DE59203064D1 - Filler for thermally conductive plastics. - Google Patents
Filler for thermally conductive plastics.Info
- Publication number
- DE59203064D1 DE59203064D1 DE59203064T DE59203064T DE59203064D1 DE 59203064 D1 DE59203064 D1 DE 59203064D1 DE 59203064 T DE59203064 T DE 59203064T DE 59203064 T DE59203064 T DE 59203064T DE 59203064 D1 DE59203064 D1 DE 59203064D1
- Authority
- DE
- Germany
- Prior art keywords
- filler
- thermally conductive
- conductive plastics
- plastics
- thermally
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01F—COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM, CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THE RARE-EARTH METALS
- C01F7/00—Compounds of aluminium
- C01F7/02—Aluminium oxide; Aluminium hydroxide; Aluminates
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/30—Particle morphology extending in three dimensions
- C01P2004/32—Spheres
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/51—Particles with a specific particle size distribution
- C01P2004/53—Particles with a specific particle size distribution bimodal size distribution
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/62—Submicrometer sized, i.e. from 0.1-1 micrometer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CH45491 | 1991-02-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE59203064D1 true DE59203064D1 (en) | 1995-09-07 |
Family
ID=4187395
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE59203064T Expired - Fee Related DE59203064D1 (en) | 1991-02-14 | 1992-02-06 | Filler for thermally conductive plastics. |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP0499585B1 (en) |
| JP (1) | JP3176416B2 (en) |
| KR (1) | KR100210184B1 (en) |
| CA (1) | CA2061093A1 (en) |
| DE (1) | DE59203064D1 (en) |
| TW (1) | TW197458B (en) |
Families Citing this family (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3359410B2 (en) * | 1994-03-04 | 2002-12-24 | 三菱電機株式会社 | Epoxy resin composition for molding, molded product for high voltage equipment using the same, and method for producing the same |
| WO1998016585A1 (en) * | 1996-10-16 | 1998-04-23 | Kureha Kagaku Kogyo K.K. | Resin composition |
| US5929138A (en) * | 1996-11-05 | 1999-07-27 | Raychem Corporation | Highly thermally conductive yet highly comformable alumina filled composition and method of making the same |
| JP2001168246A (en) * | 1999-11-30 | 2001-06-22 | Three M Innovative Properties Co | Heat conductive sheet and manufacturing method thereof |
| US6794030B1 (en) | 1999-11-30 | 2004-09-21 | 3M Innovative Properties Company | Heat conductive sheet and method of producing the sheet |
| US6500891B1 (en) | 2000-05-19 | 2002-12-31 | Loctite Corporation | Low viscosity thermally conductive compositions containing spherical thermally conductive particles |
| JP4118691B2 (en) * | 2001-05-18 | 2008-07-16 | 株式会社日立製作所 | Thermosetting resin cured product |
| US7053018B2 (en) | 2001-05-30 | 2006-05-30 | Showa Denko K.K. | Spherical alumina particles and production process thereof |
| JP4920141B2 (en) * | 2001-05-30 | 2012-04-18 | 昭和電工株式会社 | Alumina particles and method for producing the same |
| JP2002348115A (en) * | 2001-05-30 | 2002-12-04 | Showa Denko Kk | Alumina particle and method for producing the same |
| US6887811B2 (en) | 2001-05-30 | 2005-05-03 | Showa Denko K.K. | Spherical alumina particles and production process thereof |
| JP3807995B2 (en) * | 2002-03-05 | 2006-08-09 | ポリマテック株式会社 | Thermally conductive sheet |
| DE10260098A1 (en) * | 2002-12-19 | 2004-07-01 | Basf Ag | Electrically insulating and thermally conductive polyester molding compounds |
| JP4526064B2 (en) * | 2003-06-04 | 2010-08-18 | 昭和電工株式会社 | Corundum for resin filling and resin composition |
| WO2004108812A1 (en) * | 2003-06-04 | 2004-12-16 | Showa Denko K.K. | Corundum for filling in resin and resin composition |
| KR100709548B1 (en) * | 2003-06-04 | 2007-04-20 | 쇼와 덴코 가부시키가이샤 | Corundum for filling in resin and resin composition |
| JP4631272B2 (en) * | 2003-11-14 | 2011-02-16 | 東レ株式会社 | Highly filled resin composition and molded product obtained therefrom |
| US20090188701A1 (en) * | 2004-01-08 | 2009-07-30 | Hiroshi Tsuzuki | Inorganic powder, resin composition filled with the powder and use thereof |
| WO2006062210A1 (en) | 2004-12-06 | 2006-06-15 | Showa Denko K.K. | Surface modified corundum and resin composition |
| JP4890063B2 (en) * | 2006-03-20 | 2012-03-07 | 新日鐵化学株式会社 | Resin composition, varnish obtained using this resin composition, film adhesive and copper foil with film adhesive |
| JP5089908B2 (en) * | 2006-04-06 | 2012-12-05 | 株式会社マイクロン | High thermal conductive resin compound / high thermal conductive resin molding / mixing particles for heat radiating sheet, high thermal conductive resin compound / high thermal conductive resin molding / heat radiating sheet, and manufacturing method thereof |
| JP2008013759A (en) * | 2006-06-07 | 2008-01-24 | Sumitomo Chemical Co Ltd | Epoxy resin composition and epoxy resin cured product |
| CN101466757A (en) * | 2006-06-07 | 2009-06-24 | 住友化学株式会社 | Epoxy resin composition and epoxy resin cured product |
| JP5345340B2 (en) * | 2008-05-16 | 2013-11-20 | 新日鉄住金マテリアルズ株式会社 | Alumina-containing particles and resin moldings |
| DE102008049850A1 (en) * | 2008-10-01 | 2010-04-08 | Tesa Se | Thermally conductive pressure-sensitive adhesive |
| TWI350716B (en) * | 2008-12-29 | 2011-10-11 | Nanya Plastics Corp | High thermal conductivity, halogen-free flame-retardent resin composition and its pre-impregnated and coating materials for printed circuit boards |
| JP5558161B2 (en) | 2010-03-29 | 2014-07-23 | アロン化成株式会社 | Thermally conductive elastomer composition used as a spacer between a heating element and a cooling component |
| JP5649126B2 (en) * | 2011-08-04 | 2015-01-07 | 株式会社日立製作所 | Epoxy resin composition for casting and electric device using the same |
| JP6123277B2 (en) * | 2011-12-28 | 2017-05-10 | 日立化成株式会社 | RESIN COMPOSITION, RESIN COMPOSITION SHEET, AND METHOD FOR PRODUCING RESIN COMPOSITION SHEET, RESIN COMPOSITION SHEET WITH METAL FILMS, B STAGE SHEET, RESIN COMPOSITION SHEET WITH SEMI-HARDENED METAL FILMS, METAL BASE WIRING BOARD MATERIAL, METAL BASE WIRING BOARD , LED light source member, and power semiconductor device |
| ITMI20121202A1 (en) * | 2012-07-10 | 2014-01-11 | Francesco Pio Salvatore Calabrese | FORMULATION FOR COMPOSITE MATERIALS, COMPOSITE MATERIALS AND PROCEDURE FOR THEIR PRODUCTION |
| KR102451609B1 (en) | 2016-05-16 | 2022-10-06 | 마르틴스베르크 게엠베하 | Alumina products and uses thereof in polymer compositions with high thermal conductivity |
| US20190367719A1 (en) | 2017-01-19 | 2019-12-05 | University Of Fukui | Material having high thermal conductivity and method for producing same |
| US11773254B2 (en) | 2017-12-27 | 2023-10-03 | 3M Innovative Properties Company | Cured epoxy resin composition suitable for electronic device enclosure, articles, and methods |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR1462141A (en) * | 1965-01-05 | 1966-12-09 | Lockheed Aircraft Corp | Moldable ceramic-ceramic compositions resistant to high temperatures |
-
1992
- 1992-01-22 TW TW081100457A patent/TW197458B/zh active
- 1992-02-06 EP EP92810084A patent/EP0499585B1/en not_active Expired - Lifetime
- 1992-02-06 DE DE59203064T patent/DE59203064D1/en not_active Expired - Fee Related
- 1992-02-12 CA CA002061093A patent/CA2061093A1/en not_active Abandoned
- 1992-02-13 KR KR1019920002072A patent/KR100210184B1/en not_active IP Right Cessation
- 1992-02-14 JP JP05923692A patent/JP3176416B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CA2061093A1 (en) | 1992-08-15 |
| KR920016518A (en) | 1992-09-25 |
| EP0499585B1 (en) | 1995-08-02 |
| JP3176416B2 (en) | 2001-06-18 |
| JPH05132576A (en) | 1993-05-28 |
| TW197458B (en) | 1993-01-01 |
| KR100210184B1 (en) | 1999-07-15 |
| EP0499585A1 (en) | 1992-08-19 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8364 | No opposition during term of opposition | ||
| 8327 | Change in the person/name/address of the patent owner |
Owner name: CIBA SPECIALTY CHEMICALS HOLDING INC., BASEL, CH |
|
| 8327 | Change in the person/name/address of the patent owner |
Owner name: VANTICO AG, BASEL, CH |
|
| 8339 | Ceased/non-payment of the annual fee |