DE3887186D1 - Verfahren zur Herstellung eines keramischen Mehrschichtkondensators. - Google Patents
Verfahren zur Herstellung eines keramischen Mehrschichtkondensators.Info
- Publication number
- DE3887186D1 DE3887186D1 DE88104178T DE3887186T DE3887186D1 DE 3887186 D1 DE3887186 D1 DE 3887186D1 DE 88104178 T DE88104178 T DE 88104178T DE 3887186 T DE3887186 T DE 3887186T DE 3887186 D1 DE3887186 D1 DE 3887186D1
- Authority
- DE
- Germany
- Prior art keywords
- production
- multilayer ceramic
- ceramic capacitor
- capacitor
- multilayer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000003985 ceramic capacitor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/43—Electric condenser making
- Y10T29/435—Solid dielectric type
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62082227A JPH084053B2 (ja) | 1987-04-04 | 1987-04-04 | 積層セラミックコンデンサ |
JP62082228A JPH084054B2 (ja) | 1987-04-04 | 1987-04-04 | 積層セラミックコンデンサ |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3887186D1 true DE3887186D1 (de) | 1994-03-03 |
DE3887186T2 DE3887186T2 (de) | 1994-05-19 |
Family
ID=26423238
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE3887186T Expired - Fee Related DE3887186T2 (de) | 1987-04-04 | 1988-03-16 | Verfahren zur Herstellung eines keramischen Mehrschichtkondensators. |
Country Status (3)
Country | Link |
---|---|
US (1) | US4835656A (de) |
EP (1) | EP0285873B1 (de) |
DE (1) | DE3887186T2 (de) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH065656B2 (ja) * | 1988-02-19 | 1994-01-19 | 株式会社村田製作所 | セラミック積層体の製造方法 |
US5027253A (en) * | 1990-04-09 | 1991-06-25 | Ibm Corporation | Printed circuit boards and cards having buried thin film capacitors and processing techniques for fabricating said boards and cards |
US5227951A (en) * | 1992-08-04 | 1993-07-13 | Murata Erie North America, Inc. | Composite multilayer capacitive device and method for fabricating the same |
US5430605A (en) * | 1992-08-04 | 1995-07-04 | Murata Erie North America, Inc. | Composite multilayer capacitive device and method for fabricating the same |
US5350637A (en) * | 1992-10-30 | 1994-09-27 | Corning Incorporated | Microlaminated composites and method |
US5519191A (en) * | 1992-10-30 | 1996-05-21 | Corning Incorporated | Fluid heater utilizing laminar heating element having conductive layer bonded to flexible ceramic foil substrate |
US5623724A (en) * | 1994-08-09 | 1997-04-22 | Northrop Grumman Corporation | High power capacitor |
US5745333A (en) * | 1994-11-21 | 1998-04-28 | International Business Machines Corporation | Laminar stackable circuit board structure with capacitor |
US5509200A (en) * | 1994-11-21 | 1996-04-23 | International Business Machines Corporation | Method of making laminar stackable circuit board structure |
US6739027B1 (en) | 1996-06-12 | 2004-05-25 | International Business Machines Corporation | Method for producing printed circuit board with embedded decoupling capacitance |
US6343001B1 (en) | 1996-06-12 | 2002-01-29 | International Business Machines Corporation | Multilayer capacitance structure and circuit board containing the same |
US5796587A (en) * | 1996-06-12 | 1998-08-18 | International Business Machines Corporation | Printed circut board with embedded decoupling capacitance and method for producing same |
DE19630883A1 (de) * | 1996-07-31 | 1998-02-05 | Philips Patentverwaltung | Bauteil mit einem Kondensator |
US6011683A (en) * | 1997-12-29 | 2000-01-04 | Texas Instruments Incorporated | Thin multilayer ceramic capacitors |
US6205032B1 (en) * | 1999-03-16 | 2001-03-20 | Cts Corporation | Low temperature co-fired ceramic with improved registration |
JP2002083737A (ja) * | 2000-09-07 | 2002-03-22 | Murata Mfg Co Ltd | 非線形誘電体素子 |
US7014725B2 (en) * | 2001-10-25 | 2006-03-21 | Matsushita Electric Industrial Co., Ltd. | Multilayer ceramic electronic component manufacturing method including a sintered adhesive layer with a resin and inorganic powder |
JP4293553B2 (ja) | 2005-05-31 | 2009-07-08 | Tdk株式会社 | 積層型電子部品及び積層セラミックコンデンサ |
JP4933968B2 (ja) * | 2007-07-04 | 2012-05-16 | Tdk株式会社 | セラミック電子部品 |
WO2013047646A1 (ja) * | 2011-09-29 | 2013-04-04 | 株式会社村田製作所 | 積層セラミックコンデンサ、および積層セラミックコンデンサの製造方法 |
EP3520126A4 (de) * | 2016-09-27 | 2020-05-27 | Perkinelmer Health Sciences Canada, Inc | Kondensatoren und funkfrequenzgeneratoren sowie andere vorrichtungen damit |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1020016A (fr) * | 1950-06-10 | 1953-01-30 | Csf | Procédé d'assemblage de plaques minces de céramiques |
US2972180A (en) * | 1956-01-11 | 1961-02-21 | Gulton Ind Inc | Electrical components and method of making same |
FR1328877A (fr) * | 1961-07-19 | 1963-05-31 | Johnson Matthey Co Ltd | Perfectionnement aux condensateurs électriques |
US3469161A (en) * | 1964-11-13 | 1969-09-23 | Westinghouse Electric Corp | Capacitors employing lead silico-borate glass compositions |
US3267342A (en) * | 1965-05-18 | 1966-08-16 | Corning Glass Works | Electrical capacitor |
US3467898A (en) * | 1968-08-07 | 1969-09-16 | Erie Technological Prod Inc | Capacitor with terminal means |
JPS4870855A (de) * | 1971-12-29 | 1973-09-26 | ||
US3784887A (en) * | 1973-04-26 | 1974-01-08 | Du Pont | Process for making capacitors and capacitors made thereby |
US4082906A (en) * | 1977-02-14 | 1978-04-04 | San Fernando Electric Manufacturing Company | Low temperature fired ceramic capacitors |
FR2389211A1 (fr) * | 1977-04-26 | 1978-11-24 | Eurofarad | Fabrication de condensateurs a dielectrique mica multicouches, avec interposition de couches de verre |
US4267634A (en) * | 1978-04-05 | 1981-05-19 | American Components Inc. | Method for making a chip circuit component |
JPS55133597A (en) * | 1979-04-06 | 1980-10-17 | Hitachi Ltd | Multilayer circuit board |
-
1988
- 1988-03-07 US US07/182,774 patent/US4835656A/en not_active Expired - Fee Related
- 1988-03-16 EP EP88104178A patent/EP0285873B1/de not_active Expired - Lifetime
- 1988-03-16 DE DE3887186T patent/DE3887186T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0285873B1 (de) | 1994-01-19 |
EP0285873A3 (en) | 1989-04-19 |
EP0285873A2 (de) | 1988-10-12 |
DE3887186T2 (de) | 1994-05-19 |
US4835656A (en) | 1989-05-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |