DE3724996A1 - Filling of a volume with a resin or adhesive - Google Patents
Filling of a volume with a resin or adhesiveInfo
- Publication number
- DE3724996A1 DE3724996A1 DE19873724996 DE3724996A DE3724996A1 DE 3724996 A1 DE3724996 A1 DE 3724996A1 DE 19873724996 DE19873724996 DE 19873724996 DE 3724996 A DE3724996 A DE 3724996A DE 3724996 A1 DE3724996 A1 DE 3724996A1
- Authority
- DE
- Germany
- Prior art keywords
- filling
- adhesive
- resin
- volume
- ultrasonic vibration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/22—Component parts, details or accessories; Auxiliary operations
- B29C39/26—Moulds or cores
- B29C39/34—Moulds or cores for undercut articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/52—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive
- B29C65/54—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive between pre-assembled parts
- B29C65/546—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive between pre-assembled parts by gravity, e.g. by pouring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B3/00—Packaging plastic material, semiliquids, liquids or mixed solids and liquids, in individual containers or receptacles, e.g. bags, sacks, boxes, cartons, cans, or jars
- B65B3/04—Methods of, or means for, filling the material into the containers or receptacles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2791/00—Shaping characteristics in general
- B29C2791/004—Shaping under special conditions
- B29C2791/008—Using vibrations during moulding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
- B29C65/483—Reactive adhesives, e.g. chemically curing adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/4865—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding containing additives
Abstract
Description
Die Erfindung betrifft ein Verfahren zur schnellen Füllung eines Volumens mit einem Harz bzw. zur Füllung einer Fuge mit Klebstoff.The invention relates to a method for rapid filling of a volume with a resin or for filling a joint with Adhesive.
Derartige Aufgaben ergeben sich insbesondere bei der Applika tion von Klebstoffen in Klebefugen aber auch beim Vergießen von Bauteilen, Körpern, Schaltungen usw. Bei nur einseitig zugäng lichen, dünnen Klebefugen ist die kapillarische Füllung ange zeigt.Such tasks arise particularly in the case of the applica tion of adhesives in adhesive joints but also when casting Components, bodies, circuits etc. With only one-sided access The capillary filling is suitable for thin, thin adhesive joints shows.
Unter Kapillarität versteht man die Erscheinung, daß eine Flüs sigkeit in einer engen Röhre höher oder tiefer steht als die Flüssigkeit in dem größeren Gefäß, in das das offene Röhrchen eintaucht, je nachdem, ob es sich um eine die Rohrwand benetzen de oder nicht benetzende Flüssigkeit handelt. Die maximal er reichbare Füllhöhe und Füllgeschwindigkeit ist abhängig von der Differenz zwischen der Oberflächenspannung, zum Beispiel des Klebstoffs, und der freien, spezifischen Oberflächenenergie der Fügeteile sowie von der Viskosität des Klebstoffs.Capillarity means the phenomenon that a river liquid in a narrow tube is higher or lower than that Liquid in the larger vessel into which the open tube is located immersed, depending on whether it is a wet the pipe wall de or non-wetting liquid. The maximum he achievable fill level and fill speed depends on the Difference between the surface tension, for example the Adhesive, and the free, specific surface energy of the Joined parts and the viscosity of the adhesive.
Zur Steigerung der Füllhöhe und Füllgeschwindigkeit durch Vis kositätserniedrigung werden häufig Fügeteile und/oder ein Harz bzw. der Klebstoff erwärmt. Hierdurch kann aber zum einen die Aushärtereaktion des Klebstoffs beschleunigt werden. Zum ande ren ändern sich die geometrischen Abmaße bei Fügeteilen mit un terschiedlichen Wärmeausdehnungsverhalten. Bei höher viskosen bzw. gefüllten Klebstoffen ist eine Kapillarfüllung auch bei Erwärmung nur schwer möglich.To increase the filling height and filling speed by Vis Lowers the joint and / or a resin or the adhesive warms up. As a result, however, the The curing reaction of the adhesive can be accelerated. To the other The geometric dimensions of the parts to be joined change with un different thermal expansion behavior. At higher viscous or filled adhesives is also a capillary filling Warming is difficult.
Der Erfindung liegt die Aufgabe zugrunde, das eingangs beschrie bene Verfahren zu konzipieren, um zum Beispiel Füll-, Klebe oder Vergußvorgänge zu beschleunigen bzw. um sie überhaupt erst ohne Erwärmung zu ermöglichen.The invention is based, described above bene to design processes such as filling, gluing or to accelerate potting processes, or to accelerate them in the first place without allowing warming.
Diese Aufgabe wird erfindungsgemäß durch das Merkmal des kenn zeichnenden Teils des Anspruchs 1 gelöst. Vorteilhafte Ausfüh rungsformen und Weiterbildungen der Erfindung sind in den Unter ansprüchen angegeben.This object is achieved by the feature of the kenn drawing part of claim 1 solved. Advantageous execution Forms and developments of the invention are in the sub claims specified.
Der Effekt nach der Erfindung beruht auf dem struktur-viskosen Viskositätsverhalten von gefüllten bzw. ungefüllten Harzen und Klebstoffen. Die Ultraschall-Energie führt im Klebstoff zu einer sofortigen und erheblichen Viskositätserniedrigung, ohne daß makroskopische Erwärmungen der Fügeteile oder eine beginnen de Vernetzungsreaktion zu beobachten sind.The effect according to the invention is based on the structurally viscous Viscosity behavior of filled or unfilled resins and Adhesives. The ultrasound energy leads in the adhesive an immediate and significant reduction in viscosity without that macroscopic heating of the parts to be joined or one begins de crosslinking reaction can be observed.
Die Kapillarfüllung eines Ringspalts von 150 µm Dicke (Da = 1,9 mm, Di = 1,6 mm) und 13 mm Länge konnte mit Ultraschall-An regung des Fügeteils bei einem quarzgefüllten Epoxid-Klebstoff (η = 6,7 Pas bei RT) in kleiner 30 Sekunden erreicht werden, während die Füllung bei auf 70°C erwärmten Fügeteilen ohne Ul traschallanregung ca. 10 Minuten dauert. Die Frequenz der Ul traschall-Anregung betrug bei diesem Ausführungsbeispiel 20 kHz, die Amplitude ca. 10 µm und die Anpreßkraft der Sonotrode an das Teil ca. 10 N. Die Schwingungsankopplung erfolgte parallel oder in axialer Richtung zum Ringspalt. Zwischen beiden Richtun gen war kein Unterschied in der Wirkung feststellbar.The capillary filling of an annular gap 150 µm thick (Da = 1.9 mm, Di = 1.6 mm) and 13 mm long could be ultrasonically stimulated with a quartz-filled epoxy adhesive ( η = 6.7 Pas at RT ) can be reached in less than 30 seconds, while the filling takes about 10 minutes when the parts are heated to 70 ° C without ultrasonic excitation. The frequency of the ultrasonic excitation was 20 kHz in this exemplary embodiment, the amplitude was approximately 10 μm and the contact force of the sonotrode on the part was approximately 10 N. The oscillation coupling took place parallel or in the axial direction to the annular gap. There was no difference in effect between the two directions.
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19873724996 DE3724996C2 (en) | 1987-07-28 | 1987-07-28 | METHOD FOR QUICKLY FILLING A NARROW SPACE WITH A FLOWABLE RESIN |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19873724996 DE3724996C2 (en) | 1987-07-28 | 1987-07-28 | METHOD FOR QUICKLY FILLING A NARROW SPACE WITH A FLOWABLE RESIN |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3724996A1 true DE3724996A1 (en) | 1989-02-09 |
DE3724996C2 DE3724996C2 (en) | 1993-11-04 |
Family
ID=6332538
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19873724996 Expired - Fee Related DE3724996C2 (en) | 1987-07-28 | 1987-07-28 | METHOD FOR QUICKLY FILLING A NARROW SPACE WITH A FLOWABLE RESIN |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE3724996C2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1795959A1 (en) * | 2005-10-18 | 2007-06-13 | Canon Kabushiki Kaisha | Imprint method, imprint apparatus, and process for producing chip |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DD36104A (en) * | ||||
DE876909C (en) * | 1944-02-06 | 1953-05-18 | Siemens Ag | Process and injection molding device for the production of moldings from organic, powdery molding compounds |
GB1395468A (en) * | 1972-08-26 | 1975-05-29 | Nippon Steel Corp | Method and apparatus for forming by vibration a refractory lining of a container for a molten metal |
-
1987
- 1987-07-28 DE DE19873724996 patent/DE3724996C2/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DD36104A (en) * | ||||
DE876909C (en) * | 1944-02-06 | 1953-05-18 | Siemens Ag | Process and injection molding device for the production of moldings from organic, powdery molding compounds |
GB1395468A (en) * | 1972-08-26 | 1975-05-29 | Nippon Steel Corp | Method and apparatus for forming by vibration a refractory lining of a container for a molten metal |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1795959A1 (en) * | 2005-10-18 | 2007-06-13 | Canon Kabushiki Kaisha | Imprint method, imprint apparatus, and process for producing chip |
EP2073059A1 (en) | 2005-10-18 | 2009-06-24 | Canon Kabushiki Kaisha | Imprint method, imprint apparatus, and process for producing chip |
US7828984B2 (en) | 2005-10-18 | 2010-11-09 | Canon Kabushiki Kaisha | Imprint method, imprint apparatus, and process for producing chip |
CN1952777B (en) * | 2005-10-18 | 2010-11-17 | 佳能株式会社 | Imprint method, imprint apparatus, and process for producing chip |
US9507256B2 (en) | 2005-10-18 | 2016-11-29 | Canon Kabushiki Kaisha | Imprint method, imprint apparatus, and process for producing chip |
Also Published As
Publication number | Publication date |
---|---|
DE3724996C2 (en) | 1993-11-04 |
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Legal Events
Date | Code | Title | Description |
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OM8 | Search report available as to paragraph 43 lit. 1 sentence 1 patent law | ||
8110 | Request for examination paragraph 44 | ||
D2 | Grant after examination | ||
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |