DE4017217C2 - - Google Patents

Info

Publication number
DE4017217C2
DE4017217C2 DE4017217A DE4017217A DE4017217C2 DE 4017217 C2 DE4017217 C2 DE 4017217C2 DE 4017217 A DE4017217 A DE 4017217A DE 4017217 A DE4017217 A DE 4017217A DE 4017217 C2 DE4017217 C2 DE 4017217C2
Authority
DE
Germany
Prior art keywords
capacitor
lead frame
electrically conductive
connection
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE4017217A
Other languages
German (de)
English (en)
Other versions
DE4017217A1 (de
Inventor
Ulrich 8050 Freising De Kaiser
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Deutschland GmbH
Original Assignee
Texas Instruments Deutschland GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Deutschland GmbH filed Critical Texas Instruments Deutschland GmbH
Priority to DE4017217A priority Critical patent/DE4017217A1/de
Priority to EP91108788A priority patent/EP0459442B1/en
Priority to AT91108788T priority patent/ATE150902T1/de
Priority to DE69125313T priority patent/DE69125313T2/de
Publication of DE4017217A1 publication Critical patent/DE4017217A1/de
Application granted granted Critical
Publication of DE4017217C2 publication Critical patent/DE4017217C2/de
Priority to US07/986,886 priority patent/US5281846A/en
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/475—Capacitors in combination with leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5366—Shapes of wire connectors the bond wires having kinks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/752—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
DE4017217A 1990-05-29 1990-05-29 Elektronisches bauelement Granted DE4017217A1 (de)

Priority Applications (5)

Application Number Priority Date Filing Date Title
DE4017217A DE4017217A1 (de) 1990-05-29 1990-05-29 Elektronisches bauelement
EP91108788A EP0459442B1 (en) 1990-05-29 1991-05-29 Electronic component including a lead frame with built-in capacitor
AT91108788T ATE150902T1 (de) 1990-05-29 1991-05-29 Elektronisches bauteil, das einen leiterrahmen mit eingebautem kondensator enthält
DE69125313T DE69125313T2 (de) 1990-05-29 1991-05-29 Elektronisches Bauteil, das einen Leiterrahmen mit eingebautem Kondensator enthält
US07/986,886 US5281846A (en) 1990-05-29 1992-12-03 Electronic device having a discrete capacitor adherently mounted to a lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4017217A DE4017217A1 (de) 1990-05-29 1990-05-29 Elektronisches bauelement

Publications (2)

Publication Number Publication Date
DE4017217A1 DE4017217A1 (de) 1991-12-19
DE4017217C2 true DE4017217C2 (enExample) 1992-04-02

Family

ID=6407383

Family Applications (2)

Application Number Title Priority Date Filing Date
DE4017217A Granted DE4017217A1 (de) 1990-05-29 1990-05-29 Elektronisches bauelement
DE69125313T Expired - Lifetime DE69125313T2 (de) 1990-05-29 1991-05-29 Elektronisches Bauteil, das einen Leiterrahmen mit eingebautem Kondensator enthält

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE69125313T Expired - Lifetime DE69125313T2 (de) 1990-05-29 1991-05-29 Elektronisches Bauteil, das einen Leiterrahmen mit eingebautem Kondensator enthält

Country Status (3)

Country Link
EP (1) EP0459442B1 (enExample)
AT (1) ATE150902T1 (enExample)
DE (2) DE4017217A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19821857A1 (de) * 1998-05-15 1999-11-18 Biotronik Mess & Therapieg Hochintegrierte elektronische Schaltung, insbesondere zum Einsatz in Herzschrittmachern

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19905886A1 (de) * 1999-02-11 2000-08-17 Meto International Gmbh Identifizierungselement und Verfahren zur Herstellung eines Identifizierungselements
DE102005037460A1 (de) * 2005-08-09 2007-02-15 Robert Bosch Gmbh Anorndung mit einer intergrierten Schaltung
DE102007005862A1 (de) * 2007-02-06 2008-08-14 Siemens Audiologische Technik Gmbh Schaltungsvorrichtung mit bebondetem SMD-Bauteil

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2091035B (en) * 1981-01-12 1985-01-09 Avx Corp Integrated circuit device and sub-assembly
JPS61108160A (ja) * 1984-11-01 1986-05-26 Nec Corp コンデンサ内蔵型半導体装置及びその製造方法
DE3626151C3 (de) * 1986-08-01 1995-06-14 Siemens Ag Spannungszuführungsanordnung für eine integrierte Halbleiterschaltung
ES2008655T3 (es) * 1987-07-31 1994-02-01 Texas Instruments Deutschland Gmbh Disposicion de transmision-respuesta (transpondedora).

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19821857A1 (de) * 1998-05-15 1999-11-18 Biotronik Mess & Therapieg Hochintegrierte elektronische Schaltung, insbesondere zum Einsatz in Herzschrittmachern

Also Published As

Publication number Publication date
EP0459442B1 (en) 1997-03-26
ATE150902T1 (de) 1997-04-15
EP0459442A1 (en) 1991-12-04
DE69125313D1 (de) 1997-04-30
DE4017217A1 (de) 1991-12-19
DE69125313T2 (de) 1997-10-09

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
D2 Grant after examination
8363 Opposition against the patent
8365 Fully valid after opposition proceedings
8339 Ceased/non-payment of the annual fee