DE3936613C2 - - Google Patents
Info
- Publication number
- DE3936613C2 DE3936613C2 DE3936613A DE3936613A DE3936613C2 DE 3936613 C2 DE3936613 C2 DE 3936613C2 DE 3936613 A DE3936613 A DE 3936613A DE 3936613 A DE3936613 A DE 3936613A DE 3936613 C2 DE3936613 C2 DE 3936613C2
- Authority
- DE
- Germany
- Prior art keywords
- housing
- cover
- hybrid circuit
- wall
- face
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0091—Housing specially adapted for small components
- H05K5/0095—Housing specially adapted for small components hermetically-sealed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/165—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Casings For Electric Apparatus (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE3936613A DE3936613A1 (de) | 1989-11-03 | 1989-11-03 | Mehrfach verschliessbarers hybridschaltkreisgehaeuse |
DE9010159U DE9010159U1 (de) | 1989-11-03 | 1990-07-04 | Mehrfach verschließbares Hybridschaltkreisgehäuse |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE3936613A DE3936613A1 (de) | 1989-11-03 | 1989-11-03 | Mehrfach verschliessbarers hybridschaltkreisgehaeuse |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3936613A1 DE3936613A1 (de) | 1991-05-08 |
DE3936613C2 true DE3936613C2 (sv) | 1992-09-17 |
Family
ID=6392794
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE3936613A Granted DE3936613A1 (de) | 1989-11-03 | 1989-11-03 | Mehrfach verschliessbarers hybridschaltkreisgehaeuse |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE3936613A1 (sv) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6091146A (en) * | 1997-12-09 | 2000-07-18 | Trw Inc. | Ceramic lid for large multi-chip modules |
DE19806722A1 (de) * | 1998-02-18 | 1999-08-19 | Itt Mfg Enterprises Inc | Sensor |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2568518A (en) * | 1947-08-15 | 1951-09-18 | Ohio Brass Co | Gasproof receptacle |
DE2824426C2 (de) * | 1978-06-03 | 1982-09-02 | Schott Glaswerke, 6500 Mainz | Gehäuse zur Kapselung von elektrischen und/oder elektronischen Bauelementen |
DE3527818A1 (de) * | 1985-08-02 | 1987-02-26 | Rose Elektrotech Gmbh | Gehaeuse fuer einen hybridschaltkreis |
-
1989
- 1989-11-03 DE DE3936613A patent/DE3936613A1/de active Granted
Also Published As
Publication number | Publication date |
---|---|
DE3936613A1 (de) | 1991-05-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
OP8 | Request for examination as to paragraph 44 patent law | ||
D2 | Grant after examination | ||
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |