO2000043573A1 (en) 2000-07-27
US6436305B1 (en) 2002-08-20
EP1066416A1 (de) 2001-01-10
EP1066416B9 (de) 2006-01-04

Similar Documents

Publication Publication Date Title
DE50100912D1 (de) Korrosionsschutzverfahren für metalloberflächen
DE69927498D1 (de) Pektine aus aloe
AU2003270628A8 (en) Corrosion-resistant coated copper and method for making the same
DE50113859D1 (de) Monochromator für geladene Teilchen
DE69901515T2 (de) Gewindeverbindung für zwei metallrohre
ID29854A (id) Kompleks-kompleks logam berjembatan
PL373301A1 (en) Phosphodiesterase 4 inhibitors
DE60221872D1 (de) Kugelförmiges monodisperses metallteilchen
DE69903202D1 (de) Eisen-Kobalt Legierung
DE69938997D1 (de) Bauteil für die Oberflächenmontage
ITMI20021064A0 (it) Apparecchiatura e metodo per la valutazione di un corrispettivo di godimento di un veicolo
ID23216A (id) Peralatan penurun air-dalam
DE69835089D1 (de) Strahlrohr für geladene Teilchen
ATE216738T1 (de) Aluminium-legierung für aerosoldose
DE50007418D1 (de) Bindemittel für "Soft-Feel"-Lacke
DE60021663D1 (de) Passivierungsätzmittel für metallpartikel
DE69925789D1 (de) Bauteil für Bremsen
DE60216787D1 (de) Schmierpulver für pulvermetallurgie
DE60029333T8 (de) Herstellungsverfahren für wasserstoffspeicherndes metallpulver
AU2002360565A8 (en) Compositions and methods for normalizing assays
ITMI992330A0 (it) Apparecchiatura per la finitura di superfici metalliche
DE69922742D1 (de) Partikelfalle für Turbomaschinen
DE69804161T2 (de) Bauteil für Halbleiterapparatur
EP1364653A4 (de) Casoase-3-hemmer
DE59800483D1 (de) Rostblock

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Representative=s name: MULLER FOTTNER STEINECKE RECHTSANWAELTE PATENTANWAELTE