DE3770449D1 - Schwalloetgeraet mit fingerschirm. - Google Patents

Schwalloetgeraet mit fingerschirm.

Info

Publication number
DE3770449D1
DE3770449D1 DE8787905532T DE3770449T DE3770449D1 DE 3770449 D1 DE3770449 D1 DE 3770449D1 DE 8787905532 T DE8787905532 T DE 8787905532T DE 3770449 T DE3770449 T DE 3770449T DE 3770449 D1 DE3770449 D1 DE 3770449D1
Authority
DE
Germany
Prior art keywords
umbrella
finger
flooding device
flooding
finger umbrella
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8787905532T
Other languages
English (en)
Inventor
John Popielarski
Darhol Thomas
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Unisys Corp
Original Assignee
Unisys Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Unisys Corp filed Critical Unisys Corp
Application granted granted Critical
Publication of DE3770449D1 publication Critical patent/DE3770449D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/06—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for positioning the molten material, e.g. confining it to a desired area
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0557—Non-printed masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
DE8787905532T 1986-08-15 1987-08-12 Schwalloetgeraet mit fingerschirm. Expired - Fee Related DE3770449D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/896,703 US4717064A (en) 1986-08-15 1986-08-15 Wave solder finger shield apparatus
PCT/US1987/001949 WO1988001217A1 (en) 1986-08-15 1987-08-12 Wave solder finger shield apparatus

Publications (1)

Publication Number Publication Date
DE3770449D1 true DE3770449D1 (de) 1991-07-04

Family

ID=25406677

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8787905532T Expired - Fee Related DE3770449D1 (de) 1986-08-15 1987-08-12 Schwalloetgeraet mit fingerschirm.

Country Status (7)

Country Link
US (1) US4717064A (de)
EP (1) EP0277209B1 (de)
JP (1) JPH0683893B2 (de)
KR (1) KR910001001B1 (de)
CA (1) CA1263896A (de)
DE (1) DE3770449D1 (de)
WO (1) WO1988001217A1 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5611475A (en) * 1986-07-11 1997-03-18 Sun Industrial Coatings Private Ltd. Soldering apparatus
US4981248A (en) * 1989-06-20 1991-01-01 Digital Equipment Corporation Electronically controlled wave solder mask shield
US5292055A (en) * 1991-12-06 1994-03-08 Electrovert Ltd. Gas shrouded wave improvement
US6123251A (en) * 1999-11-15 2000-09-26 Unisys Corporation Apparatus and method for soldering
US6223973B1 (en) * 1999-11-16 2001-05-01 Visteon Global Technologies, Inc. Apparatus and method for connecting printed circuit boards through soldered lap joints
JP2002113570A (ja) * 2000-10-05 2002-04-16 Sony Corp 自動はんだ付け装置
CN1784807B (zh) 2003-03-04 2013-03-20 诺福特罗尼有限公司 同轴波导微结构及其形成方法
US7656256B2 (en) 2006-12-30 2010-02-02 Nuvotronics, PLLC Three-dimensional microstructures having an embedded support member with an aperture therein and method of formation thereof
KR101593686B1 (ko) 2007-03-20 2016-02-12 누보트로닉스, 엘.엘.씨 일체화된 전자 요소들 및 이들의 형성 방법
US20110123783A1 (en) 2009-11-23 2011-05-26 David Sherrer Multilayer build processses and devices thereof
US8866300B1 (en) * 2011-06-05 2014-10-21 Nuvotronics, Llc Devices and methods for solder flow control in three-dimensional microstructures
WO2013010108A1 (en) 2011-07-13 2013-01-17 Nuvotronics, Llc Methods of fabricating electronic and mechanical structures
US9325044B2 (en) 2013-01-26 2016-04-26 Nuvotronics, Inc. Multi-layer digital elliptic filter and method
US9306255B1 (en) 2013-03-15 2016-04-05 Nuvotronics, Inc. Microstructure including microstructural waveguide elements and/or IC chips that are mechanically interconnected to each other
US9306254B1 (en) 2013-03-15 2016-04-05 Nuvotronics, Inc. Substrate-free mechanical interconnection of electronic sub-systems using a spring configuration
US10310009B2 (en) 2014-01-17 2019-06-04 Nuvotronics, Inc Wafer scale test interface unit and contactors
US9296056B2 (en) 2014-07-08 2016-03-29 International Business Machines Corporation Device for thermal management of surface mount devices during reflow soldering
US10847469B2 (en) 2016-04-26 2020-11-24 Cubic Corporation CTE compensation for wafer-level and chip-scale packages and assemblies
US10511073B2 (en) 2014-12-03 2019-12-17 Cubic Corporation Systems and methods for manufacturing stacked circuits and transmission lines
US10319654B1 (en) 2017-12-01 2019-06-11 Cubic Corporation Integrated chip scale packages

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1102621A (en) * 1965-04-07 1968-02-07 Electrovert Mfg Company Ltd Method and apparatus for fluxing and soldering connections on printed circuit boards
US3616984A (en) * 1970-01-14 1971-11-02 Bunker Ramo Automatic soldering machine having circuit board protection member
US3849870A (en) * 1971-06-15 1974-11-26 Amp Inc Method of fabricating selectively applied flowable solder joints
JPS52264A (en) * 1975-06-21 1977-01-05 Kyorin Pharmaceut Co Ltd Process for preparing novel isoxazole derivatives
US4447001A (en) * 1980-12-11 1984-05-08 Banner/Technical Devices Company, Inc. Adjustably dimensioned uniformly distributed solder wave apparatus
US4632291A (en) * 1983-02-28 1986-12-30 Electrovert Ltd. Automatic wave soldering machine
US4527731A (en) * 1983-03-31 1985-07-09 At&T Technologies, Inc. Method and apparatus for applying stripes of solder to articles
US4545520A (en) * 1983-08-30 1985-10-08 At&T Technologies, Inc. Method and system for soldering insulation coated parts

Also Published As

Publication number Publication date
CA1263896A (en) 1989-12-12
KR910001001B1 (ko) 1991-02-19
JPH01500888A (ja) 1989-03-30
WO1988001217A1 (en) 1988-02-25
EP0277209B1 (de) 1991-05-29
JPH0683893B2 (ja) 1994-10-26
KR880701609A (ko) 1988-11-04
US4717064A (en) 1988-01-05
EP0277209A1 (de) 1988-08-10

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee