DE3784211D1 - Produkt aus kunstharz mit einer oberflaeche, die mit einer anordnung von einer durch mikrodendriten gebundenen metallschicht beschichtbar ist und kunstharz metallaminat daraus. - Google Patents
Produkt aus kunstharz mit einer oberflaeche, die mit einer anordnung von einer durch mikrodendriten gebundenen metallschicht beschichtbar ist und kunstharz metallaminat daraus.Info
- Publication number
- DE3784211D1 DE3784211D1 DE8787309067T DE3784211T DE3784211D1 DE 3784211 D1 DE3784211 D1 DE 3784211D1 DE 8787309067 T DE8787309067 T DE 8787309067T DE 3784211 T DE3784211 T DE 3784211T DE 3784211 D1 DE3784211 D1 DE 3784211D1
- Authority
- DE
- Germany
- Prior art keywords
- synthetic resin
- microdendrite
- coated
- arrangement
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1152—Replicating the surface structure of a sacrificial layer, e.g. for roughening
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
- Y10T428/24521—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness with component conforming to contour of nonplanar surface
- Y10T428/24529—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness with component conforming to contour of nonplanar surface and conforming component on an opposite nonplanar surface
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
- Y10T428/24521—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness with component conforming to contour of nonplanar surface
- Y10T428/24545—Containing metal or metal compound
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
- Y10T428/24595—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness and varying density
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
- Y10T428/24612—Composite web or sheet
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61242174A JPS63103075A (ja) | 1986-10-14 | 1986-10-14 | マイクロ樹枝状体配列を介して結合された金属層で被覆可能とされる表面を有する樹脂製品並びに該金属層被覆樹脂製品 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3784211D1 true DE3784211D1 (de) | 1993-03-25 |
DE3784211T2 DE3784211T2 (de) | 1993-06-03 |
Family
ID=17085415
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8787309067T Expired - Fee Related DE3784211T2 (de) | 1986-10-14 | 1987-10-14 | Produkt aus kunstharz mit einer oberflaeche, die mit einer anordnung von einer durch mikrodendriten gebundenen metallschicht beschichtbar ist und kunstharz metallaminat daraus. |
Country Status (4)
Country | Link |
---|---|
US (1) | US4774122A (de) |
EP (1) | EP0265161B1 (de) |
JP (1) | JPS63103075A (de) |
DE (1) | DE3784211T2 (de) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4867839A (en) * | 1987-09-04 | 1989-09-19 | Shinko Electric Industries Co., Ltd. | Process for forming a circuit substrate |
JPH0634448B2 (ja) * | 1988-07-25 | 1994-05-02 | 株式会社日立製作所 | 多層プリント配線板及びその製造方法 |
JPH0628941B2 (ja) * | 1988-09-20 | 1994-04-20 | 株式会社日立製作所 | 回路基板及びその製造方法 |
US4997516A (en) * | 1989-07-10 | 1991-03-05 | Edward Adler | Method for improving adherence of copper foil to resinous substrates |
US4997722A (en) * | 1989-07-10 | 1991-03-05 | Edward Adler | Composition and method for improving adherence of copper foil to resinous substrates |
US5298685A (en) * | 1990-10-30 | 1994-03-29 | International Business Machines Corporation | Interconnection method and structure for organic circuit boards |
JP2768390B2 (ja) * | 1990-12-11 | 1998-06-25 | インターナショナル・ビジネス・マシーンズ・コーポレイション | 無電解金属付着のために基体をコンディショニングする方法 |
US5238729A (en) * | 1991-04-05 | 1993-08-24 | Minnesota Mining And Manufacturing Company | Sensors based on nanosstructured composite films |
US5336558A (en) * | 1991-06-24 | 1994-08-09 | Minnesota Mining And Manufacturing Company | Composite article comprising oriented microstructures |
US5517758A (en) * | 1992-05-29 | 1996-05-21 | Matsushita Electric Industrial Co., Ltd. | Plating method and method for producing a multi-layered printed wiring board using the same |
SE470277B (sv) * | 1992-11-06 | 1993-12-20 | Metfoils Ab | Förfarande vid mönsterkortstillverkning samt användning därvid |
US5362534A (en) * | 1993-08-23 | 1994-11-08 | Parlex Corporation | Multiple layer printed circuit boards and method of manufacture |
US5376232A (en) * | 1993-08-23 | 1994-12-27 | Parlex Corporation | Method of manufacturing a printed circuit board |
EP0954620A4 (de) * | 1997-01-16 | 2002-01-02 | Bottomfield Layne F | Dampfphasenabscheidungskomponente und entsprechende verfahren |
US6141870A (en) | 1997-08-04 | 2000-11-07 | Peter K. Trzyna | Method for making electrical device |
KR100248054B1 (ko) * | 1997-08-14 | 2000-03-15 | 윤종용 | 솔더링을 이용한 광섬유어레이 모듈 및 그 제작방법 |
EP0899053A3 (de) | 1997-08-29 | 2000-04-05 | Sintokogio Ltd. | Plattiertes Produkt und Verfahren und Vorrichtung zu dessen Herstellung |
JP4957552B2 (ja) * | 2005-09-30 | 2012-06-20 | 住友ベークライト株式会社 | プリント配線板用キャリア付きプリプレグの製造方法、プリント配線板用キャリア付きプリプレグ、プリント配線板用薄型両面板の製造方法、プリント配線板用薄型両面板、及び多層プリント配線板の製造方法 |
FR2996491A1 (fr) * | 2012-10-08 | 2014-04-11 | Europ Aeronautic Defence Ans Space Company Eads France | Procede de realisation de pieces composites thermodurcissables par drapage de materiau preimpregne |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US29820A (en) * | 1860-08-28 | Of richmond | ||
US1963834A (en) * | 1933-01-14 | 1934-06-19 | Moto Mcter Gauge & Equipment C | Method of ornamentation |
BE529729A (de) * | 1953-06-19 | 1900-01-01 | ||
US3585010A (en) * | 1968-10-03 | 1971-06-15 | Clevite Corp | Printed circuit board and method of making same |
JPS49348B1 (de) * | 1970-12-25 | 1974-01-07 | ||
BE789715A (fr) * | 1971-10-08 | 1973-02-01 | Yates Industries | Traitement de feuilles de cuivre en plusieurs couches |
US3864147A (en) * | 1972-09-25 | 1975-02-04 | Macdermid Inc | Method of improving the bonding capability of polymer surfaces for subsequently applied coatings, and products thereof |
JPS5123266B2 (de) * | 1972-04-21 | 1976-07-15 | ||
US3956041A (en) * | 1972-07-11 | 1976-05-11 | Kollmorgen Corporation | Transfer coating process for manufacture of printing circuits |
FR2193363A5 (en) * | 1972-07-17 | 1974-02-15 | Dodge Ind Inc | Sheet bonding - using stepped cross-section in metal sheeting for heat/pre-assure roller bonding |
US4087300A (en) * | 1974-01-07 | 1978-05-02 | Edward Adler | Process for producing metal-plastic laminate |
US3984598A (en) * | 1974-02-08 | 1976-10-05 | Universal Oil Products Company | Metal-clad laminates |
US4354895A (en) * | 1981-11-27 | 1982-10-19 | International Business Machines Corporation | Method for making laminated multilayer circuit boards |
US4448804A (en) * | 1983-10-11 | 1984-05-15 | International Business Machines Corporation | Method for selective electroless plating of copper onto a non-conductive substrate surface |
GB8333753D0 (en) * | 1983-12-19 | 1984-01-25 | Thorpe J E | Dielectric boards |
JPS6142993A (ja) * | 1984-08-07 | 1986-03-01 | 三菱電機株式会社 | 樹脂への導体層形成方法 |
-
1986
- 1986-10-14 JP JP61242174A patent/JPS63103075A/ja active Pending
-
1987
- 1987-02-26 US US07/019,239 patent/US4774122A/en not_active Expired - Fee Related
- 1987-10-14 EP EP87309067A patent/EP0265161B1/de not_active Expired - Lifetime
- 1987-10-14 DE DE8787309067T patent/DE3784211T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0265161A3 (en) | 1988-09-21 |
DE3784211T2 (de) | 1993-06-03 |
EP0265161A2 (de) | 1988-04-27 |
JPS63103075A (ja) | 1988-05-07 |
EP0265161B1 (de) | 1993-02-17 |
US4774122A (en) | 1988-09-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |