DE3936723A1 - Vorrichtung zum selbsttaetigen positionieren von leiterplatten - Google Patents
Vorrichtung zum selbsttaetigen positionieren von leiterplattenInfo
- Publication number
- DE3936723A1 DE3936723A1 DE19893936723 DE3936723A DE3936723A1 DE 3936723 A1 DE3936723 A1 DE 3936723A1 DE 19893936723 DE19893936723 DE 19893936723 DE 3936723 A DE3936723 A DE 3936723A DE 3936723 A1 DE3936723 A1 DE 3936723A1
- Authority
- DE
- Germany
- Prior art keywords
- sensors
- circuit board
- positioning
- marks
- pairs
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 230000001939 inductive effect Effects 0.000 claims 1
- 238000003780 insertion Methods 0.000 claims 1
- 230000037431 insertion Effects 0.000 claims 1
- 239000003550 marker Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q1/00—Members which are comprised in the general build-up of a form of machine, particularly relatively large fixed members
- B23Q1/25—Movable or adjustable work or tool supports
- B23Q1/44—Movable or adjustable work or tool supports using particular mechanisms
- B23Q1/48—Movable or adjustable work or tool supports using particular mechanisms with sliding pairs and rotating pairs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
- B23Q17/24—Arrangements for observing, indicating or measuring on machine tools using optics or electromagnetic waves
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/101—Using electrical induction, e.g. for heating during soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Supply And Installment Of Electrical Components (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19893936723 DE3936723A1 (de) | 1989-11-04 | 1989-11-04 | Vorrichtung zum selbsttaetigen positionieren von leiterplatten |
EP19900120689 EP0427081A3 (en) | 1989-11-04 | 1990-10-29 | Device for self-positioning of printed circuit boards |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19893936723 DE3936723A1 (de) | 1989-11-04 | 1989-11-04 | Vorrichtung zum selbsttaetigen positionieren von leiterplatten |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3936723A1 true DE3936723A1 (de) | 1991-05-08 |
DE3936723C2 DE3936723C2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1993-06-03 |
Family
ID=6392846
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19893936723 Granted DE3936723A1 (de) | 1989-11-04 | 1989-11-04 | Vorrichtung zum selbsttaetigen positionieren von leiterplatten |
Country Status (2)
Country | Link |
---|---|
EP (1) | EP0427081A3 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
DE (1) | DE3936723A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1248502A1 (fr) * | 2001-04-02 | 2002-10-09 | Posalux S.A. | Procédé de détermination d'incertitudes pour machine à perforer des plaquettes à circuits imprimés |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3506279A1 (de) * | 1985-02-22 | 1986-08-28 | MANIA Elektronik Automatisation Entwicklung und Gerätebau GmbH, 6384 Schmitten | Anordnung zur ausrichtung von unbelichteten leiterplattenrohlingen und fotomasken zueinander |
EP0204901A2 (de) * | 1985-06-10 | 1986-12-17 | Ezio Curti | Verfahren und Vorrichtung zum registergenauen Aufdruck eines elektronischen Schaltkreises gegenueber den Bezugsbohrungen einer Traegerplatte |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3045433A1 (de) * | 1980-12-02 | 1982-07-01 | Siemens AG, 1000 Berlin und 8000 München | Mehrlagen-leiterplatte und verfahren zur ermittlung der ist-position innenliegender anschlussflaechen |
JPS61125712A (ja) * | 1984-11-26 | 1986-06-13 | Matsushita Electric Works Ltd | 多層印刷配線板の孔穿設法 |
JPS6346466A (ja) * | 1986-08-13 | 1988-02-27 | Oak Seisakusho:Kk | 両面露光用ワ−クアライメント装置 |
-
1989
- 1989-11-04 DE DE19893936723 patent/DE3936723A1/de active Granted
-
1990
- 1990-10-29 EP EP19900120689 patent/EP0427081A3/de not_active Withdrawn
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3506279A1 (de) * | 1985-02-22 | 1986-08-28 | MANIA Elektronik Automatisation Entwicklung und Gerätebau GmbH, 6384 Schmitten | Anordnung zur ausrichtung von unbelichteten leiterplattenrohlingen und fotomasken zueinander |
EP0204901A2 (de) * | 1985-06-10 | 1986-12-17 | Ezio Curti | Verfahren und Vorrichtung zum registergenauen Aufdruck eines elektronischen Schaltkreises gegenueber den Bezugsbohrungen einer Traegerplatte |
Also Published As
Publication number | Publication date |
---|---|
EP0427081A3 (en) | 1992-03-04 |
EP0427081A2 (de) | 1991-05-15 |
DE3936723C2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1993-06-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
OP8 | Request for examination as to paragraph 44 patent law | ||
D2 | Grant after examination | ||
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |