DE3850176D1 - Verdrahtungsverfahren. - Google Patents
Verdrahtungsverfahren.Info
- Publication number
- DE3850176D1 DE3850176D1 DE3850176T DE3850176T DE3850176D1 DE 3850176 D1 DE3850176 D1 DE 3850176D1 DE 3850176 T DE3850176 T DE 3850176T DE 3850176 T DE3850176 T DE 3850176T DE 3850176 D1 DE3850176 D1 DE 3850176D1
- Authority
- DE
- Germany
- Prior art keywords
- wiring method
- wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0317—Thin film conductor layer; Thin film passive component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0341—Intermediate metal, e.g. before reinforcing of conductors by plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0315—Oxidising metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/072—Electroless plating, e.g. finish plating or initial plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1157—Using means for chemical reduction
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62168638A JP2550081B2 (ja) | 1987-07-08 | 1987-07-08 | 回路形成法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3850176D1 true DE3850176D1 (de) | 1994-07-21 |
DE3850176T2 DE3850176T2 (de) | 1994-12-01 |
Family
ID=15871750
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE3850176T Expired - Fee Related DE3850176T2 (de) | 1987-07-08 | 1988-07-05 | Verdrahtungsverfahren. |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0298422B1 (de) |
JP (1) | JP2550081B2 (de) |
KR (1) | KR910000079B1 (de) |
DE (1) | DE3850176T2 (de) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2664246B2 (ja) * | 1989-05-29 | 1997-10-15 | 株式会社日立製作所 | プリント基板の製造方法 |
US5294291A (en) * | 1991-09-20 | 1994-03-15 | Hitachi, Ltd. | Process for the formation of a conductive circuit pattern |
JP2644951B2 (ja) * | 1991-09-20 | 1997-08-25 | 株式会社日立製作所 | 導体回路の形成方法 |
DE69535768D1 (de) * | 1994-12-01 | 2008-07-24 | Ibiden Co Ltd | Mehrschichtige leiterplatte und verfahren für deren herstellung |
US6117300A (en) * | 1996-05-01 | 2000-09-12 | Honeywell International Inc. | Method for forming conductive traces and printed circuits made thereby |
JP3728572B2 (ja) * | 1996-10-31 | 2005-12-21 | 株式会社日立製作所 | 配線基板の製造方法 |
CN100546439C (zh) * | 2008-04-30 | 2009-09-30 | 李东明 | 印刷电路板掩膜孔铜加厚电镀工艺 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2009018B1 (de) * | 1970-02-26 | 1971-04-15 | Krause W | Verfahren zur Herstellung von gedruck ten Schaltunge |
JPS5662393A (en) * | 1979-10-26 | 1981-05-28 | Nippon Electric Co | Method of forming high density wering pattern |
JPS5730319A (en) * | 1980-07-31 | 1982-02-18 | Fujitsu Ltd | Automatic manufacturing equipment of integrated circuit device |
JPS5750489A (en) * | 1980-09-11 | 1982-03-24 | Nippon Electric Co | Method of producing hybrid circuit board |
US4606788A (en) * | 1984-04-12 | 1986-08-19 | Moran Peter L | Methods of and apparatus for forming conductive patterns on a substrate |
JPS6148831A (ja) * | 1984-08-10 | 1986-03-10 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | 光硬化性構造体 |
JPS63283097A (ja) * | 1987-05-14 | 1988-11-18 | Hitachi Plant Eng & Constr Co Ltd | パタ−ン形成法 |
-
1987
- 1987-07-08 JP JP62168638A patent/JP2550081B2/ja not_active Expired - Lifetime
-
1988
- 1988-07-05 DE DE3850176T patent/DE3850176T2/de not_active Expired - Fee Related
- 1988-07-05 EP EP88110710A patent/EP0298422B1/de not_active Expired - Lifetime
- 1988-07-08 KR KR1019880008500A patent/KR910000079B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP0298422A3 (en) | 1990-10-31 |
JPS6413794A (en) | 1989-01-18 |
KR890003270A (ko) | 1989-04-13 |
KR910000079B1 (ko) | 1991-01-19 |
EP0298422B1 (de) | 1994-06-15 |
DE3850176T2 (de) | 1994-12-01 |
EP0298422A2 (de) | 1989-01-11 |
JP2550081B2 (ja) | 1996-10-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |