DE3814054C2 - - Google Patents
Info
- Publication number
- DE3814054C2 DE3814054C2 DE19883814054 DE3814054A DE3814054C2 DE 3814054 C2 DE3814054 C2 DE 3814054C2 DE 19883814054 DE19883814054 DE 19883814054 DE 3814054 A DE3814054 A DE 3814054A DE 3814054 C2 DE3814054 C2 DE 3814054C2
- Authority
- DE
- Germany
- Prior art keywords
- force
- semiconductor material
- base body
- side edges
- absorbing element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000463 material Substances 0.000 claims description 16
- 239000004065 semiconductor Substances 0.000 claims description 16
- 239000013078 crystal Substances 0.000 claims description 10
- 238000005530 etching Methods 0.000 description 16
- 238000010521 absorption reaction Methods 0.000 description 8
- 230000035945 sensitivity Effects 0.000 description 7
- 230000001133 acceleration Effects 0.000 description 4
- 239000012528 membrane Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000007704 transition Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- 208000031872 Body Remains Diseases 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 108090000623 proteins and genes Proteins 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/12—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance
- G01P15/123—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance by piezo-resistive elements, e.g. semiconductor strain gauges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/18—Measuring force or stress, in general using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Pressure Sensors (AREA)
- Force Measurement Appropriate To Specific Purposes (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19883814054 DE3814054A1 (de) | 1988-04-26 | 1988-04-26 | Auf die einwirkung einer kraft ansprechender sensor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19883814054 DE3814054A1 (de) | 1988-04-26 | 1988-04-26 | Auf die einwirkung einer kraft ansprechender sensor |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3814054A1 DE3814054A1 (de) | 1989-11-09 |
DE3814054C2 true DE3814054C2 (enrdf_load_stackoverflow) | 1990-12-13 |
Family
ID=6352904
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19883814054 Granted DE3814054A1 (de) | 1988-04-26 | 1988-04-26 | Auf die einwirkung einer kraft ansprechender sensor |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE3814054A1 (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4334080A1 (de) * | 1993-10-06 | 1995-04-13 | Telefunken Microelectron | Piezoresistive Sensorstruktur |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6691616B2 (en) | 1999-05-07 | 2004-02-17 | Heidelberger Druckmaschinen Ag | Device for detecting the position of a printing plate on a cylinder of a rotary printing machine |
DE19921272A1 (de) * | 1999-05-07 | 2000-11-09 | Heidelberger Druckmasch Ag | Piezokeramische Einspannüberwachung Vorrichtung zur Erfassung einer Druckplattenlage |
CN103921171B (zh) * | 2014-04-17 | 2016-04-06 | 西安交通大学 | 一种大量程压阻式高频响固定式四分量铣削力传感器 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2841312C2 (de) * | 1978-09-22 | 1985-06-05 | Robert Bosch Gmbh, 7000 Stuttgart | Monolithischer Halbleiter-Drucksensor und Verfahren zu dessen Herstellung |
DE3429250C1 (de) * | 1984-08-08 | 1986-03-27 | Texas Instruments Deutschland Gmbh, 8050 Freising | Auf die Einwirkung einer Kraft ansprechender Sensor |
-
1988
- 1988-04-26 DE DE19883814054 patent/DE3814054A1/de active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4334080A1 (de) * | 1993-10-06 | 1995-04-13 | Telefunken Microelectron | Piezoresistive Sensorstruktur |
Also Published As
Publication number | Publication date |
---|---|
DE3814054A1 (de) | 1989-11-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
OP8 | Request for examination as to paragraph 44 patent law | ||
D2 | Grant after examination | ||
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |