DE69206496D1 - Elektroplattierungsverfahren und Zusammenstellung. - Google Patents

Elektroplattierungsverfahren und Zusammenstellung.

Info

Publication number
DE69206496D1
DE69206496D1 DE69206496T DE69206496T DE69206496D1 DE 69206496 D1 DE69206496 D1 DE 69206496D1 DE 69206496 T DE69206496 T DE 69206496T DE 69206496 T DE69206496 T DE 69206496T DE 69206496 D1 DE69206496 D1 DE 69206496D1
Authority
DE
Germany
Prior art keywords
assembly
electroplating process
electroplating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69206496T
Other languages
English (en)
Other versions
DE69206496T2 (de
Inventor
John J Bladon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shipley Co Inc
Original Assignee
Shipley Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shipley Co Inc filed Critical Shipley Co Inc
Publication of DE69206496D1 publication Critical patent/DE69206496D1/de
Application granted granted Critical
Publication of DE69206496T2 publication Critical patent/DE69206496T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0716—Metallic plating catalysts, e.g. for direct electroplating of through holes; Sensitising or activating metallic plating catalysts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
DE69206496T 1991-06-24 1992-05-25 Elektroplattierungsverfahren und Zusammenstellung. Expired - Fee Related DE69206496T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/719,978 US5207888A (en) 1991-06-24 1991-06-24 Electroplating process and composition

Publications (2)

Publication Number Publication Date
DE69206496D1 true DE69206496D1 (de) 1996-01-18
DE69206496T2 DE69206496T2 (de) 1996-07-11

Family

ID=24892170

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69206496T Expired - Fee Related DE69206496T2 (de) 1991-06-24 1992-05-25 Elektroplattierungsverfahren und Zusammenstellung.

Country Status (4)

Country Link
US (2) US5207888A (de)
EP (1) EP0520195B1 (de)
JP (1) JP3281417B2 (de)
DE (1) DE69206496T2 (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6001289A (en) 1991-12-04 1999-12-14 Materials Innovation, Inc. Acid assisted cold welding and intermetallic formation
US6042781A (en) * 1991-12-04 2000-03-28 Materials Innovation, Inc. Ambient temperature method for increasing the green strength of parts
EP0584386A1 (de) * 1992-08-26 1994-03-02 International Business Machines Corporation Leiterplatte und Herstellungsverfahren für Leiterplatten
US5374346A (en) * 1993-08-09 1994-12-20 Rohm And Haas Company Electroplating process and composition
US5415762A (en) * 1993-08-18 1995-05-16 Shipley Company Inc. Electroplating process and composition
US5484518A (en) * 1994-03-04 1996-01-16 Shipley Company Inc. Electroplating process
US5500106A (en) * 1994-03-04 1996-03-19 Shipley Company, L.L.C. Electroplating process
US5425873A (en) * 1994-04-11 1995-06-20 Shipley Company Llc Electroplating process
US5799393A (en) * 1994-11-09 1998-09-01 Blaupunkt-Werke Gmbh Method for producing a plated-through hole on a printed-circuit board
JP3481379B2 (ja) * 1995-08-23 2003-12-22 メック株式会社 電気めっき法
US5626736A (en) 1996-01-19 1997-05-06 Shipley Company, L.L.C. Electroplating process
US6017967A (en) * 1996-04-01 2000-01-25 Shipley Company, L.L.C. Electroplating process and composition
DE69822480T2 (de) * 1997-09-05 2004-08-12 Cambridge Display Technology Ltd. Transportschichten in self-assembly-technik für oled's
US6140234A (en) * 1998-01-20 2000-10-31 International Business Machines Corporation Method to selectively fill recesses with conductive metal
US6066889A (en) * 1998-09-22 2000-05-23 International Business Machines Corporation Methods of selectively filling apertures
US6815266B2 (en) * 2002-12-30 2004-11-09 Bae Systems Information And Electronic Systems Integration, Inc. Method for manufacturing sidewall contacts for a chalcogenide memory device
US20090056994A1 (en) * 2007-08-31 2009-03-05 Kuhr Werner G Methods of Treating a Surface to Promote Metal Plating and Devices Formed
JP2010538160A (ja) * 2007-08-31 2010-12-09 ゼタコア インコーポレイテッド 興味ある分子の結合を促進するための表面処理方法、該方法により形成されたコーティングおよび装置
US9345149B2 (en) 2010-07-06 2016-05-17 Esionic Corp. Methods of treating copper surfaces for enhancing adhesion to organic substrates for use in printed circuit boards

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US844304A (en) * 1901-10-15 1907-02-12 John Andrew Daly Method of coating lace with metal.
US2474502A (en) * 1944-02-29 1949-06-28 Charles T Suchy Metallization of electrically nonconductive fabrics, fibrous materials, and porous materials
US3011920A (en) * 1959-06-08 1961-12-05 Shipley Co Method of electroless deposition on a substrate and catalyst solution therefor
US3099608A (en) * 1959-12-30 1963-07-30 Ibm Method of electroplating on a dielectric base
US3533918A (en) * 1967-04-18 1970-10-13 John C Smith Method of making electrodes for fuel cells
US3934335A (en) * 1974-10-16 1976-01-27 Texas Instruments Incorporated Multilayer printed circuit board
US4303798A (en) * 1979-04-27 1981-12-01 Kollmorgen Technologies Corporation Heat shock resistant printed circuit board assemblies
US4325780A (en) * 1980-09-16 1982-04-20 Schulz Sr Robert M Method of making a printed circuit board
DE3323476A1 (de) * 1982-07-01 1984-01-05 Kollmorgen Technologies Corp., 75201 Dallas, Tex. Verbessertes verfahren zur galvanischen metallabscheidung auf nichtmetallischen oberflaechen
IL82764A0 (en) * 1986-06-06 1987-12-20 Advanced Plating Technology Ap Selective plating process for the electrolytic coating of circuit boards
US5007990A (en) * 1987-07-10 1991-04-16 Shipley Company Inc. Electroplating process
US5017742A (en) * 1988-09-15 1991-05-21 Shipley Company Inc. Printed circuit board
US4919768A (en) * 1989-09-22 1990-04-24 Shipley Company Inc. Electroplating process

Also Published As

Publication number Publication date
EP0520195A3 (en) 1993-03-10
US5207888A (en) 1993-05-04
EP0520195A2 (de) 1992-12-30
JP3281417B2 (ja) 2002-05-13
JPH05214585A (ja) 1993-08-24
DE69206496T2 (de) 1996-07-11
EP0520195B1 (de) 1995-12-06
US5276290A (en) 1994-01-04

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee