DE59607296D1 - Thermally conductive fastening of an electronic power component on a printed circuit board with a cooling plate - Google Patents

Thermally conductive fastening of an electronic power component on a printed circuit board with a cooling plate

Info

Publication number
DE59607296D1
DE59607296D1 DE59607296T DE59607296T DE59607296D1 DE 59607296 D1 DE59607296 D1 DE 59607296D1 DE 59607296 T DE59607296 T DE 59607296T DE 59607296 T DE59607296 T DE 59607296T DE 59607296 D1 DE59607296 D1 DE 59607296D1
Authority
DE
Germany
Prior art keywords
circuit board
printed circuit
thermally conductive
cooling plate
power component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE59607296T
Other languages
German (de)
Inventor
Hans-Martin Hiller
Martin Stratmann
Friedrich Werhahn
Wolfram Debus
Guenter Oppermann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Braun GmbH
Original Assignee
Braun GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Braun GmbH filed Critical Braun GmbH
Application granted granted Critical
Publication of DE59607296D1 publication Critical patent/DE59607296D1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0382—Continuously deformed conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0397—Tab
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09054—Raised area or protrusion of metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DE59607296T 1995-06-27 1996-05-03 Thermally conductive fastening of an electronic power component on a printed circuit board with a cooling plate Expired - Fee Related DE59607296D1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19523366 1995-06-27
DE19533251A DE19533251A1 (en) 1995-06-27 1995-09-08 Method for the thermally conductive fastening of an electronic power component on a printed circuit board with a heat sink or heat sink

Publications (1)

Publication Number Publication Date
DE59607296D1 true DE59607296D1 (en) 2001-08-23

Family

ID=7765377

Family Applications (2)

Application Number Title Priority Date Filing Date
DE19533251A Ceased DE19533251A1 (en) 1995-06-27 1995-09-08 Method for the thermally conductive fastening of an electronic power component on a printed circuit board with a heat sink or heat sink
DE59607296T Expired - Fee Related DE59607296D1 (en) 1995-06-27 1996-05-03 Thermally conductive fastening of an electronic power component on a printed circuit board with a cooling plate

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE19533251A Ceased DE19533251A1 (en) 1995-06-27 1995-09-08 Method for the thermally conductive fastening of an electronic power component on a printed circuit board with a heat sink or heat sink

Country Status (1)

Country Link
DE (2) DE19533251A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006009812B4 (en) * 2006-03-01 2008-09-04 Beru Ag Mounting arrangement for several power semiconductors and circuit with such a mounting arrangement
DE102010013334A1 (en) 2010-03-30 2012-05-10 Borgwarner Beru Systems Gmbh Circuit board assembly has metallic carrier plate that is soldered with electrical component, and equipped with component carrying area placed in recess of printed circuit board

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL7704770A (en) * 1977-05-02 1978-11-06 Philips Nv PROCEDURE FOR APPLYING SPACERS TO AN INSULATING SUBSTRATE.
US4227036A (en) * 1978-09-18 1980-10-07 Microwave Semiconductor Corp. Composite flanged ceramic package for electronic devices
US4367523A (en) * 1981-02-17 1983-01-04 Electronic Devices, Inc. Rectifier bridge unit
DE3147789A1 (en) * 1981-12-03 1983-06-09 Brown, Boveri & Cie Ag, 6800 Mannheim Power module and method of producing it
FR2615347B1 (en) * 1987-05-15 1993-07-23 Neiman Sa POWER MODULE FOR AUTOMOTIVE EQUIPMENT
DE4226816C2 (en) * 1992-08-13 1996-08-22 Licentia Gmbh Device for heat dissipation from a housing of an integrated circuit
DE9308845U1 (en) * 1993-06-14 1993-08-12 Blaupunkt-Werke Gmbh, 31139 Hildesheim Electrical circuit

Also Published As

Publication number Publication date
DE19533251A1 (en) 1997-01-02

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee