DE3887186D1 - Verfahren zur Herstellung eines keramischen Mehrschichtkondensators. - Google Patents

Verfahren zur Herstellung eines keramischen Mehrschichtkondensators.

Info

Publication number
DE3887186D1
DE3887186D1 DE88104178T DE3887186T DE3887186D1 DE 3887186 D1 DE3887186 D1 DE 3887186D1 DE 88104178 T DE88104178 T DE 88104178T DE 3887186 T DE3887186 T DE 3887186T DE 3887186 D1 DE3887186 D1 DE 3887186D1
Authority
DE
Germany
Prior art keywords
production
multilayer ceramic
ceramic capacitor
capacitor
multilayer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE88104178T
Other languages
English (en)
Other versions
DE3887186T2 (de
Inventor
Naoto Kitahara
Hiroaki Tanidokoro
Masahiro Hirama
Yoshinori Shinohara
Kazuyasu Hikita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Mining and Cement Co Ltd
Original Assignee
Mitsubishi Mining and Cement Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP62082228A external-priority patent/JPH084054B2/ja
Priority claimed from JP62082227A external-priority patent/JPH084053B2/ja
Application filed by Mitsubishi Mining and Cement Co Ltd filed Critical Mitsubishi Mining and Cement Co Ltd
Publication of DE3887186D1 publication Critical patent/DE3887186D1/de
Application granted granted Critical
Publication of DE3887186T2 publication Critical patent/DE3887186T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y10T29/435—Solid dielectric type

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
DE3887186T 1987-04-04 1988-03-16 Verfahren zur Herstellung eines keramischen Mehrschichtkondensators. Expired - Fee Related DE3887186T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP62082228A JPH084054B2 (ja) 1987-04-04 1987-04-04 積層セラミックコンデンサ
JP62082227A JPH084053B2 (ja) 1987-04-04 1987-04-04 積層セラミックコンデンサ

Publications (2)

Publication Number Publication Date
DE3887186D1 true DE3887186D1 (de) 1994-03-03
DE3887186T2 DE3887186T2 (de) 1994-05-19

Family

ID=26423238

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3887186T Expired - Fee Related DE3887186T2 (de) 1987-04-04 1988-03-16 Verfahren zur Herstellung eines keramischen Mehrschichtkondensators.

Country Status (3)

Country Link
US (1) US4835656A (de)
EP (1) EP0285873B1 (de)
DE (1) DE3887186T2 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH065656B2 (ja) * 1988-02-19 1994-01-19 株式会社村田製作所 セラミック積層体の製造方法
US5027253A (en) * 1990-04-09 1991-06-25 Ibm Corporation Printed circuit boards and cards having buried thin film capacitors and processing techniques for fabricating said boards and cards
US5227951A (en) * 1992-08-04 1993-07-13 Murata Erie North America, Inc. Composite multilayer capacitive device and method for fabricating the same
US5430605A (en) * 1992-08-04 1995-07-04 Murata Erie North America, Inc. Composite multilayer capacitive device and method for fabricating the same
US5350637A (en) * 1992-10-30 1994-09-27 Corning Incorporated Microlaminated composites and method
US5519191A (en) * 1992-10-30 1996-05-21 Corning Incorporated Fluid heater utilizing laminar heating element having conductive layer bonded to flexible ceramic foil substrate
US5623724A (en) * 1994-08-09 1997-04-22 Northrop Grumman Corporation High power capacitor
US5745333A (en) * 1994-11-21 1998-04-28 International Business Machines Corporation Laminar stackable circuit board structure with capacitor
US5509200A (en) * 1994-11-21 1996-04-23 International Business Machines Corporation Method of making laminar stackable circuit board structure
US5796587A (en) * 1996-06-12 1998-08-18 International Business Machines Corporation Printed circut board with embedded decoupling capacitance and method for producing same
US6739027B1 (en) 1996-06-12 2004-05-25 International Business Machines Corporation Method for producing printed circuit board with embedded decoupling capacitance
US6343001B1 (en) 1996-06-12 2002-01-29 International Business Machines Corporation Multilayer capacitance structure and circuit board containing the same
DE19630883A1 (de) * 1996-07-31 1998-02-05 Philips Patentverwaltung Bauteil mit einem Kondensator
US6011683A (en) * 1997-12-29 2000-01-04 Texas Instruments Incorporated Thin multilayer ceramic capacitors
US6205032B1 (en) * 1999-03-16 2001-03-20 Cts Corporation Low temperature co-fired ceramic with improved registration
JP2002083737A (ja) * 2000-09-07 2002-03-22 Murata Mfg Co Ltd 非線形誘電体素子
JP3760942B2 (ja) * 2001-10-25 2006-03-29 松下電器産業株式会社 積層セラミック電子部品の製造方法
JP4293553B2 (ja) 2005-05-31 2009-07-08 Ｔｄｋ株式会社 積層型電子部品及び積層セラミックコンデンサ
JP4933968B2 (ja) * 2007-07-04 2012-05-16 Ｔｄｋ株式会社 セラミック電子部品
WO2013047646A1 (ja) * 2011-09-29 2013-04-04 株式会社村田製作所 積層セラミックコンデンサ、および積層セラミックコンデンサの製造方法
JP7108605B2 (ja) * 2016-09-27 2022-07-28 パーキンエルマー・ヘルス・サイエンシーズ・カナダ・インコーポレイテッド コンデンサ及び無線周波発生器、ならびにこれらを使用する他のデバイス

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1020016A (fr) * 1950-06-10 1953-01-30 Csf Procédé d'assemblage de plaques minces de céramiques
US2972180A (en) * 1956-01-11 1961-02-21 Gulton Ind Inc Electrical components and method of making same
FR1328877A (fr) * 1961-07-19 1963-05-31 Johnson Matthey Co Ltd Perfectionnement aux condensateurs électriques
US3469161A (en) * 1964-11-13 1969-09-23 Westinghouse Electric Corp Capacitors employing lead silico-borate glass compositions
US3267342A (en) * 1965-05-18 1966-08-16 Corning Glass Works Electrical capacitor
US3467898A (en) * 1968-08-07 1969-09-16 Erie Technological Prod Inc Capacitor with terminal means
JPS4870855A (de) * 1971-12-29 1973-09-26
US3784887A (en) * 1973-04-26 1974-01-08 Du Pont Process for making capacitors and capacitors made thereby
US4082906A (en) * 1977-02-14 1978-04-04 San Fernando Electric Manufacturing Company Low temperature fired ceramic capacitors
FR2389211A1 (fr) * 1977-04-26 1978-11-24 Eurofarad Fabrication de condensateurs a dielectrique mica multicouches, avec interposition de couches de verre
US4267634A (en) * 1978-04-05 1981-05-19 American Components Inc. Method for making a chip circuit component
JPS55133597A (en) * 1979-04-06 1980-10-17 Hitachi Ltd Multilayer circuit board

Also Published As

Publication number Publication date
EP0285873B1 (de) 1994-01-19
EP0285873A3 (en) 1989-04-19
EP0285873A2 (de) 1988-10-12
DE3887186T2 (de) 1994-05-19
US4835656A (en) 1989-05-30

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee