DE3824140A1 - Fixing and electrical bonding of piezoceramics - Google Patents

Fixing and electrical bonding of piezoceramics

Info

Publication number
DE3824140A1
DE3824140A1 DE3824140A DE3824140A DE3824140A1 DE 3824140 A1 DE3824140 A1 DE 3824140A1 DE 3824140 A DE3824140 A DE 3824140A DE 3824140 A DE3824140 A DE 3824140A DE 3824140 A1 DE3824140 A1 DE 3824140A1
Authority
DE
Germany
Prior art keywords
copper foil
piezoceramic
fixing
electrical bonding
melt adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE3824140A
Other languages
German (de)
Inventor
Thomas Dipl Ing Hirsch
Rudolf Burger
Egon Dipl Ing Edinger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE3824140A priority Critical patent/DE3824140A1/en
Publication of DE3824140A1 publication Critical patent/DE3824140A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
    • H10N30/073—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies by fusion of metals or by adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/88—Mounts; Supports; Enclosures; Casings
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/06—Arranging circuit leads; Relieving strain on circuit leads
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/006—Interconnection of transducer parts

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

The object of the invention is to fix (via the front face) a piezoceramic disc, coated with silver on both sides, over the entire area on a copper foil, while at the same time establishing electrical contact between the copper foil and that silver layer of the piezoceramic, which faces the copper foil. The purpose of fixing and electrical bonding is served by a hot-melt type adhesive which is filled with carbon black and during the application is present as a film, a material plasticated via heat, or as a substance dissolved in a solvent. Electrical bonding and at the same time mechanical fixing of components. <IMAGE>

Description

Die Erfindung betrifft ein Verfahren nach dem Oberbegriff des Anspruchs 1.The invention relates to a method according to the preamble of Claim 1.

Unter Piezokeramiken sind schwingende Bauelemente zu verstehen, die in Fernsprechapparaten, Tongebern, Sensoren, mechanischen Filtern, Tintendruckköpfen usw. Verwendung finden. Eine derarti­ ge Piezokeramik ist beispielsweise bei der Uhren-Summerscheibe beidseitig und ganzflächig mit Elektroden versehen, die aus Ein­ brennsilber oder aus aufgedampften Metallschichten bestehen. Es ist aber auch möglich, die Silberschichten mittels Siebdrucktech­ nik auf die Piezokeramik aufzubringen und dann einzubrennen.Piezo ceramics are to be understood as vibrating components, those in telephone sets, sounder, sensors, mechanical Filters, ink printheads, etc. are used. Such a Ge piezoceramic is, for example, in the watch buzzer Provided on both sides and over the entire surface with electrodes that consist of one fuel silver or vapor-deposited metal layers. It is also possible, the silver layers using screen printing technology nik on the piezoceramic and then burn.

Die Piezo-Kapseln (Mikrofon, Hörer, Tonruf) der Fernsprechgerä­ te beinhalten unter anderem eine Wandlerplatte, die aus einer mit Elektroden versehenen Piezokeramikscheibe, einer kleberbe­ schichteten Trägerplatte und zwei Anschlußbändchen besteht. Wäh­ rend das eine Anschlußbändchen auf eine Elektrode der Keramik gelötet ist, wird die untere Elektrode mit dem zweiten Anschluß­ bändchen beim Klebevorgang druckkontaktiert.The piezo capsules (microphone, handset, ringer) of the telephone sets te include a converter plate that consists of a Piezoceramic disc with electrodes, one adhesive layered carrier plate and two connecting tapes. Wuh rend a connection ribbon on an electrode of the ceramic is soldered, the lower electrode is connected to the second connector Ribbon pressure-contacted during the gluing process.

Der Erfindung liegt die Aufgabe zugrunde eine beidseitig sil­ berbeschichtete Piezokeramikscheibe über die Stirnseite auf einer metallischen Trägerplatte, zum Beispiel einer Kupferfolie, ganzflächig zu befestigen. Die Kupferfolie kann beispielsweise aus drei Lagen Kupfer-Kapton-Kupfer bestehen. Zwischen der Kupferfolie und der der Kupferfolie zugewandten Silberschicht der Piezokeramik soll gleichzeitig elektrischer Kontakt herge­ stellt werden.The invention has for its object a bilateral sil over-coated piezoceramic disc on the front a metallic carrier plate, for example a copper foil, to be fastened over the entire surface. The copper foil can, for example consist of three layers of copper-Kapton-copper. Between the Copper foil and the silver layer facing the copper foil the piezoceramic is intended to provide electrical contact at the same time be put.

Diese Aufgabe wird gemäß dem Kennzeichen des Anspruchs 1 gelöst. Vorteilhafte Ausführungsformen und Weiterbildungen sind Gegen­ stände der Unteransprüche. This object is achieved in accordance with the characterizing part of claim 1. Advantageous embodiments and further developments are counter levels of subclaims.  

Als Schmelzkleber eignet sich beispielsweise ein unter dem Han­ delsnamen bekannter Kunststoff "Lucalen", der besonders gute Klebeeigenschaften aufweist und durch das Beimischen von Ruß die erforderliche elektrische Leitfähigkeit erhält.A hot melt adhesive is, for example, one under the han The well-known plastic "Lucalen", the particularly good one Has adhesive properties and by adding soot receives the required electrical conductivity.

Der Vorteil der Erfindung besteht darin, daß der Schmelzkleber die beiden Teile miteinander verklebt und gleichzeitig aufgrund der elektrisch leitenden Rußfüllung elektrischen Kontakt zwi­ schen den beiden Teilen herstellt und zugleich die elektrische Verbindung zu den nach außen führenden Leitungen ersetzt.The advantage of the invention is that the hot melt adhesive the two parts glued together and due to the electrically conductive soot filling electrical contact between the two parts and at the same time the electrical Connection to the lines leading to the outside replaced.

Der Schmelzkleber kann während des Aufbringens als Folie, über Wärme plastifiziertes Material oder als in Lösungsmittel gelös­ te Substanz vorliegen.The hot melt adhesive can be applied as a film during application Heat plasticized material or as dissolved in solvent substance.

Die Erfindung wird anhand der Figur erläutert, die einen Schnitt durch eine Piezokeramikscheibe und einen Teil der Trä­ gerplatte zeigt.The invention is explained with reference to the figure, the one Cut through a piezoceramic disc and part of the door gerplatte shows.

Mit 1 ist die Piezokeramik bezeichnet, die beidseitig und ganz­ flächig mit Elektroden 2, 3, zum Beispiel aus Silber, versehen ist. Eine als Kupferfolie dienende Trägerplatte besteht bei­ spielsweise aus Kupfer 4, Kapton 5 und Kupfer 6. Zwischen der Kupferfolie 4 und der Elektrode 3 ist der der Befestigung und elektrischen Kontaktierung dienende Schmelzkleber 7 vorgesehen. 1 designates the piezoceramic, which is provided on both sides and over the entire area with electrodes 2 , 3 , for example made of silver. A carrier plate serving as copper foil consists, for example, of copper 4 , Kapton 5 and copper 6 . Provided between the copper foil 4 and the electrode 3 is the hot-melt adhesive 7 used for fastening and electrical contacting.

Die Verwendung von rußgefülltem und dadurch elektrisch leiten­ dem Schmelzkleber zur elektrischen Kontaktierung und gleichzei­ tigen mechanischen Befestigung ist nicht auf die Anwendung bei Piezokeramikscheiben beschränkt sondern allgemein bei Bauteilen anwendbar.The use of soot-filled and therefore electrically conductive the hot melt adhesive for electrical contacting and at the same time mechanical attachment is not related to the application Piezoceramic disks are limited in general for components applicable.

Claims (3)

1. Befestigen und elektrisches Kontaktieren einer beidseitig silberbeschichteten (Elektroden) Piezokeramikscheibe auf einem metallischen Träger, zum Beispiel einer Kupferfolie, die vor­ zugsweise aus drei Lagen Kupfer-Kapton-Kupfer besteht, da­ durch gekennzeichnet, daß ein rußgefüll­ ter Schmelzkleber (7) zur elektrischen Kontaktierung zwischen der unteren Elektrode (3) und dem Träger (4 bis 6) und zu­ gleich zur Befestigung dieser beiden Teile miteinander verwen­ det wird.1. Attach and electrically contact a silver-coated (electrode) piezoceramic disk on both sides on a metallic support, for example a copper foil, which preferably consists of three layers of copper-Kapton-copper, characterized in that a soot-filled hot melt adhesive ( 7 ) for electrical Contact between the lower electrode ( 3 ) and the carrier ( 4 to 6 ) and is used to attach these two parts to each other. 2. Verfahren nach Anspruch 1, dadurch gekenn­ zeichnet, daß der Schmelzkleber (7) während des Auf­ bringens als Folie vorliegt.2. The method according to claim 1, characterized in that the hot melt adhesive ( 7 ) is present during the bringing on as a film. 3. Verfahren nach Anspruch 1, dadurch gekenn­ zeichnet, daß der Schmelzkleber (7) während des Auf­ bringens als plastifiziertes Material oder als in Lösungsmittel gelöste Substanz Verwendung findet.3. The method according to claim 1, characterized in that the hot melt adhesive ( 7 ) is used during the bringing on as a plasticized material or as a substance dissolved in solvent.
DE3824140A 1988-07-15 1988-07-15 Fixing and electrical bonding of piezoceramics Withdrawn DE3824140A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE3824140A DE3824140A1 (en) 1988-07-15 1988-07-15 Fixing and electrical bonding of piezoceramics

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3824140A DE3824140A1 (en) 1988-07-15 1988-07-15 Fixing and electrical bonding of piezoceramics

Publications (1)

Publication Number Publication Date
DE3824140A1 true DE3824140A1 (en) 1990-01-25

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
DE3824140A Withdrawn DE3824140A1 (en) 1988-07-15 1988-07-15 Fixing and electrical bonding of piezoceramics

Country Status (1)

Country Link
DE (1) DE3824140A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19636813C1 (en) * 1996-09-11 1998-01-29 Bosch Gmbh Robert Method of mounting piezoelectric elements on metal surface e.g. in sensor systems
DE19809207C1 (en) * 1998-03-04 1999-08-26 Siemens Ag Structure and manufacturing process of an ultrasonic transducer device with an elastically embedded ultrasonic transducer
DE10112433A1 (en) * 2001-03-15 2002-10-02 Bosch Gmbh Robert Arrangement for measuring properties, e.g. viscosity of liquid, comprises piezoelectric sensor which is immersed in liquid and is electrically connected to exciter and analysis unit

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2622849A1 (en) * 1975-05-19 1976-11-25 Suisse Horlogerie LONGITUDINAL CONNECTING ELEMENT
GB1477780A (en) * 1974-08-14 1977-06-29 Seikosha Kk Assembly incorporating electrically conductive adhesive
US4467237A (en) * 1980-06-25 1984-08-21 Commissariat A L'energie Atomique Multielement ultrasonic probe and its production process
DE8435052U1 (en) * 1984-11-29 1985-03-28 Siemens AG, 1000 Berlin und 8000 München CONVERTER PLATE FOR PIEZOELECTRIC CONVERTER
DE3602487A1 (en) * 1985-01-28 1986-07-31 Sharp K.K., Osaka HEAT-SENSITIVE ADHESIVE CONNECTOR FOR ELECTRICAL CONNECTIONS
DE3504011A1 (en) * 1985-02-06 1986-08-07 Siemens AG, 1000 Berlin und 8000 München Making contact with oscillating components by means of conductive rubber
DE3313887C2 (en) * 1983-04-16 1987-01-15 Stettner & Co, 8560 Lauf, De

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1477780A (en) * 1974-08-14 1977-06-29 Seikosha Kk Assembly incorporating electrically conductive adhesive
DE2622849A1 (en) * 1975-05-19 1976-11-25 Suisse Horlogerie LONGITUDINAL CONNECTING ELEMENT
US4467237A (en) * 1980-06-25 1984-08-21 Commissariat A L'energie Atomique Multielement ultrasonic probe and its production process
DE3313887C2 (en) * 1983-04-16 1987-01-15 Stettner & Co, 8560 Lauf, De
DE8435052U1 (en) * 1984-11-29 1985-03-28 Siemens AG, 1000 Berlin und 8000 München CONVERTER PLATE FOR PIEZOELECTRIC CONVERTER
DE3602487A1 (en) * 1985-01-28 1986-07-31 Sharp K.K., Osaka HEAT-SENSITIVE ADHESIVE CONNECTOR FOR ELECTRICAL CONNECTIONS
DE3504011A1 (en) * 1985-02-06 1986-08-07 Siemens AG, 1000 Berlin und 8000 München Making contact with oscillating components by means of conductive rubber

Non-Patent Citations (6)

* Cited by examiner, † Cited by third party
Title
DE-Z: MÜLLER-DITTMANN, Hansjürgen: Elektrisch leitfähige Elastomere als Kontaktelemente in elektronischen Schaltungen. In: Radio Fernsehen Elektronik, Bd. 28, 1979, H. 9, S. 584,585 *
DE-Z: URBIG, Jürgen, HÖFT, Herbert: Über das Kontaktverhalten elektrisch leitfähiger Elastomere auf Silikonkautschukbasis. In: Radio Fernsehen Elektronik, Bd. 28, 1979, H. 9, S. 586-588 *
JP 55 150286 A. In: Patents Abstracts of Japan, E-45, February 12, 1981, Vol. 5, No. 23 *
JP 61 210686 A. In: Patents Abstracts of Japan, E-479, February 12, 1987, Vol. 11, No. 46 *
US-Z: Chemical Abstracts Vol. 89, 1978, Nr. 6, Ref. 44769z *
US-Z: Chemical Abstracts Vol. 90, 1979, Nr. 22, Ref. 169824r *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19636813C1 (en) * 1996-09-11 1998-01-29 Bosch Gmbh Robert Method of mounting piezoelectric elements on metal surface e.g. in sensor systems
DE19809207C1 (en) * 1998-03-04 1999-08-26 Siemens Ag Structure and manufacturing process of an ultrasonic transducer device with an elastically embedded ultrasonic transducer
DE10112433A1 (en) * 2001-03-15 2002-10-02 Bosch Gmbh Robert Arrangement for measuring properties, e.g. viscosity of liquid, comprises piezoelectric sensor which is immersed in liquid and is electrically connected to exciter and analysis unit

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Legal Events

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