DE3878735D1 - Verfahren zur herstellung von etiketten mit jeweils einer einen schwingkreis bildenden schaltung. - Google Patents

Verfahren zur herstellung von etiketten mit jeweils einer einen schwingkreis bildenden schaltung.

Info

Publication number
DE3878735D1
DE3878735D1 DE8888107811T DE3878735T DE3878735D1 DE 3878735 D1 DE3878735 D1 DE 3878735D1 DE 8888107811 T DE8888107811 T DE 8888107811T DE 3878735 T DE3878735 T DE 3878735T DE 3878735 D1 DE3878735 D1 DE 3878735D1
Authority
DE
Germany
Prior art keywords
circuit
web
circuits
labels
insulating material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8888107811T
Other languages
German (de)
English (en)
Inventor
Poul Richter-Joergensen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Actron Entwicklungs AG
Original Assignee
Actron Entwicklungs AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Actron Entwicklungs AG filed Critical Actron Entwicklungs AG
Application granted granted Critical
Publication of DE3878735D1 publication Critical patent/DE3878735D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1207—Heat-activated adhesive
    • G—PHYSICS
    • G08—SIGNALLING
    • G08B—SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
    • G08B13/00—Burglar, theft or intruder alarms
    • G08B13/22—Electrical actuation
    • G08B13/24—Electrical actuation by interference with electromagnetic field distribution
    • G08B13/2402—Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting
    • G08B13/2405—Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting characterised by the tag technology used
    • G08B13/2414—Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting characterised by the tag technology used using inductive tags
    • G08B13/242—Tag deactivation
    • G—PHYSICS
    • G08—SIGNALLING
    • G08B—SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
    • G08B13/00—Burglar, theft or intruder alarms
    • G08B13/22—Electrical actuation
    • G08B13/24—Electrical actuation by interference with electromagnetic field distribution
    • G08B13/2402—Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting
    • G08B13/2428—Tag details
    • G08B13/2437—Tag layered structure, processes for making layered tags
    • G—PHYSICS
    • G08—SIGNALLING
    • G08B—SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
    • G08B13/00—Burglar, theft or intruder alarms
    • G08B13/22—Electrical actuation
    • G08B13/24—Electrical actuation by interference with electromagnetic field distribution
    • G08B13/2402—Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting
    • G08B13/2428—Tag details
    • G08B13/2437—Tag layered structure, processes for making layered tags
    • G08B13/244—Tag manufacturing, e.g. continuous manufacturing processes
    • G—PHYSICS
    • G08—SIGNALLING
    • G08B—SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
    • G08B13/00—Burglar, theft or intruder alarms
    • G08B13/22—Electrical actuation
    • G08B13/24—Electrical actuation by interference with electromagnetic field distribution
    • G08B13/2402—Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting
    • G08B13/2428—Tag details
    • G08B13/2437—Tag layered structure, processes for making layered tags
    • G08B13/2442—Tag materials and material properties thereof, e.g. magnetic material details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/041—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a die for cutting the conductive material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/80—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple passive components, e.g. resistors, capacitors or inductors
    • H10D86/85—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple passive components, e.g. resistors, capacitors or inductors characterised by only passive components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1207—Heat-activated adhesive
    • B32B2037/1215—Hot-melt adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2519/00—Labels, badges
    • B32B2519/02—RFID tags
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1062—Prior to assembly
    • Y10T156/107—Punching and bonding pressure application by punch
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/108—Flash, trim or excess removal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1082—Partial cutting bonded sandwich [e.g., grooving or incising]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1084—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing of continuous or running length bonded web
    • Y10T156/1085—One web only
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Computer Security & Cryptography (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Burglar Alarm Systems (AREA)
  • Laminated Bodies (AREA)
  • Credit Cards Or The Like (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Structure Of Printed Boards (AREA)
  • Labeling Devices (AREA)
DE8888107811T 1987-05-22 1988-05-16 Verfahren zur herstellung von etiketten mit jeweils einer einen schwingkreis bildenden schaltung. Expired - Fee Related DE3878735D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH2003/87A CH673744A5 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1987-05-22 1987-05-22

Publications (1)

Publication Number Publication Date
DE3878735D1 true DE3878735D1 (de) 1993-04-08

Family

ID=4223626

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8888107811T Expired - Fee Related DE3878735D1 (de) 1987-05-22 1988-05-16 Verfahren zur herstellung von etiketten mit jeweils einer einen schwingkreis bildenden schaltung.

Country Status (7)

Country Link
US (1) US4900386A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
EP (1) EP0292827B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JP2681366B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
AT (1) ATE86404T1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
CH (1) CH673744A5 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (1) DE3878735D1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
ES (1) ES2039502T3 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (66)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4985288A (en) * 1988-04-30 1991-01-15 Tokai Metals Co., Ltd. Resonant frequency characteristic tag and method of manufacturing the same
CH680483A5 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1989-10-20 1992-08-31 Kobe Properties Ltd
US5589251A (en) * 1990-08-06 1996-12-31 Tokai Electronics Co., Ltd. Resonant tag and method of manufacturing the same
US5695860A (en) * 1990-08-06 1997-12-09 Tokai Electronics Co., Ltd. Resonant tag and method of manufacturing the same
US5447779A (en) * 1990-08-06 1995-09-05 Tokai Electronics Co., Ltd. Resonant tag and method of manufacturing the same
JP3096069B2 (ja) * 1990-08-06 2000-10-10 チェックポイント・マニュファクチュアリング・ジャパン株式会社 共振タグ及びその製造方法
EP0617826B1 (fr) * 1991-12-19 1996-04-10 GUSTAFSON, Ake Dispositif de scellement de securite
US5331313A (en) * 1992-10-01 1994-07-19 Minnesota Mining And Manufacturing Company Marker assembly for use with an electronic article surveillance system
DE4239846C2 (de) * 1992-11-27 2000-06-29 Meto International Gmbh Verfahren und Vorrichtung zur Herstellung von Diebstahlsicherungsetiketten
US5751256A (en) * 1994-03-04 1998-05-12 Flexcon Company Inc. Resonant tag labels and method of making same
JPH07319810A (ja) * 1994-04-01 1995-12-08 Fujitsu Ltd ネットワークサービスシステム及びネットワークサービスシステムを利用可能なゲーム機用通信装置並びにゲーム機
US6496112B1 (en) 1998-02-27 2002-12-17 Motorola, Inc. Radio frequency identification tag with a programmable circuit state
US6252508B1 (en) 1995-10-11 2001-06-26 Motorola, Inc. Radio frequency identification tag arranged for magnetically storing tag state information
US6411213B1 (en) 1995-10-11 2002-06-25 Motorola, Inc. Radio frequency identification tag system using tags arranged for coupling to ground
US6040773A (en) * 1995-10-11 2000-03-21 Motorola, Inc. Radio frequency identification tag arranged for magnetically storing tag state information
US6404339B1 (en) 1995-10-11 2002-06-11 Motorola, Inc. Radio frequency identification tag arranged with a printable display
CA2171526C (en) * 1995-10-13 1997-11-18 Glen E. Mavity Combination article security target and printed label and method and apparatus for making and applying same
US5833793A (en) * 1996-03-25 1998-11-10 Minnesota Mining And Manufacturing Company Apparatus and method for inserting markers into books
US5843272A (en) * 1996-03-25 1998-12-01 Minnesota Mining And Manufacturing Company Apparatus for automatically inserting markers into books
US5847649A (en) * 1996-03-25 1998-12-08 Minnesota Mining And Manufacturing Company EAS marker assemblies
DE19650611A1 (de) * 1996-12-06 1998-06-10 Meto International Gmbh Verfahren und Vorrichtung zur Herstellung von Sicherungselementen für die elektronische Artikelsicherung sowie ein entsprechendes Bandmaterial
US6222452B1 (en) * 1996-12-16 2001-04-24 Confidence International Ab Electronic identification tag
US5867102C1 (en) * 1997-02-27 2002-09-10 Wallace Comp Srvices Inc Electronic article surveillance label assembly and method of manufacture
US6019865A (en) * 1998-01-21 2000-02-01 Moore U.S.A. Inc. Method of forming labels containing transponders
US5999098A (en) * 1998-02-03 1999-12-07 Sensormatic Electronics Corporation Redistributing magnetic charge in bias element for magnetomechanical EAS marker
US6618939B2 (en) * 1998-02-27 2003-09-16 Kabushiki Kaisha Miyake Process for producing resonant tag
JP2001084463A (ja) * 1999-09-14 2001-03-30 Miyake:Kk 共振回路
US6107921A (en) 1998-04-16 2000-08-22 Motorola, Inc. Conveyor bed with openings for capacitive coupled readers
US6362738B1 (en) 1998-04-16 2002-03-26 Motorola, Inc. Reader for use in a radio frequency identification system and method thereof
US6018299A (en) * 1998-06-09 2000-01-25 Motorola, Inc. Radio frequency identification tag having a printed antenna and method
US6246327B1 (en) 1998-06-09 2001-06-12 Motorola, Inc. Radio frequency identification tag circuit chip having printed interconnection pads
US6107920A (en) * 1998-06-09 2000-08-22 Motorola, Inc. Radio frequency identification tag having an article integrated antenna
SE516920C2 (sv) * 1998-08-04 2002-03-19 Kent Loerd Metod för framställning av etikettmaterial
JP3180086B2 (ja) 1998-08-31 2001-06-25 株式会社シーメディア 携帯通信装置、情報伝達システム及び方法、携帯通信装置で利用可能な非接触ｉｃメディア
US6246326B1 (en) * 1999-05-05 2001-06-12 Intermec Ip Corp. Performance optimized smart label printer
US6784789B2 (en) * 1999-07-08 2004-08-31 Intermec Ip Corp. Method and apparatus for verifying RFID tags
US6451154B1 (en) * 2000-02-18 2002-09-17 Moore North America, Inc. RFID manufacturing concepts
EP1261489A4 (en) 2000-03-01 2005-03-09 Zih Corp CONTACT PROGRAMMER
US6229442B1 (en) 2000-03-14 2001-05-08 Motorola, Inc, Radio frequency identification device having displacement current control and method thereof
US7017820B1 (en) 2001-02-08 2006-03-28 James Brunner Machine and process for manufacturing a label with a security element
EP1233662A1 (en) * 2001-02-19 2002-08-21 Westvaco Corporation Foil/ink composite inductor
US6830641B2 (en) * 2001-08-13 2004-12-14 Saint-Gobain Performance Plastics Corporation Method of making a seal formed from polymer laminated metallic constructions
US6988666B2 (en) * 2001-09-17 2006-01-24 Checkpoint Systems, Inc. Security tag and process for making same
EP1500043B1 (en) * 2002-04-24 2008-07-30 Mineral Lassen LLC Manufacturing method for a wireless communication device and manufacturing apparatus
JP2004342755A (ja) * 2003-05-14 2004-12-02 Shinko Electric Ind Co Ltd 平面コイルの製造方法
US7119685B2 (en) * 2004-02-23 2006-10-10 Checkpoint Systems, Inc. Method for aligning capacitor plates in a security tag and a capacitor formed thereby
US7384496B2 (en) * 2004-02-23 2008-06-10 Checkpoint Systems, Inc. Security tag system for fabricating a tag including an integrated surface processing system
DE602005021074D1 (de) * 2004-02-23 2010-06-17 Checkpoint Systems Inc Sicherheitsetikett und verfahren zum herstellen eines etiketts
US7138919B2 (en) * 2004-02-23 2006-11-21 Checkpoint Systems, Inc. Identification marking and method for applying the identification marking to an item
US7704346B2 (en) * 2004-02-23 2010-04-27 Checkpoint Systems, Inc. Method of fabricating a security tag in an integrated surface processing system
US8099335B2 (en) * 2004-02-23 2012-01-17 Checkpoint Systems, Inc. Method and system for determining billing information in a tag fabrication process
US7116227B2 (en) * 2004-02-23 2006-10-03 Checkpoint Systems, Inc. Tag having patterned circuit elements and a process for making same
US7500307B2 (en) * 2004-09-22 2009-03-10 Avery Dennison Corporation High-speed RFID circuit placement method
US20070013520A1 (en) * 2005-03-01 2007-01-18 Kevin Conwell Printhead with RFID antenna
US20060249917A1 (en) * 2005-04-07 2006-11-09 Saint-Gobain Performance Plastics Corporation Composite sealing device
US7623040B1 (en) * 2005-11-14 2009-11-24 Checkpoint Systems, Inc. Smart blister pack
US7504950B2 (en) * 2005-11-30 2009-03-17 Zih Corp. System and method for continuous RFID encoding
US8786510B2 (en) * 2006-01-24 2014-07-22 Avery Dennison Corporation Radio frequency (RF) antenna containing element and methods of making the same
US7497004B2 (en) * 2006-04-10 2009-03-03 Checkpoint Systems, Inc. Process for making UHF antennas for EAS and RFID tags and antennas made thereby
TW200811717A (en) * 2006-08-25 2008-03-01 Advanced Connectek Inc Method for fabricating antenna units in continuous manner
DE102007026720A1 (de) * 2007-06-06 2008-12-11 Bielomatik Leuze Gmbh + Co.Kg Selbstklebende Antenne für ein RFID-System, insbesondere für ein RFID-Etikett, und Verfahren zu ihrer Herstellung
US20090121880A1 (en) * 2007-11-12 2009-05-14 3M Innovative Properties Company Applicators and apparatuses for applying radio frequency identification (rfid) tags
US9111191B2 (en) * 2008-11-25 2015-08-18 Avery Dennison Corporation Method of making RFID devices
US9941569B2 (en) 2010-06-14 2018-04-10 Avery Dennison Retail Information Services, Llc Method of manufacturing a radio frequency identification device
FI125720B (fi) 2011-05-19 2016-01-29 Tecnomar Oy Rullalta rullalle -massavalmistukseen soveltuva sähköisten siltojen valmistusmenetelmä
DE102018117364A1 (de) * 2018-07-18 2020-01-23 Infineon Technologies Ag Verfahren und Vorrichtung zum Trimmen einer auf einem Träger aufgebrachten Antenne, Verfahren zum Herstellen einer Trägerstruktur, Trägerstruktur und Chipkarte

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4555291A (en) * 1981-04-23 1985-11-26 Minnesota Mining And Manufacturing Company Method of constructing an LC network
DE3221500A1 (de) * 1982-06-07 1983-12-08 Max-E. Dipl.-Ing. 7320 Göppingen Reeb Identifizierungsanordnung in form eines an einem gegenstand anbringbaren gebildes und verfahren zur herstellung
DK163151C (da) * 1983-11-16 1992-06-22 Minnesota Mining & Mfg Maerkeplade med lc resonanskredsloeb til anvendelse i elektronisk genstandsovervaagningssystem, fremgangsmaade til fremstilling af maerkeplader, samt elektronisk genstandsovervaagningssystem hvori maerkepladen anvendes.
CH668880A5 (de) * 1985-07-25 1989-01-31 Durgo Ag Verfahren zur herstellung ebener elektrischer schaltungen.
US4717438A (en) * 1986-09-29 1988-01-05 Monarch Marking Systems, Inc. Method of making tags

Also Published As

Publication number Publication date
ATE86404T1 (de) 1993-03-15
JP2681366B2 (ja) 1997-11-26
JPS63317389A (ja) 1988-12-26
US4900386A (en) 1990-02-13
ES2039502T3 (es) 1993-10-01
EP0292827A1 (de) 1988-11-30
EP0292827B1 (de) 1993-03-03
CH673744A5 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1990-03-30

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