DE60018651D1 - Flüssige Vergussmasse - Google Patents

Flüssige Vergussmasse

Info

Publication number
DE60018651D1
DE60018651D1 DE60018651T DE60018651T DE60018651D1 DE 60018651 D1 DE60018651 D1 DE 60018651D1 DE 60018651 T DE60018651 T DE 60018651T DE 60018651 T DE60018651 T DE 60018651T DE 60018651 D1 DE60018651 D1 DE 60018651D1
Authority
DE
Germany
Prior art keywords
potting compound
liquid potting
liquid
compound
potting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60018651T
Other languages
English (en)
Other versions
DE60018651T2 (de
Inventor
Yushi Sakamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Publication of DE60018651D1 publication Critical patent/DE60018651D1/de
Application granted granted Critical
Publication of DE60018651T2 publication Critical patent/DE60018651T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/625—Hydroxyacids
    • C08G59/628—Phenolcarboxylic acids
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12528—Semiconductor component

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
DE60018651T 1999-08-02 2000-07-31 Flüssige Vergussmasse Expired - Fee Related DE60018651T2 (de)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP21842599 1999-08-02
JP21842499 1999-08-02
JP21842499 1999-08-02
JP21842599 1999-08-02
JP2000072083A JP3868179B2 (ja) 1999-08-02 2000-03-15 液状封止樹脂組成物、半導体装置の製造方法及び半導体装置
JP2000072083 2000-03-15

Publications (2)

Publication Number Publication Date
DE60018651D1 true DE60018651D1 (de) 2005-04-21
DE60018651T2 DE60018651T2 (de) 2006-03-30

Family

ID=27330143

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60018651T Expired - Fee Related DE60018651T2 (de) 1999-08-02 2000-07-31 Flüssige Vergussmasse

Country Status (7)

Country Link
US (1) US6562482B1 (de)
EP (1) EP1074571B1 (de)
JP (1) JP3868179B2 (de)
KR (1) KR100699606B1 (de)
DE (1) DE60018651T2 (de)
SG (1) SG92727A1 (de)
TW (1) TWI285652B (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003289089A (ja) * 2002-03-28 2003-10-10 Sumitomo Bakelite Co Ltd 半導体装置の製造方法及び半導体装置
US7063413B2 (en) * 2003-07-23 2006-06-20 Hewlett-Packard Development Company, L.P. Fluid ejection cartridge utilizing a two-part epoxy adhesive
JP4729873B2 (ja) * 2004-06-23 2011-07-20 住友ベークライト株式会社 半導体素子の組立方法
JP2006104393A (ja) * 2004-10-07 2006-04-20 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
DE102004049717A1 (de) * 2004-10-11 2006-04-13 Henkel Kgaa Alterungsbeständige Beschichtungen und Klebeverbunde
JP4821166B2 (ja) * 2005-04-20 2011-11-24 住友ベークライト株式会社 半導体封止用液状樹脂組成物、その硬化物、並びにそれを用いた半導体装置及びチップの再生方法
JP4973037B2 (ja) * 2006-07-07 2012-07-11 住友ベークライト株式会社 樹脂組成物、封止材、半導体装置および半導体装置の製造方法
JP4802987B2 (ja) * 2006-11-08 2011-10-26 住友ベークライト株式会社 接着フィルム
US9085685B2 (en) 2011-11-28 2015-07-21 Nitto Denko Corporation Under-fill material and method for producing semiconductor device
CN103184022B (zh) * 2011-12-30 2017-09-19 汉高股份有限及两合公司 用于硅片制备中的暂时性粘合用粘合剂组合物
KR102072060B1 (ko) * 2013-08-05 2020-01-31 히타치가세이가부시끼가이샤 에폭시 수지 조성물 및 전자 부품 장치
JP6221529B2 (ja) * 2013-09-04 2017-11-01 日立化成株式会社 熱硬化性樹脂成形材料及び電子部品装置
EP3466992B1 (de) * 2016-05-31 2020-07-08 Mitsubishi Gas Chemical Company, Inc. Harzzusammensetzung, laminat, halbleiterwafer mit harzzusammensetzungsschicht, substrat zur montage eines halbleiters mit harzzusammensetzungsschicht und halbleiterbauelement
EP4368651A1 (de) 2022-11-09 2024-05-15 Sika Technology AG Härter für epoxidharze mit diphenolsäure
CN117106286B (zh) * 2023-10-19 2024-03-22 聚灿光电科技（宿迁）有限公司 一种led复合封装材料及其制备方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4067838A (en) * 1975-02-15 1978-01-10 Dai Nippon Toryo Co., Ltd. Chelate-forming aqueous resin composition
US4663190A (en) * 1984-03-08 1987-05-05 Hitachi Chemical Company, Ltd. Process for producing semiconductor element
JPS63225616A (ja) * 1986-10-01 1988-09-20 Toray Ind Inc 半導体封止用樹脂組成物
JP2600258B2 (ja) * 1988-03-25 1997-04-16 東レ株式会社 半導体封止用樹脂組成物
JPH0329352A (ja) * 1989-06-26 1991-02-07 Nitto Denko Corp 半導体装置
US5128746A (en) * 1990-09-27 1992-07-07 Motorola, Inc. Adhesive and encapsulant material with fluxing properties
JPH10330460A (ja) * 1997-06-03 1998-12-15 Toshiba Chem Corp 注形用エポキシ樹脂組成物
US6367150B1 (en) 1997-09-05 2002-04-09 Northrop Grumman Corporation Solder flux compatible with flip-chip underfill material
WO1999036484A1 (en) * 1998-01-16 1999-07-22 Loctite (R & D) Limited Curable epoxy-based compositions
JP2000141084A (ja) 1998-10-02 2000-05-23 Sophia Systems & Technology はんだをその場所でカプセルに包むための重合性フラックス組成物

Also Published As

Publication number Publication date
JP2001106770A (ja) 2001-04-17
SG92727A1 (en) 2002-11-19
TWI285652B (en) 2007-08-21
KR100699606B1 (ko) 2007-03-23
JP3868179B2 (ja) 2007-01-17
KR20010067046A (ko) 2001-07-12
US6562482B1 (en) 2003-05-13
EP1074571A3 (de) 2002-10-02
DE60018651T2 (de) 2006-03-30
EP1074571A2 (de) 2001-02-07
EP1074571B1 (de) 2005-03-16

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee