DE3703582C1 - Bestrahlungsmaske zur lithographischen Erzeugung von Mustern - Google Patents
Bestrahlungsmaske zur lithographischen Erzeugung von MusternInfo
- Publication number
- DE3703582C1 DE3703582C1 DE3703582A DE3703582A DE3703582C1 DE 3703582 C1 DE3703582 C1 DE 3703582C1 DE 3703582 A DE3703582 A DE 3703582A DE 3703582 A DE3703582 A DE 3703582A DE 3703582 C1 DE3703582 C1 DE 3703582C1
- Authority
- DE
- Germany
- Prior art keywords
- carrier layer
- radiation
- irradiation mask
- patterns
- mask
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000005855 radiation Effects 0.000 claims description 17
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 238000001015 X-ray lithography Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- 229910001374 Invar Inorganic materials 0.000 description 1
- 206010073150 Multiple endocrine neoplasia Type 1 Diseases 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002164 ion-beam lithography Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/22—Masks or mask blanks for imaging by radiation of 100nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Electron Beam Exposure (AREA)
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE3703582A DE3703582C1 (de) | 1987-02-06 | 1987-02-06 | Bestrahlungsmaske zur lithographischen Erzeugung von Mustern |
| DE8717448U DE8717448U1 (de) | 1987-02-06 | 1987-02-06 | Bestrahlungsmaske zur lithographischen Erzeugung von Mustern |
| DE8787117249T DE3785331D1 (de) | 1987-02-06 | 1987-11-24 | Bestrahlungsmaske zur lithographischen erzeugung von mustern. |
| EP87117249A EP0278076B1 (de) | 1987-02-06 | 1987-11-24 | Bestrahlungsmaske zur lithographischen Erzeugung von Mustern |
| JP63024066A JPS63202022A (ja) | 1987-02-06 | 1988-02-05 | リゾグラフイによるパターンの形成のための露光マスク |
| US07/155,070 US4950568A (en) | 1987-02-06 | 1988-02-08 | Radiation mask for the lithographic production of patterns |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE3703582A DE3703582C1 (de) | 1987-02-06 | 1987-02-06 | Bestrahlungsmaske zur lithographischen Erzeugung von Mustern |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE3703582C1 true DE3703582C1 (de) | 1988-04-07 |
Family
ID=6320354
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE3703582A Expired DE3703582C1 (de) | 1987-02-06 | 1987-02-06 | Bestrahlungsmaske zur lithographischen Erzeugung von Mustern |
| DE8717448U Expired DE8717448U1 (de) | 1987-02-06 | 1987-02-06 | Bestrahlungsmaske zur lithographischen Erzeugung von Mustern |
| DE8787117249T Expired - Fee Related DE3785331D1 (de) | 1987-02-06 | 1987-11-24 | Bestrahlungsmaske zur lithographischen erzeugung von mustern. |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE8717448U Expired DE8717448U1 (de) | 1987-02-06 | 1987-02-06 | Bestrahlungsmaske zur lithographischen Erzeugung von Mustern |
| DE8787117249T Expired - Fee Related DE3785331D1 (de) | 1987-02-06 | 1987-11-24 | Bestrahlungsmaske zur lithographischen erzeugung von mustern. |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US4950568A (enExample) |
| EP (1) | EP0278076B1 (enExample) |
| JP (1) | JPS63202022A (enExample) |
| DE (3) | DE3703582C1 (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1089128A3 (en) * | 1999-09-30 | 2001-05-02 | Kabushiki Kaisha Toshiba | Exposure mask, exposure mask manufacturing method, and semiconductor device manufacturing method using exposure mask |
| US7063921B2 (en) | 2002-09-27 | 2006-06-20 | Infineon Technologies Ag | Photomask, in particular alternating phase shift mask, with compensation structure |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2796552B2 (ja) * | 1988-12-12 | 1998-09-10 | 日本電信電話株式会社 | X線リソグラフィー用マスク |
| US5155749A (en) * | 1991-03-28 | 1992-10-13 | International Business Machines Corporation | Variable magnification mask for X-ray lithography |
| JPH0567561A (ja) * | 1991-09-10 | 1993-03-19 | Canon Inc | X線マスク基板とその製造方法およびx線マスク |
| JP2746098B2 (ja) * | 1994-01-19 | 1998-04-28 | 日本電気株式会社 | 電子ビーム描画用アパーチャおよび電子ビーム描画方法 |
| US5951881A (en) * | 1996-07-22 | 1999-09-14 | President And Fellows Of Harvard College | Fabrication of small-scale cylindrical articles |
| US6753131B1 (en) | 1996-07-22 | 2004-06-22 | President And Fellows Of Harvard College | Transparent elastomeric, contact-mode photolithography mask, sensor, and wavefront engineering element |
| JP2007024589A (ja) * | 2005-07-13 | 2007-02-01 | Hitachi Ltd | 気体流量計測装置 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3150056A1 (de) * | 1980-12-17 | 1982-07-15 | Westinghouse Electric Corp., 15222 Pittsburgh, Pa. | "maske zur verwendung bei lithopraphischen verfahren" |
| DE3232499A1 (de) * | 1982-09-01 | 1984-03-01 | Philips Patentverwaltung Gmbh, 2000 Hamburg | Maske fuer die mustererzeugung in lackschichten mittels roentgenstrahllithographie und verfahren zu ihrer herstellung |
| DE3427449A1 (de) * | 1983-07-27 | 1985-02-07 | Mitsubishi Denki K.K., Tokio/Tokyo | Maske fuer die roentgenstrahllithographie |
| DE3425063A1 (de) * | 1984-07-07 | 1986-02-06 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Maske fuer die roentgenlithographie |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5321271B2 (enExample) * | 1972-09-14 | 1978-07-01 | ||
| JPS54141571A (en) * | 1978-04-26 | 1979-11-02 | Dainippon Printing Co Ltd | Mask for soft xxray lithograph |
| US4260670A (en) * | 1979-07-12 | 1981-04-07 | Western Electric Company, Inc. | X-ray mask |
| JPS59191332A (ja) * | 1983-04-14 | 1984-10-30 | Seiko Epson Corp | X線マスク |
| GB8723000D0 (en) * | 1987-09-30 | 1987-11-04 | Antibioticos Sa | Expression vectors |
-
1987
- 1987-02-06 DE DE3703582A patent/DE3703582C1/de not_active Expired
- 1987-02-06 DE DE8717448U patent/DE8717448U1/de not_active Expired
- 1987-11-24 EP EP87117249A patent/EP0278076B1/de not_active Expired - Lifetime
- 1987-11-24 DE DE8787117249T patent/DE3785331D1/de not_active Expired - Fee Related
-
1988
- 1988-02-05 JP JP63024066A patent/JPS63202022A/ja active Granted
- 1988-02-08 US US07/155,070 patent/US4950568A/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3150056A1 (de) * | 1980-12-17 | 1982-07-15 | Westinghouse Electric Corp., 15222 Pittsburgh, Pa. | "maske zur verwendung bei lithopraphischen verfahren" |
| DE3232499A1 (de) * | 1982-09-01 | 1984-03-01 | Philips Patentverwaltung Gmbh, 2000 Hamburg | Maske fuer die mustererzeugung in lackschichten mittels roentgenstrahllithographie und verfahren zu ihrer herstellung |
| DE3427449A1 (de) * | 1983-07-27 | 1985-02-07 | Mitsubishi Denki K.K., Tokio/Tokyo | Maske fuer die roentgenstrahllithographie |
| DE3425063A1 (de) * | 1984-07-07 | 1986-02-06 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Maske fuer die roentgenlithographie |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1089128A3 (en) * | 1999-09-30 | 2001-05-02 | Kabushiki Kaisha Toshiba | Exposure mask, exposure mask manufacturing method, and semiconductor device manufacturing method using exposure mask |
| US7063921B2 (en) | 2002-09-27 | 2006-06-20 | Infineon Technologies Ag | Photomask, in particular alternating phase shift mask, with compensation structure |
| DE10245159B4 (de) * | 2002-09-27 | 2006-10-12 | Infineon Technologies Ag | Photomaske, insbesondere alternierende Phasenmaske, mit Kompensationsstruktur |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0351287B2 (enExample) | 1991-08-06 |
| JPS63202022A (ja) | 1988-08-22 |
| EP0278076A2 (de) | 1988-08-17 |
| DE3785331D1 (de) | 1993-05-13 |
| US4950568A (en) | 1990-08-21 |
| DE8717448U1 (de) | 1988-12-29 |
| EP0278076A3 (en) | 1990-04-25 |
| EP0278076B1 (de) | 1993-04-07 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8100 | Publication of the examined application without publication of unexamined application | ||
| D1 | Grant (no unexamined application published) patent law 81 | ||
| 8364 | No opposition during term of opposition | ||
| 8339 | Ceased/non-payment of the annual fee |