DE3851985T2 - Wärmeleitende Packung für elektronische Bauelemente. - Google Patents

Wärmeleitende Packung für elektronische Bauelemente.

Info

Publication number
DE3851985T2
DE3851985T2 DE3851985T DE3851985T DE3851985T2 DE 3851985 T2 DE3851985 T2 DE 3851985T2 DE 3851985 T DE3851985 T DE 3851985T DE 3851985 T DE3851985 T DE 3851985T DE 3851985 T2 DE3851985 T2 DE 3851985T2
Authority
DE
Germany
Prior art keywords
heat
distributor
carrier plate
carrier
board wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE3851985T
Other languages
German (de)
English (en)
Other versions
DE3851985D1 (de
Inventor
Harvey S Friedman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Digital Equipment Corp
Original Assignee
Digital Equipment Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Digital Equipment Corp filed Critical Digital Equipment Corp
Application granted granted Critical
Publication of DE3851985D1 publication Critical patent/DE3851985D1/de
Publication of DE3851985T2 publication Critical patent/DE3851985T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE3851985T 1987-07-01 1988-06-30 Wärmeleitende Packung für elektronische Bauelemente. Expired - Fee Related DE3851985T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/069,406 US4887147A (en) 1987-07-01 1987-07-01 Thermal package for electronic components

Publications (2)

Publication Number Publication Date
DE3851985D1 DE3851985D1 (de) 1994-12-08
DE3851985T2 true DE3851985T2 (de) 1995-05-18

Family

ID=22088776

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3851985T Expired - Fee Related DE3851985T2 (de) 1987-07-01 1988-06-30 Wärmeleitende Packung für elektronische Bauelemente.

Country Status (5)

Country Link
US (1) US4887147A (https=)
EP (1) EP0297894B1 (https=)
JP (1) JPS6489451A (https=)
CA (1) CA1282866C (https=)
DE (1) DE3851985T2 (https=)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6478356B1 (en) * 2000-01-05 2002-11-12 Mark Wayne Cargo area structure
US5218215A (en) * 1990-12-19 1993-06-08 Vlsi Technology, Inc. Semiconductor device package having a thermal dissipation means that allows for lateral movement of the lead frame with respect to the housing without breakage of the thermal dissipation path
US5262925A (en) * 1991-10-15 1993-11-16 Hewlett-Packard Company Tab frame with area array edge contacts
US5162975A (en) * 1991-10-15 1992-11-10 Hewlett-Packard Company Integrated circuit demountable TAB apparatus
US5504652A (en) * 1994-09-16 1996-04-02 Apple Computer, Inc. Unitary heat sink for integrated circuits
US5548090A (en) * 1995-08-21 1996-08-20 Northern Telecom Limited Heat sink and printed circuit board combination
GB2346703B (en) * 1997-10-07 2002-06-19 Reliability Inc Burn-in board with adaptable heat sink device
US6323665B1 (en) 1997-10-07 2001-11-27 Reliability Incorporated Apparatus capable of high power dissipation during burn-in of a device under test
US6049217A (en) * 1997-12-30 2000-04-11 Intel Corporation Thermally enhanced test contactor
US6570247B1 (en) * 1997-12-30 2003-05-27 Intel Corporation Integrated circuit device having an embedded heat slug
US6072322A (en) * 1997-12-30 2000-06-06 Intel Corporation Thermally enhanced test socket
US6545352B1 (en) 2002-02-15 2003-04-08 Ericsson Inc. Assembly for mounting power semiconductive modules to heat dissipators
US6999317B2 (en) * 2003-08-12 2006-02-14 Delphi Technologies, Inc. Thermally enhanced electronic module with self-aligning heat sink
US8686277B2 (en) * 2004-12-27 2014-04-01 Intel Corporation Microelectronic assembly including built-in thermoelectric cooler and method of fabricating same
US7532474B2 (en) * 2006-02-21 2009-05-12 3Com Corporation Apparatus for dissipating heat from electronic components in an enclosed housing
US7679917B2 (en) * 2007-02-02 2010-03-16 Deck Joseph F Electronic assembly cooling
JP2009059760A (ja) * 2007-08-30 2009-03-19 Toshiba Corp 電子回路基板の放熱構造体
DE102008028299B3 (de) * 2008-06-13 2009-07-30 Epcos Ag Systemträger für elektronische Komponente und Verfahren für dessen Herstellung
KR20120129885A (ko) 2009-12-09 2012-11-28 톰슨 라이센싱 마이크로천공을 구비하는 셋탑 박스
WO2011106082A1 (en) 2010-02-25 2011-09-01 Thomson Licensing Miniature multilayer radiative cooling case with hidden quick release snaps
BR112012029464A2 (pt) 2010-05-19 2017-03-01 Thomson Licensing caixa de decodificação possuindo cargas térmicas de dissipação
CN103858067A (zh) 2011-03-09 2014-06-11 汤姆逊许可公司 具有卡扣式热沉和智能卡读取器的机顶盒或服务器
CN103703875B (zh) 2011-07-14 2016-10-12 汤姆逊许可公司 具有扣合式散热器和智能卡读卡器、带有用于保持散热器的固定部件的机顶盒
US11807381B2 (en) * 2021-03-16 2023-11-07 Rolls-Royce Corporation Aircraft hybrid propulsion system including cold plate for a high density power converter
US20230262935A1 (en) * 2022-01-26 2023-08-17 Celsia Technologies Taiwan, Inc. Heat dissipation device and anti-vibration heat conduction structure thereof

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1327352A (en) * 1971-10-02 1973-08-22 Kyoto Ceramic Semiconductor device
US4396935A (en) * 1980-10-06 1983-08-02 Ncr Corporation VLSI Packaging system
JPS58169943A (ja) * 1982-03-29 1983-10-06 Fujitsu Ltd 半導体装置
JPS58173790A (ja) * 1982-04-06 1983-10-12 シチズン時計株式会社 表示装置と半導体装置の接続構造
US4620215A (en) * 1982-04-16 1986-10-28 Amdahl Corporation Integrated circuit packaging systems with double surface heat dissipation
US4479140A (en) * 1982-06-28 1984-10-23 International Business Machines Corporation Thermal conduction element for conducting heat from semiconductor devices to a cold plate
EP0103068B1 (de) * 1982-09-09 1989-01-04 Siemens Aktiengesellschaft Einrichtung zum Kühlen einer Mehrzahl von zu Flachbaugruppen zusammengefassten integrierten Bausteinen
US4647959A (en) * 1985-05-20 1987-03-03 Tektronix, Inc. Integrated circuit package, and method of forming an integrated circuit package

Also Published As

Publication number Publication date
JPS6489451A (en) 1989-04-03
EP0297894A3 (en) 1989-06-14
EP0297894A2 (en) 1989-01-04
DE3851985D1 (de) 1994-12-08
EP0297894B1 (en) 1994-11-02
US4887147A (en) 1989-12-12
CA1282866C (en) 1991-04-09
JPH0581185B2 (https=) 1993-11-11

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee