DE4301737A1 - - Google Patents

Info

Publication number
DE4301737A1
DE4301737A1 DE4301737A DE4301737A DE4301737A1 DE 4301737 A1 DE4301737 A1 DE 4301737A1 DE 4301737 A DE4301737 A DE 4301737A DE 4301737 A DE4301737 A DE 4301737A DE 4301737 A1 DE4301737 A1 DE 4301737A1
Authority
DE
Germany
Prior art keywords
resist
etching
polymeric film
areas
photoresist
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE4301737A
Other languages
German (de)
English (en)
Other versions
DE4301737C2 (de
Inventor
Thomas Klun
Thach Truong
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Co
Original Assignee
Minnesota Mining and Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=25240051&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE4301737(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Minnesota Mining and Manufacturing Co filed Critical Minnesota Mining and Manufacturing Co
Publication of DE4301737A1 publication Critical patent/DE4301737A1/de
Application granted granted Critical
Publication of DE4301737C2 publication Critical patent/DE4301737C2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/32—Liquid compositions therefor, e.g. developers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/0325—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polysaccharides, e.g. cellulose
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0166—Polymeric layer used for special processing, e.g. resist for etching insulating material or photoresist used as a mask during plasma etching
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
DE4301737A 1992-01-23 1993-01-22 Verfahren zur Herstellung von flexiblen Schaltungen Expired - Fee Related DE4301737C2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/823,899 US5227008A (en) 1992-01-23 1992-01-23 Method for making flexible circuits

Publications (2)

Publication Number Publication Date
DE4301737A1 true DE4301737A1 (https=) 1993-07-29
DE4301737C2 DE4301737C2 (de) 2001-07-05

Family

ID=25240051

Family Applications (1)

Application Number Title Priority Date Filing Date
DE4301737A Expired - Fee Related DE4301737C2 (de) 1992-01-23 1993-01-22 Verfahren zur Herstellung von flexiblen Schaltungen

Country Status (3)

Country Link
US (1) US5227008A (https=)
JP (1) JP3401281B2 (https=)
DE (1) DE4301737C2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19621545C1 (de) * 1996-05-29 1998-02-05 Cicorel S A Verfahren zum Herstellen einer Leiterplatte

Families Citing this family (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5753976A (en) * 1996-06-14 1998-05-19 Minnesota Mining And Manufacturing Company Multi-layer circuit having a via matrix interlayer connection
US5888594A (en) * 1996-11-05 1999-03-30 Minnesota Mining And Manufacturing Company Process for depositing a carbon-rich coating on a moving substrate
US5948166A (en) * 1996-11-05 1999-09-07 3M Innovative Properties Company Process and apparatus for depositing a carbon-rich coating on a moving substrate
US5795299A (en) * 1997-01-31 1998-08-18 Acuson Corporation Ultrasonic transducer assembly with extended flexible circuits
US6375871B1 (en) 1998-06-18 2002-04-23 3M Innovative Properties Company Methods of manufacturing microfluidic articles
US6071597A (en) * 1997-08-28 2000-06-06 3M Innovative Properties Company Flexible circuits and carriers and process for manufacture
US6159666A (en) * 1998-01-14 2000-12-12 Fijitsu Limited Environmentally friendly removal of photoresists used in wet etchable polyimide processes
US6140707A (en) * 1998-05-07 2000-10-31 3M Innovative Properties Co. Laminated integrated circuit package
US6211468B1 (en) 1998-08-12 2001-04-03 3M Innovative Properties Company Flexible circuit with conductive vias having off-set axes
US6489042B2 (en) 1998-12-23 2002-12-03 3M Innovative Properties Company Photoimageable dielectric material for circuit protection
US6177357B1 (en) * 1999-04-30 2001-01-23 3M Innovative Properties Company Method for making flexible circuits
US7223364B1 (en) 1999-07-07 2007-05-29 3M Innovative Properties Company Detection article having fluid control film
US6423470B1 (en) 1999-08-20 2002-07-23 3M Innovative Properties Company Printed circuit substrate with controlled placement covercoat layer
US6316734B1 (en) 2000-03-07 2001-11-13 3M Innovative Properties Company Flexible circuits with static discharge protection and process for manufacture
US6320137B1 (en) 2000-04-11 2001-11-20 3M Innovative Properties Company Flexible circuit with coverplate layer and overlapping protective layer
US7348045B2 (en) * 2002-09-05 2008-03-25 3M Innovative Properties Company Controlled depth etched dielectric film
US6923919B2 (en) 2000-07-18 2005-08-02 3M Innovative Properties Company Liquid crystal polymers for flexible circuits
US6696163B2 (en) 2000-07-18 2004-02-24 3M Innovative Properties Company Liquid crystal polymers for flexible circuits
US20040247921A1 (en) * 2000-07-18 2004-12-09 Dodsworth Robert S. Etched dielectric film in hard disk drives
US6951707B2 (en) * 2001-03-08 2005-10-04 Ppg Industries Ohio, Inc. Process for creating vias for circuit assemblies
US6713587B2 (en) 2001-03-08 2004-03-30 Ppg Industries Ohio, Inc. Electrodepositable dielectric coating compositions and methods related thereto
US7000313B2 (en) * 2001-03-08 2006-02-21 Ppg Industries Ohio, Inc. Process for fabricating circuit assemblies using electrodepositable dielectric coating compositions
US6459043B1 (en) 2001-03-29 2002-10-01 3M Innovative Properties Company Flexible circuit with electrostatic damage limiting feature and method of manufacture
US6815620B2 (en) * 2001-03-29 2004-11-09 3M Innovative Properties Company Flexible circuit with electrostatic damage limiting feature
US6995954B1 (en) 2001-07-13 2006-02-07 Magnecomp Corporation ESD protected suspension interconnect
US6506062B1 (en) 2001-08-01 2003-01-14 Visteon Global Technologies, Inc. Circuit board having an integrated circuit board connector and method of making the same
US6824959B2 (en) * 2002-06-27 2004-11-30 Ppg Industries Ohio, Inc. Process for creating holes in polymeric substrates
US20060213685A1 (en) * 2002-06-27 2006-09-28 Wang Alan E Single or multi-layer printed circuit board with improved edge via design
EP1520454B1 (en) * 2002-06-27 2012-01-25 PPG Industries Ohio, Inc. Single or multi-layer printed circuit board with extended breakaway tabs and method of manufacture thereof
US20040258885A1 (en) * 2002-09-05 2004-12-23 Kreutter Nathan P. Etched dielectric film in microfluidic devices
US20060234042A1 (en) * 2002-09-05 2006-10-19 Rui Yang Etched dielectric film in microfluidic devices
US7163327B2 (en) * 2002-12-02 2007-01-16 3M Innovative Properties Company Illumination system using a plurality of light sources
US7678426B2 (en) * 2003-08-21 2010-03-16 3M Innovative Properties Company Perfluoropolyether amide-linked phosphonates, phosphates, and derivatives thereof
US7489493B2 (en) * 2003-12-01 2009-02-10 Magnecomp Corporation Method to form electrostatic discharge protection on flexible circuits using a diamond-like carbon material
US7250611B2 (en) * 2003-12-02 2007-07-31 3M Innovative Properties Company LED curing apparatus and method
US20050116235A1 (en) * 2003-12-02 2005-06-02 Schultz John C. Illumination assembly
US7329887B2 (en) * 2003-12-02 2008-02-12 3M Innovative Properties Company Solid state light device
US7403680B2 (en) * 2003-12-02 2008-07-22 3M Innovative Properties Company Reflective light coupler
US20050116635A1 (en) * 2003-12-02 2005-06-02 Walson James E. Multiple LED source and method for assembling same
US7456805B2 (en) * 2003-12-18 2008-11-25 3M Innovative Properties Company Display including a solid state light device and method using same
WO2005067355A2 (en) * 2003-12-30 2005-07-21 3M Innovative Properties Company Patterned circuits and method for making same
US7012017B2 (en) * 2004-01-29 2006-03-14 3M Innovative Properties Company Partially etched dielectric film with conductive features
US20050186404A1 (en) * 2004-02-23 2005-08-25 Guoping Mao Etched polycarbonate films
DE102006035749A1 (de) * 2006-07-28 2008-01-31 Leonhard Kurz Gmbh & Co. Kg Verfahren zur Herstellung mindestens eines Bauteils sowie Bauteil
KR20210030368A (ko) 2018-07-13 2021-03-17 미쓰비시 세이시 가부시키가이샤 감광성 수지 조성물, 에칭 방법 및 수지 구조체의 제조 방법
US11018024B2 (en) * 2018-08-02 2021-05-25 Nxp Usa, Inc. Method of fabricating embedded traces
CN115668460A (zh) * 2020-07-29 2023-01-31 东洋纺株式会社 柔性电子器件的制造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4857143A (en) * 1988-12-16 1989-08-15 International Business Machines Corp. Wet etching of cured polyimide
EP0351622A2 (en) * 1988-07-13 1990-01-24 International Business Machines Corporation Wet etching of cured polyimide
US4911786A (en) * 1989-04-26 1990-03-27 International Business Machines Corporation Method of etching polyimides and resulting passivation structure

Family Cites Families (9)

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US3395057A (en) * 1964-12-08 1968-07-30 G T Schjeladhl Company Method for etching polyiminde plastic film
US3526504A (en) * 1966-07-07 1970-09-01 Du Pont Photocrosslinkable elements and processes
US3448098A (en) * 1966-09-27 1969-06-03 Merck & Co Inc Production of guanylic acid
US3469982A (en) * 1968-09-11 1969-09-30 Jack Richard Celeste Process for making photoresists
US3867153A (en) * 1972-09-11 1975-02-18 Du Pont Photohardenable element
US3871930A (en) * 1973-12-19 1975-03-18 Texas Instruments Inc Method of etching films made of polyimide based polymers
DE2541624C2 (de) * 1975-09-18 1982-09-16 Ibm Deutschland Gmbh, 7000 Stuttgart Wässrige Ätzlösung und Verfahren zum Ätzen von Polymerfilmen oder Folien auf Polyimidbasis
DE3919249A1 (de) * 1989-06-13 1990-12-20 Standard Elektrik Lorenz Ag Verfahren zum herstellen von tab-filmtraeger in zweilagentechnik
US4986880A (en) * 1989-11-29 1991-01-22 E. I. Du Pont De Nemours And Company Process for etching polyimide substrate in formation of unsupported electrically conductive leads

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0351622A2 (en) * 1988-07-13 1990-01-24 International Business Machines Corporation Wet etching of cured polyimide
US4857143A (en) * 1988-12-16 1989-08-15 International Business Machines Corp. Wet etching of cured polyimide
US4911786A (en) * 1989-04-26 1990-03-27 International Business Machines Corporation Method of etching polyimides and resulting passivation structure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19621545C1 (de) * 1996-05-29 1998-02-05 Cicorel S A Verfahren zum Herstellen einer Leiterplatte

Also Published As

Publication number Publication date
JPH05283839A (ja) 1993-10-29
DE4301737C2 (de) 2001-07-05
JP3401281B2 (ja) 2003-04-28
US5227008A (en) 1993-07-13

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Legal Events

Date Code Title Description
8110 Request for examination paragraph 44
D2 Grant after examination
8364 No opposition during term of opposition
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee

Effective date: 20120801