DE3685472D1 - Verfahren und struktur um eine gezielte aenderung in einem paket von mehreren modularen bauelementen zu ermoeglichen. - Google Patents

Verfahren und struktur um eine gezielte aenderung in einem paket von mehreren modularen bauelementen zu ermoeglichen.

Info

Publication number
DE3685472D1
DE3685472D1 DE8686113233T DE3685472T DE3685472D1 DE 3685472 D1 DE3685472 D1 DE 3685472D1 DE 8686113233 T DE8686113233 T DE 8686113233T DE 3685472 T DE3685472 T DE 3685472T DE 3685472 D1 DE3685472 D1 DE 3685472D1
Authority
DE
Germany
Prior art keywords
package
enable
modular components
several modular
targeted change
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8686113233T
Other languages
German (de)
English (en)
Inventor
Charles T Ryan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE3685472D1 publication Critical patent/DE3685472D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5382—Adaptable interconnections, e.g. for engineering changes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
    • H05K1/0289—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns having a matrix lay-out, i.e. having selectively interconnectable sets of X-conductors and Y-conductors in different planes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0292—Programmable, customizable or modifiable circuits having a modifiable lay-out, i.e. adapted for engineering changes or repair
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10212—Programmable component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
DE8686113233T 1985-10-28 1986-09-26 Verfahren und struktur um eine gezielte aenderung in einem paket von mehreren modularen bauelementen zu ermoeglichen. Expired - Lifetime DE3685472D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/792,708 US4652974A (en) 1985-10-28 1985-10-28 Method and structure for effecting engineering changes in a multiple device module package

Publications (1)

Publication Number Publication Date
DE3685472D1 true DE3685472D1 (de) 1992-07-02

Family

ID=25157814

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8686113233T Expired - Lifetime DE3685472D1 (de) 1985-10-28 1986-09-26 Verfahren und struktur um eine gezielte aenderung in einem paket von mehreren modularen bauelementen zu ermoeglichen.

Country Status (5)

Country Link
US (1) US4652974A (enExample)
EP (1) EP0220503B1 (enExample)
JP (1) JPS62101062A (enExample)
CA (1) CA1236926A (enExample)
DE (1) DE3685472D1 (enExample)

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5165166A (en) * 1987-09-29 1992-11-24 Microelectronics And Computer Technology Corporation Method of making a customizable circuitry
AU610249B2 (en) * 1987-09-29 1991-05-16 Microelectronics And Computer Technology Corporation Customizable circuitry
US4888665A (en) * 1988-02-19 1989-12-19 Microelectronics And Computer Technology Corporation Customizable circuitry
US5081561A (en) * 1988-02-19 1992-01-14 Microelectronics And Computer Technology Corporation Customizable circuitry
US5039628A (en) * 1988-02-19 1991-08-13 Microelectronics & Computer Technology Corporation Flip substrate for chip mount
US4926241A (en) * 1988-02-19 1990-05-15 Microelectronics And Computer Technology Corporation Flip substrate for chip mount
JPH036844U (enExample) * 1989-06-05 1991-01-23
US5060116A (en) * 1990-04-20 1991-10-22 Grobman Warren D Electronics system with direct write engineering change capability
US5224022A (en) * 1990-05-15 1993-06-29 Microelectronics And Computer Technology Corporation Reroute strategy for high density substrates
US5162792A (en) * 1990-08-03 1992-11-10 American Telephone And Telegraph Company On-the-fly arrangement for interconnecting leads and connectors
US5220490A (en) * 1990-10-25 1993-06-15 Microelectronics And Computer Technology Corporation Substrate interconnect allowing personalization using spot surface links
US5155577A (en) * 1991-01-07 1992-10-13 International Business Machines Corporation Integrated circuit carriers and a method for making engineering changes in said carriers
US5184284A (en) * 1991-09-03 1993-02-02 International Business Machines Corporation Method and apparatus for implementing engineering changes for integrated circuit module
US5243140A (en) * 1991-10-04 1993-09-07 International Business Machines Corporation Direct distribution repair and engineering change system
US5247735A (en) * 1991-12-18 1993-09-28 International Business Machines Corporation Electrical wire deletion
DE4222402A1 (de) * 1992-07-08 1994-01-13 Daimler Benz Ag Anordnung für die Mehrfachverdrahtung von Mulichipmodulen
US5432708A (en) * 1992-10-08 1995-07-11 Aptix Corporation Multichip module integrated circuit device having maximum input/output capability
US5539186A (en) * 1992-12-09 1996-07-23 International Business Machines Corporation Temperature controlled multi-layer module
US5497027A (en) * 1993-11-30 1996-03-05 At&T Global Information Solutions Company Multi-chip module packaging system
US5726482A (en) * 1994-02-08 1998-03-10 Prolinx Labs Corporation Device-under-test card for a burn-in board
US5813881A (en) * 1994-02-08 1998-09-29 Prolinx Labs Corporation Programmable cable and cable adapter using fuses and antifuses
US5834824A (en) * 1994-02-08 1998-11-10 Prolinx Labs Corporation Use of conductive particles in a nonconductive body as an integrated circuit antifuse
US5537108A (en) * 1994-02-08 1996-07-16 Prolinx Labs Corporation Method and structure for programming fuses
US5917229A (en) * 1994-02-08 1999-06-29 Prolinx Labs Corporation Programmable/reprogrammable printed circuit board using fuse and/or antifuse as interconnect
US5808351A (en) * 1994-02-08 1998-09-15 Prolinx Labs Corporation Programmable/reprogramable structure using fuses and antifuses
US5572409A (en) * 1994-02-08 1996-11-05 Prolinx Labs Corporation Apparatus including a programmable socket adapter for coupling an electronic component to a component socket on a printed circuit board
US6101710A (en) * 1994-12-14 2000-08-15 International Business Machines Corporation Method for facilitating engineering changes in a multiple level circuit package
US5962815A (en) * 1995-01-18 1999-10-05 Prolinx Labs Corporation Antifuse interconnect between two conducting layers of a printed circuit board
US5937515A (en) * 1995-04-25 1999-08-17 Johnson; Morgan T. Reconfigurable circuit fabrication method
US5906042A (en) * 1995-10-04 1999-05-25 Prolinx Labs Corporation Method and structure to interconnect traces of two conductive layers in a printed circuit board
US5767575A (en) * 1995-10-17 1998-06-16 Prolinx Labs Corporation Ball grid array structure and method for packaging an integrated circuit chip
US5872338A (en) * 1996-04-10 1999-02-16 Prolinx Labs Corporation Multilayer board having insulating isolation rings
US6034427A (en) * 1998-01-28 2000-03-07 Prolinx Labs Corporation Ball grid array structure and method for packaging an integrated circuit chip
FR2810158B1 (fr) 2000-06-09 2002-08-30 Centre Nat Etd Spatiales Procede pour realiser une permutation d'entrees/sorties de plusieurs pistes a branches paralleles d'un circuit integre et circuit obtenu
DE10054114A1 (de) 2000-10-31 2002-05-16 Dupont Performance Coatings Verfahren zur Herstellung von Pulverlackzusammensetzungen
US6954984B2 (en) * 2002-07-25 2005-10-18 International Business Machines Corporation Land grid array structure
US6700196B1 (en) 2002-09-23 2004-03-02 Honeywell Federal Manufacturing & Technologies Programmable multi-chip module
US7299102B2 (en) * 2004-12-02 2007-11-20 Norman Ken Ouchi Method and system for engineering change implementation
US12432845B2 (en) * 2020-12-25 2025-09-30 Hitachi Astemo, Ltd. Vehicle-mounted electronic control device
CN114698270B (zh) * 2022-03-30 2024-12-03 江苏普诺威电子股份有限公司 基于表层保护的精密线路封装载板及其加工工艺

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3378920A (en) * 1966-01-26 1968-04-23 Air Force Usa Method for producing an interconnection matrix
US4089734A (en) * 1974-09-16 1978-05-16 Raytheon Company Integrated circuit fusing technique
FR2404990A1 (fr) * 1977-10-03 1979-04-27 Cii Honeywell Bull Substrat d'interconnexion de composants electroniques a circuits integres, muni d'un dispositif de reparation
US4254445A (en) * 1979-05-07 1981-03-03 International Business Machines Corporation Discretionary fly wire chip interconnection
US4245273A (en) * 1979-06-29 1981-01-13 International Business Machines Corporation Package for mounting and interconnecting a plurality of large scale integrated semiconductor devices
US4489364A (en) * 1981-12-31 1984-12-18 International Business Machines Corporation Chip carrier with embedded engineering change lines with severable periodically spaced bridging connectors on the chip supporting surface

Also Published As

Publication number Publication date
EP0220503B1 (en) 1992-05-27
EP0220503A3 (en) 1989-05-31
JPS62101062A (ja) 1987-05-11
CA1236926A (en) 1988-05-17
EP0220503A2 (en) 1987-05-06
JPH0226393B2 (enExample) 1990-06-08
US4652974A (en) 1987-03-24

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee