DE3778937D1 - Verfahren zur lotnivellierung in einem beschalteten substrat. - Google Patents

Verfahren zur lotnivellierung in einem beschalteten substrat.

Info

Publication number
DE3778937D1
DE3778937D1 DE8787103052T DE3778937T DE3778937D1 DE 3778937 D1 DE3778937 D1 DE 3778937D1 DE 8787103052 T DE8787103052 T DE 8787103052T DE 3778937 T DE3778937 T DE 3778937T DE 3778937 D1 DE3778937 D1 DE 3778937D1
Authority
DE
Germany
Prior art keywords
leveling
lot
wired substrate
wired
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8787103052T
Other languages
English (en)
Inventor
Russell Elwood Darrow
Alan James Emerick
John David Larnerd
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE3778937D1 publication Critical patent/DE3778937D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09472—Recessed pad for surface mounting; Recessed electrode of component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H05K2201/10303—Pin-in-hole mounted pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/044—Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Multi-Conductor Connections (AREA)
DE8787103052T 1986-03-10 1987-03-04 Verfahren zur lotnivellierung in einem beschalteten substrat. Expired - Fee Related DE3778937D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/837,817 US4676426A (en) 1986-03-10 1986-03-10 Solder leveling technique

Publications (1)

Publication Number Publication Date
DE3778937D1 true DE3778937D1 (de) 1992-06-17

Family

ID=25275521

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8787103052T Expired - Fee Related DE3778937D1 (de) 1986-03-10 1987-03-04 Verfahren zur lotnivellierung in einem beschalteten substrat.

Country Status (4)

Country Link
US (1) US4676426A (de)
EP (1) EP0236926B1 (de)
JP (1) JPS62211991A (de)
DE (1) DE3778937D1 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2598055B1 (fr) * 1986-04-28 1990-08-31 Talco Sa Procede de brasage de composants de surface sur un circuit imprime
US4799616A (en) * 1986-06-11 1989-01-24 International Business Machines Corporation Solder leveling method and apparatus
DE3708902C3 (de) * 1987-03-19 2000-05-04 Dbt Gmbh Steuereinheit für elektrohydraulische Ausbausteuerungen
US5159171A (en) * 1991-09-03 1992-10-27 Motorola, Inc. Method and apparatus for solder laser printing
US5548486A (en) * 1994-01-21 1996-08-20 International Business Machines Corporation Pinned module
US5878483A (en) * 1995-06-01 1999-03-09 International Business Machines Corporation Hammer for forming bulges in an array of compliant pin blanks
JP2013089313A (ja) * 2011-10-13 2013-05-13 Tyco Electronics Japan Kk コネクタ

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3058441A (en) * 1956-10-02 1962-10-16 Sanders Associates Inc Soldering apparatus and method of soldering electrical conductors
US3834015A (en) * 1973-01-29 1974-09-10 Philco Ford Corp Method of forming electrical connections
US4083323A (en) * 1975-08-07 1978-04-11 Xerox Corporation Pneumatic system for solder leveling apparatus
US4101066A (en) * 1977-08-31 1978-07-18 Western Electric Co., Inc. Soldering method and apparatus utilizing dual solder waves of different variable velocities
US4401253A (en) * 1978-04-18 1983-08-30 Cooper Industries, Inc. Mass soldering system
US4196839A (en) * 1978-06-29 1980-04-08 International Telephone And Telegraph Corporation Methods of fabricating printed circuit boards
US4410126A (en) * 1978-10-12 1983-10-18 Cooper Industries, Inc. Mass soldering system
US4402448A (en) * 1978-10-12 1983-09-06 Cooper Industries, Inc. Mass soldering system
US4311266A (en) * 1978-12-25 1982-01-19 Kenshi Kondo Soldering apparatus
SE417566B (sv) * 1979-07-11 1981-03-23 Ericsson Telefon Ab L M Anordning for rengoring av kretskort serskilt for att avlegsna lod- och hartsrester
CH641708A5 (de) * 1979-11-02 1984-03-15 Sinter Ltd Vorrichtung zum aufbringen von lot auf leiterplatten.
CH656769A5 (de) * 1980-09-09 1986-07-15 Sinter Ltd Vorrichtung zum aufbringen von lot auf leiterplatten.
EP0055323B1 (de) * 1980-12-26 1987-11-11 Matsushita Electric Industrial Co., Ltd. Einrichtung zum Löten von chipartigen Bauteilen
DE3175787D1 (en) * 1981-04-15 1987-02-05 Siemens Ag Albis Method and apparatus for the removal of solder from drilled holes of non furnished printed-circuit boards clad with solder
JPS6051939B2 (ja) * 1981-06-02 1985-11-16 権士 近藤 噴流式はんだ槽
US4463891A (en) * 1981-11-18 1984-08-07 Rca Corporation Wave soldering apparatus and method
US4530457A (en) * 1982-01-12 1985-07-23 Electrovert Ltd. Wave-soldering of printed circuit boards
JPS58184868U (ja) * 1982-06-04 1983-12-08 株式会社日立製作所 過剰ハンダ除去装置

Also Published As

Publication number Publication date
JPS62211991A (ja) 1987-09-17
US4676426A (en) 1987-06-30
EP0236926A1 (de) 1987-09-16
JPH0419680B2 (de) 1992-03-31
EP0236926B1 (de) 1992-05-13

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee