DE386177C - Aluminum solder - Google Patents

Aluminum solder

Info

Publication number
DE386177C
DE386177C DEM77415D DEM0077415D DE386177C DE 386177 C DE386177 C DE 386177C DE M77415 D DEM77415 D DE M77415D DE M0077415 D DEM0077415 D DE M0077415D DE 386177 C DE386177 C DE 386177C
Authority
DE
Germany
Prior art keywords
aluminum
solder
aluminum solder
lead
cadmium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DEM77415D
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Metallbank und Metallurgische Gesellschaft AG
Original Assignee
Metallbank und Metallurgische Gesellschaft AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Metallbank und Metallurgische Gesellschaft AG filed Critical Metallbank und Metallurgische Gesellschaft AG
Priority to DEM77415D priority Critical patent/DE386177C/en
Application granted granted Critical
Publication of DE386177C publication Critical patent/DE386177C/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/28—Selection of soldering or welding materials proper with the principal constituent melting at less than 950 degrees C
    • B23K35/286—Al as the principal constituent
    • B23K35/288—Al as the principal constituent with Sn or Zn

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

DEUTSCHES REICHGERMAN EMPIRE

AUSGEGEBEN AI 3. DEZEMBER 1923ISSUE AI DECEMBER 3, 1923

REICHSPATENTAMTREICH PATENT OFFICE

PATENTSCHRIFTPATENT LETTERING

KLASSE 49 f GRUPPE 15CLASS 49 f GROUP 15

(M774I5 Ii49-P)(M 774 I 5 Ii 49- P)

Metallbank und Metallurgische Gesellschaft Akt-Ges. in Frankfurt a. M.Metallbank and Metallurgical Society Akt-Ges. in Frankfurt a. M.

Aluminiiimlot. Patentiert im Deutschen Reiche vom 12. April 1922 ab. Aluminum solder. Patented in the German Empire on April 12 , 1922.

Aus Zink, Aluminium, Blei, Zinn und Kadmium zusammengesetzte Aluminiumlote sind bekannt. Diese Lote haben jedoch den Nachteil, daß sie sich sehr schwer mit dem zu lötenden Aluminium verbinden und gegen mechanische Beanspruchung als auch gegen chemische Einflüsse nicht sehr widerstandsfähig sind.Aluminum solders are composed of zinc, aluminum, lead, tin and cadmium known. However, these solders have the disadvantage that they are very difficult to solder Connect aluminum and against mechanical stress as well as against chemical Influences are not very resistant.

Überraschenderweise wurde gefunden, daß ίο I:ei Zink-Aluminium-Blei-Loten mit oder ohne Zusatz von Kadmium oder Zinn oder beider Metalle durch Hinzufügen von Zer oder Lithium einzeln oder zusammen die Haftfähigkeit des Lotes wesentlich gesteigert wird.Surprisingly, it was found that ίο I: ei zinc-aluminum-lead solders with or without Addition of cadmium or tin or both metals by adding cerium or lithium individually or together the adhesiveness of the plumb bob is increased significantly.

Diese Zusätze in Mengen bis zu 30 Prozent führen während des Lötvorganges eine Reduktion der Oxydhaut des zu lötenden Aluminiums herbei, derart, daß das Lot sich ohne Schwierigkeit mit dem zu lötenden Aluminium verbindet.These additives in amounts of up to 30 percent lead to a reduction during the soldering process the oxide skin of the aluminum to be soldered, in such a way that the solder contacts the aluminum to be soldered without difficulty connects.

Claims (1)

Patent-Anspruch:Patent claim: Aus Zink, Aluminium, Blei bestehendes Aluminiumlot mit oder ohne Zusätze von Kadmium oder Zinn oder beider Metalle, dadurch gekennzeichnet, daß das Lot Zer oder Lithium einzeln oder zusammen bis zu 30 Prozent enthält.Aluminum solder consisting of zinc, aluminum, lead with or without additions of Cadmium or tin or both metals, characterized in that the solder or lithium individually or together up to contains up to 30 percent.
DEM77415D 1922-04-12 1922-04-12 Aluminum solder Expired DE386177C (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DEM77415D DE386177C (en) 1922-04-12 1922-04-12 Aluminum solder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DEM77415D DE386177C (en) 1922-04-12 1922-04-12 Aluminum solder

Publications (1)

Publication Number Publication Date
DE386177C true DE386177C (en) 1923-12-03

Family

ID=7317647

Family Applications (1)

Application Number Title Priority Date Filing Date
DEM77415D Expired DE386177C (en) 1922-04-12 1922-04-12 Aluminum solder

Country Status (1)

Country Link
DE (1) DE386177C (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2190930A1 (en) * 1972-07-05 1974-02-01 Nat Res Inst Metals Lithium addn to aluminium - to prevent porosity in casting or welding

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2190930A1 (en) * 1972-07-05 1974-02-01 Nat Res Inst Metals Lithium addn to aluminium - to prevent porosity in casting or welding

Similar Documents

Publication Publication Date Title
DE386177C (en) Aluminum solder
DE1239105B (en) Magnesium alloys containing zirconium
DE560281C (en) Solder for aluminum or aluminum alloys
DE408254C (en) High lead bearing metal alloy
GB159008A (en) Improvements in or relating to aluminium alloys
DE732318C (en) Gold solder
DE876602C (en) Alloy for dental purposes
DE306892C (en)
DE759340C (en) Tin-free solder
DE414211C (en) Injection and chill casting alloy
DE457592C (en) Lot for magnesium aluminum alloys with predominantly magnesium content
AT141479B (en) Temperable and hard tarnishing silver alloy.
DE972667C (en) Use of silver alloys for soldering or hard soldering and methods for soldering with these solders
DE452239C (en) Flux for soldering and welding light metals
DE922216C (en) Detonators and explosives
DE352471C (en) Lead light metal alloy with an addition of cadmium
DE550836C (en) Lead alloy for cable sheaths
DE563819C (en) Resting contact rectifier
DE895557C (en) Use of a copper alloy for soldering or hard soldering
GB519597A (en) Improvements in or relating to permanent magnet alloys
DE677568C (en) Soft solder for aluminum or aluminum alloys
DE539294C (en) Copper-cobalt-silicon alloys
DE431196C (en) Blasting air igniter
DE522514C (en) Silicon-copper alloys
DE536691C (en) Soft solder