DE3882974T2 - Korrosionswiderstand verbesserndes Elektroplattierungsverfahren und elektroplattierter Gegenstand. - Google Patents

Korrosionswiderstand verbesserndes Elektroplattierungsverfahren und elektroplattierter Gegenstand.

Info

Publication number
DE3882974T2
DE3882974T2 DE88121447T DE3882974T DE3882974T2 DE 3882974 T2 DE3882974 T2 DE 3882974T2 DE 88121447 T DE88121447 T DE 88121447T DE 3882974 T DE3882974 T DE 3882974T DE 3882974 T2 DE3882974 T2 DE 3882974T2
Authority
DE
Germany
Prior art keywords
corrosion resistance
electroplating process
resistance improving
electroplated article
improving electroplating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE88121447T
Other languages
English (en)
Other versions
DE3882974D1 (de
Inventor
Samuel W Dr Levine
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Electro Alloys Corp
Original Assignee
Electro Alloys Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electro Alloys Corp filed Critical Electro Alloys Corp
Application granted granted Critical
Publication of DE3882974D1 publication Critical patent/DE3882974D1/de
Publication of DE3882974T2 publication Critical patent/DE3882974T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B32B15/018—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of a noble metal or a noble metal alloy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/923—Physical dimension
    • Y10S428/924—Composite
    • Y10S428/926—Thickness of individual layer specified
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/9335—Product by special process
    • Y10S428/934—Electrical process
    • Y10S428/935—Electroplating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12868—Group IB metal-base component alternative to platinum group metal-base component [e.g., precious metal, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12944—Ni-base component

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
DE88121447T 1988-01-21 1988-12-22 Korrosionswiderstand verbesserndes Elektroplattierungsverfahren und elektroplattierter Gegenstand. Expired - Fee Related DE3882974T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/146,350 US4835067A (en) 1988-01-21 1988-01-21 Corrosion resistant electroplating process, and plated article

Publications (2)

Publication Number Publication Date
DE3882974D1 DE3882974D1 (de) 1993-09-09
DE3882974T2 true DE3882974T2 (de) 1994-03-10

Family

ID=22516980

Family Applications (1)

Application Number Title Priority Date Filing Date
DE88121447T Expired - Fee Related DE3882974T2 (de) 1988-01-21 1988-12-22 Korrosionswiderstand verbesserndes Elektroplattierungsverfahren und elektroplattierter Gegenstand.

Country Status (5)

Country Link
US (1) US4835067A (de)
EP (1) EP0337015B1 (de)
JP (1) JP2575094B2 (de)
KR (1) KR960006596B1 (de)
DE (1) DE3882974T2 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0335608B1 (de) * 1988-03-28 1995-06-14 Texas Instruments Incorporated Leiterrahmen mit verminderter Korrosion
US5051317A (en) * 1990-01-03 1991-09-24 Krementz & Co. Inc. Multilayered electroplating process utilizing fine gold
US5343073A (en) * 1992-01-17 1994-08-30 Olin Corporation Lead frames having a chromium and zinc alloy coating
WO1994024702A1 (en) * 1993-04-13 1994-10-27 Johnson Matthey Electronics, Inc. Metal cover for ceramic package and method of making same
EP0660119B1 (de) 1993-12-27 2003-04-02 Hitachi, Ltd. Beschleunigungsmessaufnehmer
US5532513A (en) * 1994-07-08 1996-07-02 Johnson Matthey Electronics, Inc. Metal-ceramic composite lid
WO1996002941A1 (en) * 1994-07-19 1996-02-01 Johnson Matthey Electronics, Inc. Metal cover for ceramic package and method of making same
US5639014A (en) * 1995-07-05 1997-06-17 Johnson Matthey Electronics, Inc. Integral solder and plated sealing cover and method of making same
JP3423855B2 (ja) * 1996-04-26 2003-07-07 株式会社デンソー 電子部品搭載用構造体および電子部品の実装方法
US6390353B1 (en) 1998-01-06 2002-05-21 Williams Advanced Materials, Inc. Integral solder and plated sealing cover and method of making the same
EP1260609A4 (de) * 2000-02-24 2005-01-05 Ibiden Co Ltd Nickel-gold-plattierung mit hoher korriosionbeständigkeit
WO2003043082A1 (en) * 2001-11-12 2003-05-22 Sumitomo Special Metals C0., Ltd. Package for electronic parts, lid thereof, material for the lid and method for producing the lid material
EP1524693A1 (de) * 2003-10-13 2005-04-20 Infineon Technologies AG Leiterrahmen mit Korrosionsschutz
DE102005006281B4 (de) * 2005-02-10 2014-07-17 Infineon Technologies Ag Hochfrequenzleistungsbauteil mit Goldbeschichtungen und Verfahren zur Herstellung desselben
US9425122B2 (en) 2012-12-21 2016-08-23 Panasonic Intellectual Property Management Co., Ltd. Electronic component package and method for manufacturing the same
US9825209B2 (en) * 2012-12-21 2017-11-21 Panasonic Intellectual Property Management Co., Ltd. Electronic component package and method for manufacturing the same
US9449944B2 (en) 2012-12-21 2016-09-20 Panasonic Intellectual Property Management Co., Ltd. Electronic component package and method for manufacturing same
JP5624697B1 (ja) 2012-12-21 2014-11-12 パナソニック株式会社 電子部品パッケージおよびその製造方法
CN103077928A (zh) * 2013-02-16 2013-05-01 马国荣 单面局部镀金的盖板结构
JP7395389B2 (ja) * 2020-03-09 2023-12-11 Ｄｏｗａメタルテック株式会社 銀めっき材およびその製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1043578A (en) * 1912-05-09 1912-11-05 Commercial Res Company Compound metal body and process of making the same.
US1571541A (en) * 1924-07-25 1926-02-02 Gen Plate Co Plated metal
US2897584A (en) * 1957-05-22 1959-08-04 Sel Rex Corp Gold plated electrical contact and similar elements
US4141029A (en) * 1977-12-30 1979-02-20 Texas Instruments Incorporated Integrated circuit device
US4284481A (en) * 1978-07-31 1981-08-18 Norman Hascoe Method of fabricating a metallic hermetic sealing cover for a container
US4451540A (en) * 1982-08-30 1984-05-29 Isotronics, Inc. System for packaging of electronic circuits
GB2138025B (en) * 1983-04-13 1986-09-24 Furukawa Electric Co Ltd Silver-coated electric materials and a method for their production
US4666796A (en) * 1984-09-26 1987-05-19 Allied Corporation Plated parts and their production
US4601958A (en) * 1984-09-26 1986-07-22 Allied Corporation Plated parts and their production
US4649229A (en) * 1985-08-12 1987-03-10 Aegis, Inc. All metal flat package for microcircuitry

Also Published As

Publication number Publication date
JPH01246392A (ja) 1989-10-02
US4835067A (en) 1989-05-30
EP0337015A1 (de) 1989-10-18
DE3882974D1 (de) 1993-09-09
JP2575094B2 (ja) 1997-01-22
KR890012024A (ko) 1989-08-24
KR960006596B1 (ko) 1996-05-20
EP0337015B1 (de) 1993-08-04

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee