DE60007872D1 - Herstellungsverfahren eines elektronischen leiterplattenmodul mit wärmeableitung unter benutzung von einer konvektionsgekühlten leiterplatter - Google Patents

Herstellungsverfahren eines elektronischen leiterplattenmodul mit wärmeableitung unter benutzung von einer konvektionsgekühlten leiterplatter

Info

Publication number
DE60007872D1
DE60007872D1 DE60007872T DE60007872T DE60007872D1 DE 60007872 D1 DE60007872 D1 DE 60007872D1 DE 60007872 T DE60007872 T DE 60007872T DE 60007872 T DE60007872 T DE 60007872T DE 60007872 D1 DE60007872 D1 DE 60007872D1
Authority
DE
Germany
Prior art keywords
pcb
electronic
circuit card
module
convection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60007872T
Other languages
English (en)
Other versions
DE60007872T2 (de
Inventor
Jacob Tzlil
Ronen Zagoory
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Elta Systems Ltd
Original Assignee
Elta Electronics Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Elta Electronics Industries Ltd filed Critical Elta Electronics Industries Ltd
Application granted granted Critical
Publication of DE60007872D1 publication Critical patent/DE60007872D1/de
Publication of DE60007872T2 publication Critical patent/DE60007872T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1401—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means
    • H05K7/1402—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards
    • H05K7/1404—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards by edge clamping, e.g. wedges
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20545—Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T403/00—Joints and connections
    • Y10T403/76—Joints and connections having a cam, wedge, or tapered portion

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE60007872T 1999-07-02 2000-06-30 Herstellungsverfahren eines elektronischen leiterplattenmodul mit wärmeableitung unter benutzung von einer konvektionsgekühlten leiterplatter Expired - Lifetime DE60007872T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
IL13077599 1999-07-02
IL130775A IL130775A (en) 1999-07-02 1999-07-02 Conduction cooled electronic card module and method of producing the same utilizing an electronic circuit card originally designed for convection cooling
PCT/IL2000/000379 WO2001003486A1 (en) 1999-07-02 2000-06-30 Utilizing a convection cooled electronic circuit card for producing a conduction cooled electronic card module

Publications (2)

Publication Number Publication Date
DE60007872D1 true DE60007872D1 (de) 2004-02-26
DE60007872T2 DE60007872T2 (de) 2004-11-11

Family

ID=11072983

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60007872T Expired - Lifetime DE60007872T2 (de) 1999-07-02 2000-06-30 Herstellungsverfahren eines elektronischen leiterplattenmodul mit wärmeableitung unter benutzung von einer konvektionsgekühlten leiterplatter

Country Status (9)

Country Link
US (2) US6392891B1 (de)
EP (1) EP1198978B1 (de)
AT (1) ATE258367T1 (de)
AU (1) AU5561300A (de)
DE (1) DE60007872T2 (de)
DK (1) DK1198978T3 (de)
ES (1) ES2215054T3 (de)
IL (1) IL130775A (de)
WO (1) WO2001003486A1 (de)

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US6639801B2 (en) * 2001-08-10 2003-10-28 Agilent Technologies, Inc. Mechanical packaging architecture for heat dissipation
JP4067802B2 (ja) * 2001-09-18 2008-03-26 松下電器産業株式会社 照明装置
US6762939B2 (en) * 2002-02-20 2004-07-13 Intel Corporation Thermal solution for a mezzanine card
US6721182B1 (en) 2002-10-10 2004-04-13 Harris Corporation Circuit card module including mezzanine card heat sink and related methods
US6760220B2 (en) * 2002-11-25 2004-07-06 Lockheed Martin Corporation Rugged modular PC 104 chassis with blind mate connector and forced convection cooling capabilities
US6768642B2 (en) * 2002-12-16 2004-07-27 Lockheed Martin Corporation VME circuit host card with triple mezzanine configuration
US6839235B2 (en) * 2002-12-19 2005-01-04 Dy 4 Systems Inc. Embedded heat pipe for a conduction cooled circuit card assembly
JP2006514429A (ja) * 2003-01-29 2006-04-27 コーニンクレッカ　フィリップス　エレクトロニクス　エヌ　ヴィ 電子器具用の放熱装置
US7970006B1 (en) * 2003-03-10 2011-06-28 Ciena Corporation Dynamic configuration for a modular interconnect
US7150109B2 (en) * 2003-08-25 2006-12-19 Isothermal Systems Research, Inc. Dry-wet thermal management system
US7180741B1 (en) 2003-08-26 2007-02-20 Isothermal Systems Research, Inc. Spray cool system with a dry access chamber
US7043933B1 (en) 2003-08-26 2006-05-16 Isothermal Systems Research, Inc. Spray coolant reservoir system
US7291783B2 (en) * 2004-02-19 2007-11-06 International Business Machines Corporation Mounting components to a hardware casing
US7152126B2 (en) * 2004-08-12 2006-12-19 Motorola, Inc. Stacked 3U payload module unit
US7088583B2 (en) * 2004-10-25 2006-08-08 International Business Machines Corporation System for airflow management in electronic enclosures
US7113401B2 (en) * 2004-10-25 2006-09-26 International Business Machines Corporation System for airflow management in electronic enclosures
US7324336B2 (en) * 2005-09-27 2008-01-29 Lockheed Martin Corporation Flow through cooling assemblies for conduction-cooled circuit modules
JP4699967B2 (ja) * 2006-09-21 2011-06-15 株式会社ソニー・コンピュータエンタテインメント 情報処理装置
US20090080163A1 (en) * 2007-05-17 2009-03-26 Lockheed Martin Corporation Printed wiring board assembly
US20090147472A1 (en) * 2007-12-11 2009-06-11 Honeywell International Inc. Means to Utilize Conduction-cooled Electronics Modules in an Air Cooled System
US7796384B2 (en) * 2008-08-27 2010-09-14 Honeywell International Inc. Hybrid chassis cooling system
US7961475B2 (en) * 2008-10-23 2011-06-14 International Business Machines Corporation Apparatus and method for facilitating immersion-cooling of an electronic subsystem
US7885070B2 (en) * 2008-10-23 2011-02-08 International Business Machines Corporation Apparatus and method for immersion-cooling of an electronic system utilizing coolant jet impingement and coolant wash flow
US7916483B2 (en) * 2008-10-23 2011-03-29 International Business Machines Corporation Open flow cold plate for liquid cooled electronic packages
US7983040B2 (en) * 2008-10-23 2011-07-19 International Business Machines Corporation Apparatus and method for facilitating pumped immersion-cooling of an electronic subsystem
US7944694B2 (en) 2008-10-23 2011-05-17 International Business Machines Corporation Liquid cooling apparatus and method for cooling blades of an electronic system chassis
US8081478B1 (en) * 2008-12-09 2011-12-20 Lockheed Martin Corporation Fluid cooled electronics module cover
US8179677B2 (en) 2010-06-29 2012-05-15 International Business Machines Corporation Immersion-cooling apparatus and method for an electronic subsystem of an electronics rack
US8184436B2 (en) 2010-06-29 2012-05-22 International Business Machines Corporation Liquid-cooled electronics rack with immersion-cooled electronic subsystems
US8369091B2 (en) 2010-06-29 2013-02-05 International Business Machines Corporation Interleaved, immersion-cooling apparatus and method for an electronic subsystem of an electronics rack
US8351206B2 (en) 2010-06-29 2013-01-08 International Business Machines Corporation Liquid-cooled electronics rack with immersion-cooled electronic subsystems and vertically-mounted, vapor-condensing unit
US8345423B2 (en) 2010-06-29 2013-01-01 International Business Machines Corporation Interleaved, immersion-cooling apparatuses and methods for cooling electronic subsystems
US8427828B2 (en) * 2010-07-20 2013-04-23 Themis Computer Printed circuit board module enclosure and apparatus using same
US8233279B2 (en) * 2010-11-04 2012-07-31 Ge Intelligent Platforms, Inc. Wedge lock for use with a single board computer and method of assembling a computer system
IL215700A (en) 2011-10-11 2015-08-31 Elta Systems Ltd Cooling system and method
US8861213B2 (en) * 2012-06-29 2014-10-14 Violin Memory, Inc. Circuit card and cage arrangement with improved cooling
US9417670B2 (en) 2012-08-07 2016-08-16 Lockheed Martin Corporation High power dissipation mezzanine card cooling frame
US9426931B2 (en) 2014-02-07 2016-08-23 Lockheed Martin Corporation Fluid-flow-through cooling of circuit boards
US9357670B2 (en) 2014-02-18 2016-05-31 Lockheed Martin Corporation Efficient heat transfer from conduction-cooled circuit cards
FR3103076B1 (fr) * 2019-11-07 2022-02-25 Alstom Transp Tech Ensemble amélioré constitué d’un support de réception de cartes électroniques et d’un châssis électronique en mezzanine
US11140767B2 (en) * 2020-03-05 2021-10-05 Hamilton Sundstrand Corporation Conductive thermal management architecture for electronic modules in a two-card assembly
US11259445B2 (en) 2020-03-05 2022-02-22 Hamilton Sundstrand Corporation Cooling mechanism for electrionic component mounted on a printed wiring board

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US4536824A (en) 1983-03-28 1985-08-20 Goodyear Aerospace Corporation Indirect cooling of electronic circuits
US5010444A (en) 1987-11-13 1991-04-23 Radstone Technology Limited Rack mounted circuit board
US4916575A (en) 1988-08-08 1990-04-10 Asten Francis C Van Multiple circuit board module
US5057968A (en) 1989-10-16 1991-10-15 Lockheed Corporation Cooling system for electronic modules
JPH04113695A (ja) * 1990-09-03 1992-04-15 Fujitsu Ltd 電子機器の放熱構造
US5177666A (en) 1991-10-24 1993-01-05 Bland Timothy J Cooling rack for electronic devices
US5258887A (en) 1992-06-15 1993-11-02 Eaton Corporation Electrical device cooling system using a heat sink attached to a circuit board containing heat conductive layers and channels
US5414592A (en) * 1993-03-26 1995-05-09 Honeywell Inc. Heat transforming arrangement for printed wiring boards
US5343358A (en) 1993-04-26 1994-08-30 Ncr Corporation Apparatus for cooling electronic devices
JP3385482B2 (ja) 1993-11-15 2003-03-10 株式会社日立製作所 電子機器
US5784256A (en) 1994-09-14 1998-07-21 Kabushiki Kaisha Toshiba Portable computer having a circuit board including a heat-generating IC chip and a metal frame supporting the circuit board
DE19528632A1 (de) * 1995-08-04 1997-02-06 Bosch Gmbh Robert Steuergerät bestehend aus mindestens zwei Gehäuseteilen
US5794454A (en) 1996-12-04 1998-08-18 International Business Machines Corporation Cooling device for hard to access non-coplanar circuit chips
US5844777A (en) 1997-01-27 1998-12-01 At&T Corp. Apparatus for heat removal from a PC card array
US6212075B1 (en) * 1998-12-30 2001-04-03 Honeywell Inc. Adapter kit to allow extended width wedgelock for use in a circuit card module

Also Published As

Publication number Publication date
US20020186544A1 (en) 2002-12-12
EP1198978B1 (de) 2004-01-21
US6621706B2 (en) 2003-09-16
IL130775A0 (en) 2001-01-28
WO2001003486A1 (en) 2001-01-11
EP1198978A1 (de) 2002-04-24
DE60007872T2 (de) 2004-11-11
IL130775A (en) 2007-03-08
AU5561300A (en) 2001-01-22
ES2215054T3 (es) 2004-10-01
US6392891B1 (en) 2002-05-21
ATE258367T1 (de) 2004-02-15
DK1198978T3 (da) 2004-06-28

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Legal Events

Date Code Title Description
8327 Change in the person/name/address of the patent owner

Owner name: ELTA SYSTEMS LTD., ASHDOD, IL

8364 No opposition during term of opposition