DE3866534D1 - Verfahren und vorrichtung zum schneiden von staeben aus harten materialien. - Google Patents

Verfahren und vorrichtung zum schneiden von staeben aus harten materialien.

Info

Publication number
DE3866534D1
DE3866534D1 DE8888907344T DE3866534T DE3866534D1 DE 3866534 D1 DE3866534 D1 DE 3866534D1 DE 8888907344 T DE8888907344 T DE 8888907344T DE 3866534 T DE3866534 T DE 3866534T DE 3866534 D1 DE3866534 D1 DE 3866534D1
Authority
DE
Germany
Prior art keywords
cropping
cutting element
hard materials
layer
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8888907344T
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Application granted granted Critical
Publication of DE3866534D1 publication Critical patent/DE3866534D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00Other grinding machines or devices
    • B24B27/06Grinders for cutting-off
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D1/00Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
    • B26D1/01Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
    • B26D1/547Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a wire-like cutting member
    • B26D1/553Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a wire-like cutting member with a plurality of wire-like cutting members
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23DPLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D57/00Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
    • B23D57/003Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts
    • B23D57/0061Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts of devices for guiding or feeding saw wires
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/007Use, recovery or regeneration of abrasive mediums
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Control And Other Processes For Unpacking Of Materials (AREA)
  • Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
DE8888907344T 1987-08-21 1988-08-18 Verfahren und vorrichtung zum schneiden von staeben aus harten materialien. Expired - Lifetime DE3866534D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH3222/87A CH672452A5 (de) 1987-08-21 1987-08-21
PCT/FR1988/000421 WO1989001395A1 (fr) 1987-08-21 1988-08-18 Procede de tronçonnage de lingots de materiaux durs et appareillage de mise en oeuvre de ce procede

Publications (1)

Publication Number Publication Date
DE3866534D1 true DE3866534D1 (de) 1992-01-09

Family

ID=4251286

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8888907344T Expired - Lifetime DE3866534D1 (de) 1987-08-21 1988-08-18 Verfahren und vorrichtung zum schneiden von staeben aus harten materialien.

Country Status (8)

Country Link
EP (1) EP0328610B1 (de)
JP (1) JPH02500577A (de)
KR (1) KR890701295A (de)
AT (1) ATE69758T1 (de)
CH (1) CH672452A5 (de)
DE (1) DE3866534D1 (de)
DK (1) DK188289A (de)
WO (1) WO1989001395A1 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2673544B2 (ja) * 1988-06-14 1997-11-05 株式会社日平トヤマ 脆性材料の切断方法
FR2720452B1 (fr) * 1994-05-31 1996-07-26 Flacheres Agence Dispositif pour la réalisation de points d'ancrage sur des flancs de matière prédécoupée.
JP3427956B2 (ja) * 1995-04-14 2003-07-22 信越半導体株式会社 ワイヤーソー装置
CZ283541B6 (cs) * 1996-03-06 1998-04-15 Trimex Tesla, S.R.O. Způsob řezání ingotů z tvrdých materiálů na desky a pila k provádění tohoto způsobu
KR101226979B1 (ko) * 2011-07-01 2013-01-28 국방과학연구소 고체 추진기관의 절단방법 및 장치
US9156187B2 (en) 2011-12-29 2015-10-13 Sunedison Semiconductor Ltd. Methods for mounting an ingot on a wire saw
CN214687337U (zh) * 2020-11-20 2021-11-12 天通日进精密技术有限公司 硅棒截断设备

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1512501A (fr) * 1966-12-27 1968-02-09 Electronique & Automatisme Sa Perfectionnements apportés aux machines à scier des éléments en matériaux fragiles, notamment cristallins
US3478732A (en) * 1967-03-15 1969-11-18 David J Clark Wire saw drum
US3824982A (en) * 1971-12-20 1974-07-23 Motorola Inc Machine for cutting brittle materials
FR2254948A5 (en) * 1973-12-18 1975-07-11 Motorola Inc Brittle material cutting mechanism - has grooved pulleys on axes inclined to each other guiding moving cutting wire
CH610805A5 (en) * 1975-11-07 1979-05-15 Sotarem Sa Machine for cutting hard bodies
US4574769A (en) * 1984-02-18 1986-03-11 Ishikawa Ken Ichi Multi-wire vibratory cutting method and apparatus
JPS61168466A (ja) * 1985-01-21 1986-07-30 Yasunaga Eng Kk 加工物微速押上装置

Also Published As

Publication number Publication date
WO1989001395A1 (fr) 1989-02-23
DK188289D0 (da) 1989-04-19
ATE69758T1 (de) 1991-12-15
KR890701295A (ko) 1989-12-20
EP0328610A1 (de) 1989-08-23
JPH02500577A (ja) 1990-03-01
EP0328610B1 (de) 1991-11-27
DK188289A (da) 1989-04-19
CH672452A5 (de) 1989-11-30

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee