DE3763695D1 - Halbleiterbauelement und uebereinstimmendes verkapselungsverfahren. - Google Patents

Halbleiterbauelement und uebereinstimmendes verkapselungsverfahren.

Info

Publication number
DE3763695D1
DE3763695D1 DE8787400298T DE3763695T DE3763695D1 DE 3763695 D1 DE3763695 D1 DE 3763695D1 DE 8787400298 T DE8787400298 T DE 8787400298T DE 3763695 T DE3763695 T DE 3763695T DE 3763695 D1 DE3763695 D1 DE 3763695D1
Authority
DE
Germany
Prior art keywords
semiconductor component
enclosure method
matching enclosure
matching
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8787400298T
Other languages
English (en)
Inventor
Lucien Barre
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Application granted granted Critical
Publication of DE3763695D1 publication Critical patent/DE3763695D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/492—Bases or plates or solder therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10174—Diode
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/046—Means for drawing solder, e.g. for removing excess solder from pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
DE8787400298T 1986-02-14 1987-02-10 Halbleiterbauelement und uebereinstimmendes verkapselungsverfahren. Expired - Fee Related DE3763695D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8602054A FR2594598B1 (fr) 1986-02-14 1986-02-14 Composant semiconducteur et procede d'encapsulation correspondant

Publications (1)

Publication Number Publication Date
DE3763695D1 true DE3763695D1 (de) 1990-08-23

Family

ID=9332153

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8787400298T Expired - Fee Related DE3763695D1 (de) 1986-02-14 1987-02-10 Halbleiterbauelement und uebereinstimmendes verkapselungsverfahren.

Country Status (3)

Country Link
EP (1) EP0235025B1 (de)
DE (1) DE3763695D1 (de)
FR (1) FR2594598B1 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0359856B1 (de) * 1988-04-09 1993-12-22 Georg Sillner Verfahren sowie Vorrichtung zum Umformen von Zylindrischen elektrischen Bauteilen

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2351997A1 (de) * 1973-10-17 1975-04-30 Licentia Gmbh Mit kunststoff umhuellter halbleiter mit mindestens drei flaechenhaften anschlusselementen

Also Published As

Publication number Publication date
EP0235025A1 (de) 1987-09-02
EP0235025B1 (de) 1990-07-18
FR2594598A1 (fr) 1987-08-21
FR2594598B1 (fr) 1988-04-29

Similar Documents

Publication Publication Date Title
KR870011686A (ko) 반도체장치 및 그 제조방법
DE3687795D1 (de) Halbleiterbehandlungsvorrichtung.
DE3776106D1 (de) Doppelplasma-mikrowellengeraet und oberflaechenbearbeitungsverfahren.
DE3689538D1 (de) Integrierte Schaltung und Optimierungsverfahren dafür.
DE3773624D1 (de) Geraet sowie anschlussteil dafuer.
DE3782991D1 (de) Cvd-verfahren und vorrichtung.
KR890700922A (ko) 반도체 장치와 그 제조방법
KR880013254A (ko) 반도체장치 및 그 제조방법
DE3789826D1 (de) MOS-Halbleiteranordnung und Herstellungsverfahren.
IT8722659A0 (it) Dispositivo semiconduttore e metodo di fabbricazione dello stesso.
KR880701473A (ko) 영처리 수신장치 및 그 방법
DE3773957D1 (de) Halbleitervorrichtung.
IT8720296A0 (it) Procedimento e dispositivo per cordonare.
KR890004398A (ko) 반도체장치 및 그의 제조방법
KR870008394A (ko) 반도체장치 및 그 제조방법
DE3783507T2 (de) Zusammengesetztes halbleiterbauelement.
KR880700714A (ko) 다단식 연마장치 및 방법
KR880701968A (ko) 반도체장치 및 그 제조방법
NO872951D0 (no) Fremgangsmaate og anordning for orientering av boks-ender.
KR880701017A (ko) 반도체 장치
DE3788589T2 (de) Lötverfahren und Gerät.
NO165421C (no) Fremgangsmaate og anordning for avskinning.
DE3579235D1 (de) Halbleiteranordnung und einrichtung.
DE3886337D1 (de) Halbleiteranordnungen und Herstellungsverfahren.
DE3763695D1 (de) Halbleiterbauelement und uebereinstimmendes verkapselungsverfahren.

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee