DE3673773D1 - Leiterrahmengratentfernung. - Google Patents

Leiterrahmengratentfernung.

Info

Publication number
DE3673773D1
DE3673773D1 DE8686903815T DE3673773T DE3673773D1 DE 3673773 D1 DE3673773 D1 DE 3673773D1 DE 8686903815 T DE8686903815 T DE 8686903815T DE 3673773 T DE3673773 T DE 3673773T DE 3673773 D1 DE3673773 D1 DE 3673773D1
Authority
DE
Germany
Prior art keywords
frame rate
rate removal
removal
frame
rate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8686903815T
Other languages
English (en)
Inventor
William Moyer
Robert Scholz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
American Telephone and Telegraph Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by American Telephone and Telegraph Co Inc filed Critical American Telephone and Telegraph Co Inc
Application granted granted Critical
Publication of DE3673773D1 publication Critical patent/DE3673773D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4835—Cleaning, e.g. removing of solder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
DE8686903815T 1985-06-11 1986-05-13 Leiterrahmengratentfernung. Expired - Fee Related DE3673773D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US74366785A 1985-06-11 1985-06-11
PCT/US1986/001046 WO1986007492A1 (en) 1985-06-11 1986-05-13 Lead frame deflashing

Publications (1)

Publication Number Publication Date
DE3673773D1 true DE3673773D1 (de) 1990-10-04

Family

ID=24989678

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8686903815T Expired - Fee Related DE3673773D1 (de) 1985-06-11 1986-05-13 Leiterrahmengratentfernung.

Country Status (7)

Country Link
EP (1) EP0225374B1 (de)
JP (1) JPS63500062A (de)
KR (1) KR880700462A (de)
CA (1) CA1244146A (de)
DE (1) DE3673773D1 (de)
SG (1) SG84190G (de)
WO (1) WO1986007492A1 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0905762A1 (de) 1997-09-30 1999-03-31 STMicroelectronics S.r.l. Verfahren zum Entfernen von Grat in der Fabrikation von Kunststoffverpackungen von Halbleiteranordnungen
SG84519A1 (en) * 1998-12-07 2001-11-20 Advanced Systems Automation Method and apparatus for removal of mold flash
US6335208B1 (en) 1999-05-10 2002-01-01 Intersil Americas Inc. Laser decapsulation method
JP4467203B2 (ja) * 2001-03-27 2010-05-26 新日本無線株式会社 電子部品のリード切断方法
US7635418B2 (en) 2004-12-03 2009-12-22 Nordson Corporation Plasma processing apparatus and methods for removing extraneous material from selected areas on a substrate
US7842223B2 (en) 2004-12-22 2010-11-30 Nordson Corporation Plasma process for removing excess molding material from a substrate
CN106925896B (zh) * 2015-12-31 2019-03-19 无锡华润安盛科技有限公司 散热片表面溢料处理方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2919998A1 (de) * 1979-05-17 1980-11-27 Siemens Ag Befestigen der anschlussdraehte von halbleitersystemen auf den traegerelementen
JPS5759368A (en) * 1980-09-29 1982-04-09 Hitachi Ltd Method of removing flash on lead frame and cutting dam
EP0084424A3 (de) * 1982-01-07 1984-06-13 American Microsystems, Incorporated Chemische Entfernung von ausgelaufenem Harz von verkapselten Anordnungen und gemäss diesem Verfahren behandelte Anordung
JPS594060A (ja) * 1982-06-30 1984-01-10 Fujitsu Ltd 半導体装置

Also Published As

Publication number Publication date
CA1244146A (en) 1988-11-01
SG84190G (en) 1990-12-21
JPS63500062A (ja) 1988-01-07
KR880700462A (ko) 1988-03-15
EP0225374A1 (de) 1987-06-16
EP0225374B1 (de) 1990-08-29
WO1986007492A1 (en) 1986-12-18

Similar Documents

Publication Publication Date Title
ATE77088T1 (de) 8-phenylxanthine.
DE3668776D1 (de) Endotubus.
FI860516A (fi) Nappenhet.
NO162299C (no) Silanordning.
IT8520687A0 (it) Montatura per occhiali a lorgnette.
DE3673725D1 (de) Geruestkupplung.
NO860806L (no) Kompensator.
DE3668885D1 (de) Fluorbenzylester.
DE3669772D1 (de) Russblaeser.
IT8519201A0 (it) Filatoio-stiratoio.
DE3676715D1 (de) Photolackentfern-verfahren.
IT8620247A0 (it) Apparecchio estrusore-turbomescolatore.
DE3679122D1 (de) Trageinheit.
DE3676753D1 (de) Stranggiessverfahren.
DE3673773D1 (de) Leiterrahmengratentfernung.
DE3673520D1 (de) Perfluorpolyaether.
DE3670979D1 (de) Raederfalzapparat.
IT8620246A0 (it) Apparecchio estrusore-turbomescolatore.
DE3687513D1 (de) Filterapparat.
DE3482053D1 (de) Fahrbare lafette.
DE3667938D1 (de) Raederfalzapparat.
DE3673746D1 (de) Pudermine.
IT8721386A0 (it) Stiratoio.
FI861540A0 (fi) Stoed foer en drag- och slagdaempningsanordning.
FI862143A0 (fi) Skyddsgas.

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee