DE3689945D1 - Vorrichtung zum Festhalten von elektrischen oder elektronischen Bauteilen während der Anwendung von Lötmitteln. - Google Patents

Vorrichtung zum Festhalten von elektrischen oder elektronischen Bauteilen während der Anwendung von Lötmitteln.

Info

Publication number
DE3689945D1
DE3689945D1 DE3689945T DE3689945T DE3689945D1 DE 3689945 D1 DE3689945 D1 DE 3689945D1 DE 3689945 T DE3689945 T DE 3689945T DE 3689945 T DE3689945 T DE 3689945T DE 3689945 D1 DE3689945 D1 DE 3689945D1
Authority
DE
Germany
Prior art keywords
components
solder
electronic components
lower frame
holding electrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE3689945T
Other languages
English (en)
Inventor
Ah Tee Sim
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SUN IND COATINGS
Original Assignee
SUN IND COATINGS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SUN IND COATINGS filed Critical SUN IND COATINGS
Application granted granted Critical
Publication of DE3689945D1 publication Critical patent/DE3689945D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/087—Soldering or brazing jigs, fixtures or clamping means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S269/00—Work holders
    • Y10S269/903—Work holder for electrical circuit assemblages or wiring systems

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Packaging Frangible Articles (AREA)
  • Molten Solder (AREA)
  • Details Of Resistors (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
DE3689945T 1985-08-20 1986-08-20 Vorrichtung zum Festhalten von elektrischen oder elektronischen Bauteilen während der Anwendung von Lötmitteln. Expired - Lifetime DE3689945D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB858520844A GB8520844D0 (en) 1985-08-20 1985-08-20 Holding electrical/electronic components

Publications (1)

Publication Number Publication Date
DE3689945D1 true DE3689945D1 (de) 1994-08-11

Family

ID=10584052

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3689945T Expired - Lifetime DE3689945D1 (de) 1985-08-20 1986-08-20 Vorrichtung zum Festhalten von elektrischen oder elektronischen Bauteilen während der Anwendung von Lötmitteln.

Country Status (11)

Country Link
US (1) US4747532A (de)
EP (1) EP0211692B1 (de)
KR (1) KR910000553B1 (de)
CN (2) CN1008053B (de)
AT (1) ATE108295T1 (de)
CA (1) CA1287158C (de)
DE (1) DE3689945D1 (de)
GB (1) GB8520844D0 (de)
IN (1) IN170225B (de)
MY (1) MY102595A (de)
PH (1) PH23105A (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63140763A (ja) * 1986-12-03 1988-06-13 Tamura Seisakusho Co Ltd 自動はんだ付け装置
US4964560A (en) * 1988-10-28 1990-10-23 Wharff Charles R Non-dedicated pallet assembly for wave soldering packaged integrated circuits
US4871106A (en) * 1988-10-28 1989-10-03 Wharff Charles R Non-dedicated pallet assembly for wave soldering packaged integrated circuits
US5263632A (en) * 1992-08-06 1993-11-23 United Technologies Corporation Apparatus for positioning integrated circuit packages for tinning
US5687237A (en) * 1995-11-13 1997-11-11 Pitney Bowes Inc. Encryption key management system for an integrated circuit
KR100431842B1 (ko) * 1999-12-10 2004-05-20 주식회사 포스코 전열성이 우수한 고강도 마르텐사이트계 스테인레스클래드강판의 제조방법
DE10259277A1 (de) * 2002-12-17 2004-07-01 Endress + Hauser Gmbh + Co. Kg Einspannvorrichtung und Verfahren zur Fixierung von mindestens einem elektronischen Bauteils auf einer Leiterplatte und zum Löten des Bauteils
US6935549B2 (en) * 2003-05-23 2005-08-30 Medtronic, Inc. Brazing fixtures and methods for fabricating brazing fixtures used for making feed-through assemblies
CN100448831C (zh) * 2006-10-09 2009-01-07 昆明通发实业有限公司 一种管道化连续生产辅酶q0的方法
US10759007B2 (en) * 2013-03-14 2020-09-01 Bwxt Mpower, Inc. Spacer grid welding fixture
TW201446101A (zh) * 2013-05-30 2014-12-01 Hon Hai Prec Ind Co Ltd 承載裝置
US10604301B2 (en) * 2017-02-10 2020-03-31 Ccl Label, Inc. Item storage and display case

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1195835B (de) * 1962-05-12 1965-07-01 Siemens Ag Loetvorrichtung zum Herstellen von Thermoelementbloecken
US3392256A (en) * 1965-06-24 1968-07-09 Texas Instruments Inc Method and apparatus for assembling electronic components to printed circuit boards
JPS5127845A (ja) * 1974-09-03 1976-03-09 Koki Kk Handazukesochi
JPS5342027A (en) * 1976-09-28 1978-04-17 Minolta Camera Co Ltd Single lens reflex camera of ttl photometry with electric self-timer
DE2935043A1 (de) * 1979-08-30 1981-03-19 Philips Patentverwaltung Gmbh, 2000 Hamburg Halterung fuer eine vielzahl von langgestreckten einzelteilen
FR2495884A1 (fr) * 1980-12-05 1982-06-11 Lignes Telegraph Telephon Dispositif de reception d'au moins une plaquette, notamment de circuit imprime, et utilisation d'un tel dispositif
US4473455A (en) * 1981-12-21 1984-09-25 At&T Bell Laboratories Wafer holding apparatus and method
US4512509A (en) * 1983-02-25 1985-04-23 At&T Technologies, Inc. Technique for bonding a chip carrier to a metallized substrate
US4556776A (en) * 1983-07-26 1985-12-03 Westinghouse Electric Corp. Welding fixture for nuclear reactor fuel assembly grid
US4489923A (en) * 1983-08-05 1984-12-25 Rca Corporation Fixture for solder tinning chip carriers
US4527620A (en) * 1984-05-02 1985-07-09 Varian Associates, Inc. Apparatus for controlling thermal transfer in a cyclic vacuum processing system
GB8419420D0 (en) * 1984-07-30 1984-09-05 Sun Ind Coatings Holding electronic components during application of solder

Also Published As

Publication number Publication date
CA1287158C (en) 1991-07-30
EP0211692B1 (de) 1994-07-06
PH23105A (en) 1989-04-10
EP0211692A2 (de) 1987-02-25
MY102595A (en) 1992-08-17
CN86105118A (zh) 1987-04-08
GB8520844D0 (en) 1985-09-25
US4747532A (en) 1988-05-31
IN170225B (de) 1992-02-29
KR910000553B1 (ko) 1991-01-26
KR870001892A (ko) 1987-03-28
CN86206084U (zh) 1987-10-28
CN1008053B (zh) 1990-05-16
EP0211692A3 (en) 1988-11-30
ATE108295T1 (de) 1994-07-15

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Legal Events

Date Code Title Description
8332 No legal effect for de