JP4526064B2 - Corundum for resin filling and resin composition - Google Patents

Description

  The present invention relates to a highly heat-conductive corundum used mainly by filling a resin such as plastic, rubber, grease and the like and a resin composition using the corundum.

  Conventionally, corundum (a mineral name of aluminum oxide) has been widely used as a filler for filling rubber and plastics. For example, it is used as a heat dissipating filler in silicone resin, silicone rubber, and epoxy resin. When used as a heat dissipating filler, the heat dissipating performance is improved when corundum is filled more. However, when the filling amount exceeds 80% by volume, there is a problem that the resin and the filler do not become familiar and the molding becomes impossible.

  In order to solve such a problem, a mixture of three-component alumina particles having different particle sizes has been proposed (for example, JP-A-5-132576 (Patent Document 1) and JP-A-2001-348488 ( See Patent Document 2).).

  However, since the above corundum is simply a mixture of three components with different particle sizes, the fine particles do not disperse well, and the planar smoothness of the corundum particles is inferior. Therefore, the oil absorption of linseed oil is large, and the resin composition using this The product had a problem of high viscosity.

JP-A-5-132576 JP 2001-348488 A

  The present invention solves the above-mentioned problems, improves the compounding ratio of conventional corundum filled in a resin such as plastic and rubber, enables viscosity reduction and unprecedented high filling, high thermal conductivity and high An object of the present invention is to provide a resin-filled corundum and a composition capable of obtaining productivity.

  As a result of diligent efforts to solve the above problems, the present inventors have reached the present invention. That is, the present invention relates to the following.

1. Corundum X having an average secondary particle diameter in the range of 35 to 80 μm and a specific surface area measured by the nitrogen adsorption method (BET method) in the range of 0.01 to ¹ m ² / g, the average secondary particle diameter is 1 to 5 μm Corundum Y having a specific surface area of 0.5 to ³ m ² / g, and an average secondary particle diameter of 0.3 to 1.5 μm, and a specific surface area of 3 to 15 m ² / g. In the three-component composition diagram in which the mass composition ratio of corundum Z is 100% by mass as a whole, (X: Y: Z) = (60: 40: 0), (95: 0: 5), (95: 5: 0), (60: 0: 40) is a corundum surrounded by four points and not including a line, and a composition filled with 300 parts by mass of the corundum with respect to 100 parts by mass of silicone oil Viscosity measured at 35 ° C with a field-type viscometer is less than 2000 poise And a resin filling corundum linseed oil absorption amount is less 10 ml / 100 g.
2. 2. A resin composition comprising the corundum for resin filling according to 1 and a polymer compound.
3. 3. The resin composition according to 2 above, wherein the polymer compound is at least one selected from the group consisting of aliphatic resins, unsaturated polyester resins, acrylic resins, methacrylic resins, vinyl ester resins, epoxy resins, and silicone resins. object.
4). 4. The resin composition as described in 2 or 3 above, wherein the content of corundum for resin filling is 80% by mass or more.
5). 5. The resin composition according to any one of 2 to 4, wherein the resin-filling corundum is coated with a silane coupling agent.
6). 5. The resin composition according to any one of 2 to 4, wherein the resin-filling corundum is coated with a compound having one or more groups selected from an amino group, a carboxyl group, and an epoxy group.
7). 5. The resin composition according to any one of 2 to 4, wherein the corundum for resin filling is coated with a modified silicone oil.
8). The coating amount with a silane coupling agent or a compound having one or more groups of amino group, carboxyl group and epoxy group, or silicone oil is within a range of 0.05 mass% to 5 mass% with respect to corundum for resin filling. The resin composition according to any one of 5 to 7 above.
9. 9. The resin composition according to any one of 2 to 8 above, wherein the composition is in the form of a sheet or grease.
10. Corundum X having an average secondary particle diameter in the range of 35 to 80 μm and a specific surface area measured by the nitrogen adsorption method (BET method) in the range of 0.01 to ¹ m ² / g, the average secondary particle diameter is 1 to 5 μm Corundum Y having a specific surface area of 0.5 to ³ m ² / g, and an average secondary particle diameter of 0.3 to 1.5 μm, and a specific surface area of 3 to 15 m ² / g. In the three-component composition diagram of the mass composition ratio in which the total amount of corundum Z is 100% by mass, (X: Y: Z) = (60: 40: 0), (95: 0: 5), (95: 5: 0), (60: 0: 40) The three components are blended using a ball mill or a jet mill within a range surrounded by four points (60: 0: 40) and not including the line, and a method for producing a corundum for filling resin, .
11. A corundum for resin filling produced by the production method described in 10 above.
12 12. A resin composition comprising the corundum for resin filling described in 11 above.
13. 13. An electronic component or semiconductor device using the resin composition according to any one of 2 to 9 or 12.
14 A CPU or PDP using the resin composition according to any one of 2 to 9 or 12.
15. A battery peripheral device, a Peltier device, an inverter, or a power transistor using the resin composition according to any one of 2 to 9 or 12.

  By mixing corundum powder with the specified average secondary particle size and specific surface area while giving a shearing force at a specific ratio, when filling resin such as plastic and rubber, viscosity is reduced and high filling is possible Thus, a compound having high thermal conductivity can be obtained. Further, long-time kneading, which is necessary for conventional fine particle dispersion, becomes unnecessary, and productivity and cost can be further improved. Therefore, the industrial effect of the corundum represented by the present invention is extremely large from the viewpoint of improving the characteristics required for resin filling.

BEST MODE FOR CARRYING OUT THE INVENTION

Corundum X for resin filling according to the present invention has an average secondary particle diameter in the range of 35 to 80 μm and a specific surface area measured by the nitrogen adsorption method (BET method) in the range of 0.01 to ¹ m ² / g, Corundum Y with an average secondary particle diameter in the range of 1 to 5 μm, specific surface area in the range of 0.5 to 3 m ² / g, and an average secondary particle diameter in the range of 0.3 to 1.5 μm, with a specific surface area of 3 In a ternary composition diagram in which the mass composition ratio of corundum Z within the range of 15 m ² / g is 100% by mass as a whole, (X: Y: Z) = (60: 40: 0), (95: 0 : 5), (95: 5: 0), and (60: 0: 40) a corundum surrounded by four points and not including the line, the corundum with respect to 100 parts by mass of silicone oil 35 ° C. using a Brookfield viscometer of a composition filled with 300 parts by mass The viscosity is less than 2000 poise, more preferably less than 1700 poise, and the linseed oil absorption is 10 ml / 100 g or less.

Corundum is a mineral name indicating aluminum oxide, and the corundum of the present invention is aluminum oxide containing 90% or more of α-form crystals. The average secondary particle diameter (D ₅₀ ) is measured by a laser diffraction method.

  As a result of repeated investigations on corundum for resin filling, which has high thermal conductivity and low viscosity at the time of resin filling, the present inventors have obtained a three-component corundum powder having a specified average secondary particle diameter and specific surface area. It has been found that the purpose can be achieved by blending the body with a specific ratio using a ball mill, a jet mill or the like while applying a shearing force. By blending while applying a shearing force, the fine particles are uniformly dispersed around the coarse particles, the amount of corundum linseed oil absorbed is small, and the viscosity of the resin composition is lowered. As described in the examples of JP-A-5-132576 (Patent Document 1), these effects are insufficient in a stirrer having a stirring blade. As for the method of blending particles while applying a shearing force, a rotary, vibration, medium stirring ball mill, jet mill, Henschel mixer, etc. can be used. Therefore, a ball mill using alumina media is desirable. When these shearing forces are applied, the particle sizes of the X, Y, and Z corundum hardly change.

  The range of the mixing mass ratio of the three corundums of the present invention is as shown in FIG. 1 in a three-component composition diagram in which coarse corundum X, medium corundum Y, and fine corundum Z are 100% by mass as a whole. (X: Y: Z) = (60: 40: 0), (95: 0: 5), (95: 5: 0), (60: 0: 40) and surrounded by four points (H in FIG. 1) , J, M, and L), and a range not including the line, preferably (60: 40: 0), (90: 0: 10), (90: 10: 0), (60 : 0:40). Outside the range surrounded by H, J, M, and L, the corundum linseed oil absorption amount increases and the viscosity of the resin composition increases.

  The viscosity of the corundum for resin filling of the present invention is shown by the viscosity when measured at 35 ° C. with a Brookfield viscometer of a resin composition filled with 400 parts by weight of the corundum with respect to 100 parts by weight of silicone oil.

  Moreover, the linseed oil absorption amount of the composition was measured by the required amount with respect to 100 g of powder according to JIS K5101.

The coarse-grained corundum X of the present invention is particularly preferably particles having no cutting edge, the average secondary particle diameter is 35 to 80 μm, preferably 40 to 70 μm, and the specific surface area measured by the nitrogen adsorption method (BET method) is 0.01. Within the range of ˜1 m ² / g, preferably 0.01 to 0.5 m ² / g. When the average secondary particle size is smaller than 35 μm, the particle size is close to that of the medium-grain corundum Y described later, so that the effect of reducing the viscosity when the particles are mixed is low. When the average secondary particle diameter is larger than 80 μm, the strength when filled in the resin is remarkably lowered or the surface roughness is increased, which is not preferable. When the specific surface area is larger than 1.0 m ² / g, the curing time when filled in the resin becomes long, which is not preferable.

The medium-grain corundum Y of the present invention has an average secondary particle diameter of 1 to 5 μm, preferably ² to 4 μm, and a specific surface area of 0.5 to ³ m ² / g, preferably 0.5 to ² m ² / g. When the average secondary particle diameter is smaller than 1 μm, the particle diameter is close to that of the fine corundum Z described later, so that the effect of reducing the viscosity when the particles are blended is low. When the average secondary particle diameter is larger than 5 μm, the particle diameter is close to that of the coarse corundum X described above, so that the effect of reducing the viscosity when the particles are blended is low. When the specific surface area is larger than 3 m ² / g, the dispersion becomes worse when the resin is filled, and the curing time becomes longer, which is not preferable.

The fine corundum Z of the present invention has an average secondary particle diameter of 0.3 to 1.5 μm, preferably 0.5 to 1 μm, and a specific surface area of 3 to 15 m ² / g, preferably 3 to 10 m ² / g. When the average secondary particle diameter is larger than 1.5 μm, the particle diameter is close to that of the medium grain corundum Y described above, so that the effect of reducing the viscosity when the particles are blended is low. An average secondary particle size of less than 0.3 μm is not preferable because handling properties are significantly deteriorated. When the specific surface area is larger than 15 m ² / g, the dispersion is remarkably deteriorated when the resin is filled, or the curing time becomes long.

  The resin-filled corundum of the present invention is preferably filled with a polymer compound such as oil, rubber or plastic, and can be suitably used as a high thermal conductivity grease composition, a high thermal conductivity rubber composition or a high thermal conductivity plastic composition. . In particular, the content of the corundum for filling the resin is preferably 80% by mass or more.

  As the polymer compound constituting the composition of the present invention, known polymer compounds can be applied. Preferred examples include aliphatic resins, unsaturated polyester resins, acrylic resins, methacrylic resins, vinyl ester resins, and epoxy resins. And silicone resin.

  These resins may be a low molecular weight body or a high molecular weight body. Alternatively, it may be oily, rubbery or hardened. It can be arbitrarily selected depending on the application and environment to be used.

  Examples of the resin include hydrocarbon resins (for example, polyethylene, ethylene-vinyl acetate copolymer, ethylene-acrylate copolymer, ethylene-propylene copolymer, poly (ethylene-propylene), polypropylene, polyisoprene, poly (isoprene). -Butylene), polybutadiene, poly (styrene-butadiene), poly (butadiene-acrylonitrile), polychloroprene, chlorinated polypropylene, polybutene, polyisobutylene, olefin resin, petroleum resin, styrene resin, ABS resin, coumarone / indene resin, terpene Resin, rosin resin, diene resin, etc.), (meth) acrylic resin (for example, methyl (meth) acrylate, ethyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, n-nonyl (meth) acrylate), Resins obtained by polymerizing monomers such as meth) acrylic acid and glycidyl (meth) acrylate alone, or resins obtained by copolymerizing a plurality of monomers, polyacrylonitrile and copolymers, polycyanoacrylate, polyacrylamide, poly (meth) acrylic acid Salt), vinyl acetate and vinyl alcohol resins (eg, vinyl acetate resin, polyvinyl alcohol, polyvinyl acetal resin, polyvinyl ether, etc.), halogen-containing resins (eg, vinyl chloride resin, vinylidene chloride resin, fluorine resin, etc.) ), Nitrogen-containing vinyl resins (eg, polyvinyl carbazole, polyvinyl pyrrolidone, polyvinyl pyridine, polyvinyl imidazole, etc.), diene polymers (eg, butadiene synthetic rubber, chloroprene synthetic rubber, isoprene synthetic rubber, etc. ), Polyethers (eg, polyethylene glycol, polypropylene glycol, hydrin rubber, penton resin, etc.), polyethyleneimines resins, phenolic resins (eg, phenol / formalin resin, cresol / formalin resin, modified phenolic resin, phenol / furfural resin) , Resorcin resins, etc.), amino resins (eg, urea resins and modified urea resins, melamine resins, guanamine resins, aniline resins, sulfonamide resins, etc.), aromatic hydrocarbon resins (eg, xylene formaldehyde resins, toluene / formalin resins) Etc.), ketone resins (eg, cyclohexanone resin, methyl ethyl ketone resin, etc.), saturated alkyd resins, unsaturated polyester resins (eg, maleic anhydride-ethylene glycol polycondensate) Compounds, maleic anhydride-phthalic anhydride-ethylene glycol polycondensates, etc.), allyl phthalate resins (eg, resins obtained by crosslinking unsaturated polyester resins with diallyl phthalate), vinyl ester resins (eg, highly reactive at the end) A resin in which a primary polymer having an acrylic double bond and a main chain having a bisphenol A ether bond is crosslinked with styrene, acrylic ester, etc.), allyl ester resin, polycarbonate, polyphosphate ester resin, polyamide resin, polyimide resin, silicone resin (For example, silicone oil such as polydimethylsiloxane, silicone rubber, silicone resin, reactive silica having a hydrosiloxane, hydroxysiloxane, alkoxysiloxane, vinylsiloxane structure in the molecule and cured by catalyst or heat. Resin), furan resin, polyurethane resin, polyurethane rubber, epoxy resin (for example, a condensate of bisphenol A and epichlorohydrin, a condensate of novolac phenol resin and epichlorohydrin, a condensate of polyglycols and epichlorohydrin, etc.) And phenoxy-type resins or modified products thereof. These can be used alone or in plural.

These polymer bodies may be low molecular weight or high molecular weight. Alternatively, it may be oily, rubbery or hardened. It can be arbitrarily selected depending on the application and environment to be used.
Of these, unsaturated polyester resins, acrylic resins, methacrylic resins, vinyl ester resins, epoxy resins, and silicone resins are preferably used.

It is also preferred that the polymer is an oily substance. The grease in which the resin-filled corundum and oil are mixed can follow the unevenness of the heat generating body and the heat dissipating body and can narrow the interval therebetween, thereby further enhancing the heat dissipating effect.
The oil that can be used is not particularly limited, and known oils can be used, and examples thereof include silicone oil, petroleum oil, synthetic oil, and fluorine oil.

  The surface of the corundum for resin filling of the present invention is preferably coated with a silane coupling agent, a compound having one or more groups of amino group, carboxyl group, and epoxy group, or silicone oil.

  When the resin-filled corundum with the surface treated is kneaded with the resin, the content of the resin-filled corundum in the composition may be increased as compared to kneading the resin-filled corundum with no resin. it can. Even when the content of the corundum for resin filling in the composition is increased, the viscosity of the kneaded product is not relatively increased, the flexibility of the composition is hardly lost, and the mechanical resistance of the composition is improved. .

  As the silane coupling agent, any known compound may be used as long as it has a hydrolyzable substituent such as a halogen atom or an alkoxy group on the silicon atom. For example, vinyltrichlorosilane, vinyltrimethoxysilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, γ-glycidoxypropyltriethoxysilane, γ-methacryloxypropyltrimethoxysilane, γ-aminopropyltri Ethoxysilane, N-phenyl-γ-aminopropyltrimethoxysilane, γ-chloropropyltrimethoxysilane, γ-mercaptopropyltrimethoxysilane, n-hexyltrimethoxysilane, n-octyltrimethoxysilane, n-dodecyltrimethoxy Silane, phenyltriethoxysilane, diphenyldimethoxysilane, hexamethyldisilazane and the like are preferably used. These silane coupling agents can be used alone or in combination.

  As the compound having one or more groups of amino group, carboxyl group, and epoxy group, compounds that are easily adsorbed or reacted on the surface of corundum for resin filling by the action of these groups are preferable, and known compounds can be used.

  For example, 1,2-epoxyhexane, 1,2-epoxydodecane, n-hexylamine, n-dodecylamine, pn-hexylaniline, n-hexylcarboxylic acid, n-dodecylcarboxylic acid, pn-hexyl Benzoic acid and the like are preferable.

  As modified silicone oils, KF-105, KF-101, KF-102, X-22-173DX, KF-393, KF-864, KF-8012, KF-857, X-22-3667, X-22 -162A, X-22-3701E (manufactured by Shin-Etsu Chemical Co., Ltd.), TSF4700, TSF4701, TSF4702, TSF4703, TSF4730 *, TSF4770 (manufactured by GE Toshiba Silicone), SF8417, BY16-828 , BY16-849, BY16-892, BY16-853, BY16-837, SF8411, BY16-875, BY16-855, SF8421, SF8418, BY16-874 (manufactured by Toray Dow Corning Silicone Co., Ltd.) Preferably these are alone It can be used in multiple.

  The method for coating these compounds on the resin-filled corundum is not particularly limited, and known methods can be used. For example, a dry processing method, a wet processing method, etc. are mentioned.

  The coating amount of the silane coupling agent or the like on the resin-filled corundum is preferably in the range of 0.05 mass% to 5 mass% with respect to the resin-filled corundum. When the content is lower than 0.05% by mass, it is difficult to obtain a coating effect, and when the coating amount is higher than 5% by mass, the content of unreacted silane coupling agent and the like increases, resulting in disadvantages such as remaining as impurities.

  The composition of the present invention releases a heat generated efficiently by being sandwiched between a heat generating part of an electronic component or a semiconductor device and a heat radiating component or a heat radiating plate, etc. It can reduce thermal degradation of components and semiconductor devices, reduce failures, and extend the service life. Specific electronic components or semiconductor devices are not particularly limited, but include a computer CPU (central processing element), PDP (plasma display), energy device (lead storage battery, secondary battery, capacitor, etc.) or peripheral devices ( In a hybrid electric vehicle, etc., a thermal conductive composition is provided between the secondary battery and the radiator to control the temperature and stabilize the battery characteristics), also the motor radiator, Peltier element, inverter, (high) power Examples thereof include a transistor and an ultra-bright LED (light emitting diode).

  EXAMPLES Hereinafter, although an Example and a comparative example demonstrate this invention concretely, this invention is not limited to these Examples.

Examples 1-7:
Coarse-grained corundum X with an average secondary particle size of 49 μm, specific surface area of 0.5 m ² / g, average secondary particle size of 3.0 μm, medium-grained corundum Y of specific surface area of 1.2 m ² / g, average secondary particle size of 0.5 μm, ratio Three components of fine corundum Z with a surface area of 6.5 m ² / g were blended for 30 minutes with 1 kg of corundum and 4 kg of alumina balls in a 4 liter vibratory ball mill at the composition ratio shown in Table 1 to obtain particle-containing corundum. It was.

  The particle-containing corundum (300 parts by mass) and a commercially available silicone oil (TSE3070, manufactured by GE Toshiba Silicone Co., Ltd.) (100 parts by mass) were filled, and the viscosity was measured at 35 ° C. with a Brookfield viscometer. Further, the oil absorption amount of the particle-containing corundum was determined by kneading linseed oil No. 7 in 10 g of powder according to JISK5101 and converting the amount of linseed oil at the end point to the required amount for 100 g of powder. The results are summarized in Table 1.

  Moreover, about this particle | grain combination corundum obtained in Example 1, while showing an electron micrograph in FIG. 2, 1400 mass parts of said corundum and 2 mass parts of acid anhydrides are filled with respect to 100 mass parts of epoxy resins. When the heat conductivity of the cured composition was measured with a laser flash type heat conductivity measuring device, it showed 10.5 W / m · K.

Comparative Examples 1-7:
After mixing at least two components similar to those in Examples 1 to 7 at the composition ratio shown in Table 1, the same evaluation as in Examples 1 to 7 was performed.

Comparative Examples 8-11:
The same three components as in Examples 1, 2, 4, and 6 were placed in a 4 L plastic container at the composition ratio shown in Table 1 and mixed with a shaker for 7 hours, and then the same evaluation as in Examples 1 to 7 was performed.

Comparative Example 12:
Similar to Example 1 except that medium-sized corundum Y having an average secondary particle size of 10.0 μm and a specific surface area of 1.9 m ² / g was used, and the same composition ratio as in Example 1, and a particle-blended corundum mixed with other components in the same manner. Evaluation was conducted.

Comparative Example 13:
The same composition as in Example 1 except that fine corundum Z having an average secondary particle size of 1.6 μm and a specific surface area of 1.8 m ² / g was used. Evaluation was performed.

Comparative Example 14:
Similar to Example 1 except that coarse corundum X having an average secondary particle diameter of 22.5 μm and a specific surface area of 0.8 m ² / g was used, and the same composition ratio as in Example 1 and the particle-blended corundum mixed with other components in the same manner. Evaluation was conducted.

The ternary composition figure which shows three types of corundum composition ratio of this invention. The electron micrograph which shows an example of the corundum of this invention.

Claims (15)

Corundum X having an average secondary particle diameter in the range of 35 to 80 μm and a specific surface area measured by the nitrogen adsorption method (BET method) in the range of 0.01 to ¹ m ² / g, the average secondary particle diameter is 1 to 5 μm Corundum Y having a specific surface area of 0.5 to ³ m ² / g, and an average secondary particle diameter of 0.3 to 1.5 μm, and a specific surface area of 3 to 15 m ² / g. In the three-component composition diagram in which the mass composition ratio of corundum Z is 100% by mass as a whole, (X: Y: Z) = (60: 40: 0), (95: 0: 5), (95: 5: 0), (60: 0: 40) is a corundum surrounded by four points and not including a line, and a composition filled with 300 parts by mass of the corundum with respect to 100 parts by mass of silicone oil Viscosity measured at 35 ° C with a field-type viscometer is less than 2000 poise And a resin filling corundum linseed oil absorption amount is less 10 ml / 100 g.   A resin composition comprising the corundum for resin filling according to claim 1 and a polymer compound.   The resin according to claim 2, wherein the polymer compound is at least one selected from the group consisting of aliphatic resins, unsaturated polyester resins, acrylic resins, methacrylic resins, vinyl ester resins, epoxy resins, and silicone resins. Composition.   The resin composition according to claim 2 or 3, wherein the content of the corundum for resin filling is 80% by mass or more.   The resin composition according to any one of claims 2 to 4, wherein the resin-filling corundum is coated with a silane coupling agent.   The resin composition according to any one of claims 2 to 4, wherein the resin-filling corundum is coated with a compound having one or more groups selected from an amino group, a carboxyl group, and an epoxy group.   The resin composition according to any one of claims 2 to 4, wherein the resin-filling corundum is coated with a modified silicone oil.   The coating amount with a silane coupling agent or a compound having one or more groups of amino group, carboxyl group and epoxy group, or silicone oil is within a range of 0.05 mass% to 5 mass% with respect to corundum for resin filling. The resin composition according to any one of claims 5 to 7.   The resin composition according to any one of claims 2 to 8, wherein the composition is in the form of a sheet or grease. Corundum X having an average secondary particle diameter in the range of 35 to 80 μm and a specific surface area measured by the nitrogen adsorption method (BET method) in the range of 0.01 to ¹ m ² / g, the average secondary particle diameter is 1 to 5 μm Corundum Y having a specific surface area of 0.5 to ³ m ² / g, and an average secondary particle diameter of 0.3 to 1.5 μm, and a specific surface area of 3 to 15 m ² / g. In the three-component composition diagram of the mass composition ratio in which the total amount of corundum Z is 100% by mass, (X: Y: Z) = (60: 40: 0), (95: 0: 5), (95: 5: 0), (60: 0: 40) The three components are blended using a ball mill or a jet mill within a range surrounded by four points (60: 0: 40) and not including the line, and a method for producing a corundum for filling resin, .   The corundum for resin filling manufactured with the manufacturing method of Claim 10.   The resin composition containing the corundum for resin filling of Claim 11.   The electronic component or semiconductor device using the resin composition of any one of Claims 2 thru | or 9.   A CPU or PDP using the resin composition according to any one of claims 2 to 9.   A battery peripheral device, a Peltier device, an inverter, or a power transistor using the resin composition according to any one of claims 2 to 9.

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