DE3668474D1 - Verfahren zur bestimmung der plattierungsaktivitaet eines stromlosen plattierungsbades. - Google Patents

Verfahren zur bestimmung der plattierungsaktivitaet eines stromlosen plattierungsbades.

Info

Publication number
DE3668474D1
DE3668474D1 DE8686111281T DE3668474T DE3668474D1 DE 3668474 D1 DE3668474 D1 DE 3668474D1 DE 8686111281 T DE8686111281 T DE 8686111281T DE 3668474 T DE3668474 T DE 3668474T DE 3668474 D1 DE3668474 D1 DE 3668474D1
Authority
DE
Germany
Prior art keywords
plating
currently
determining
activity
plating bath
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8686111281T
Other languages
English (en)
Inventor
William J Amelio
Voya Markovich
Carlos J Sambucetti
Donna J Trevitt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE3668474D1 publication Critical patent/DE3668474D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C23C18/1683—Control of electrolyte composition, e.g. measurement, adjustment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
DE8686111281T 1985-10-07 1986-08-14 Verfahren zur bestimmung der plattierungsaktivitaet eines stromlosen plattierungsbades. Expired - Fee Related DE3668474D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/785,128 US4654126A (en) 1985-10-07 1985-10-07 Process for determining the plating activity of an electroless plating bath

Publications (1)

Publication Number Publication Date
DE3668474D1 true DE3668474D1 (de) 1990-03-01

Family

ID=25134525

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8686111281T Expired - Fee Related DE3668474D1 (de) 1985-10-07 1986-08-14 Verfahren zur bestimmung der plattierungsaktivitaet eines stromlosen plattierungsbades.

Country Status (4)

Country Link
US (1) US4654126A (de)
EP (1) EP0221265B1 (de)
JP (1) JPH0643980B2 (de)
DE (1) DE3668474D1 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4784729A (en) * 1986-08-29 1988-11-15 Cities Service Oil And Gas Corporation Electrochemical analysis method using corrosion probe
US4814197A (en) * 1986-10-31 1989-03-21 Kollmorgen Corporation Control of electroless plating baths
US4808431A (en) * 1987-12-08 1989-02-28 International Business Machines Corp. Method for controlling plating on seeded surfaces
US4928065A (en) * 1989-03-31 1990-05-22 E. I. Du Pont De Nemours And Company Voltammetry in low-permitivity suspensions
US5071527A (en) * 1990-06-29 1991-12-10 University Of Dayton Complete oil analysis technique
US5425859A (en) * 1991-05-28 1995-06-20 Rockwell International Corporation Method and apparatus for assessing and restoring solderability
US5262022A (en) * 1991-05-28 1993-11-16 Rockwell International Corporation Method of assessing solderability
US5484626A (en) * 1992-04-06 1996-01-16 Shipley Company L.L.C. Methods and apparatus for maintaining electroless plating solutions
US5501777A (en) * 1994-12-30 1996-03-26 At&T Corp. Method for testing solder mask material
US5933016A (en) * 1996-08-30 1999-08-03 The University Of Dayton Single electrode conductivity technique
US5889200A (en) * 1996-08-30 1999-03-30 The University Of Dayton Tandem technique for fluid monitoring
US6709561B1 (en) * 2002-11-06 2004-03-23 Eci Technology, Inc. Measurement of the concentration of a reducing agent in an electroless plating bath
JP2011017562A (ja) * 2009-07-07 2011-01-27 Yokogawa Electric Corp サイクリックボルタンメトリー法を用いた評価方法および評価装置
JP5888152B2 (ja) * 2012-07-05 2016-03-16 住友金属鉱山株式会社 パラジウムめっき液の劣化状態評価方法、パラジウムめっき方法

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3075856A (en) * 1958-03-31 1963-01-29 Gen Electric Copper plating process and solution
US2938805A (en) * 1958-03-31 1960-05-31 Gen Electric Process of stabilizing autocatalytic copper plating solutions
US3075855A (en) * 1958-03-31 1963-01-29 Gen Electric Copper plating process and solutions
US2996408A (en) * 1958-03-31 1961-08-15 Gen Electric Copper plating process and solution
US3925168A (en) * 1972-07-26 1975-12-09 Anaconda American Brass Co Method of monitoring the active roughening agent in a copper plating bath
US3844799A (en) * 1973-12-17 1974-10-29 Ibm Electroless copper plating
CA1064852A (en) * 1975-12-31 1979-10-23 Cominco Ltd. Method for evaluating a system for electrodeposition of metals
US4096301A (en) * 1976-02-19 1978-06-20 Macdermid Incorporated Apparatus and method for automatically maintaining an electroless copper plating bath
GB1585057A (en) * 1976-06-28 1981-02-25 Ici Ltd Sensing concentration of coating solution
US4132605A (en) * 1976-12-27 1979-01-02 Rockwell International Corporation Method for evaluating the quality of electroplating baths
US4152467A (en) * 1978-03-10 1979-05-01 International Business Machines Corporation Electroless copper plating process with dissolved oxygen maintained in bath
US4336111A (en) * 1978-11-02 1982-06-22 The Boeing Company Method for determining the strength of a metal processing solution
DE2911073C2 (de) * 1979-03-21 1984-01-12 Siemens AG, 1000 Berlin und 8000 München Verfahren und Vorrichtung zum automatischen Messen und Regeln der Konzentration der Hauptkomponenten eines Bades zum stromlosen Abscheiden von Kupfer
US4324621A (en) * 1979-12-26 1982-04-13 Cominco Ltd. Method and apparatus for controlling the quality of electrolytes
US4276323A (en) * 1979-12-21 1981-06-30 Hitachi, Ltd. Process for controlling of chemical copper plating solution
US4287027A (en) * 1980-05-20 1981-09-01 Tosk Jeffrey M Method of determining the concentration of reducing agents
JPS59154400A (ja) * 1983-02-23 1984-09-03 株式会社日立製作所 放射性汚染金属の除染方法
JPS6096767A (ja) * 1983-10-31 1985-05-30 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション 銅めつき方法
US4481090A (en) * 1984-01-23 1984-11-06 The United States Of America As Represented By The United States Department Of Energy Decontaminating metal surfaces
US4525390A (en) * 1984-03-09 1985-06-25 International Business Machines Corporation Deposition of copper from electroless plating compositions
JPS60245783A (ja) * 1984-05-17 1985-12-05 インタ−ナシヨナル　ビジネス　マシ−ンズ　コ−ポレ−シヨン 無電解銅めつき浴
US4565575A (en) * 1984-11-02 1986-01-21 Shiplay Company Inc. Apparatus and method for automatically maintaining an electroless plating bath

Also Published As

Publication number Publication date
EP0221265B1 (de) 1990-01-24
JPS6283646A (ja) 1987-04-17
JPH0643980B2 (ja) 1994-06-08
EP0221265A1 (de) 1987-05-13
US4654126A (en) 1987-03-31

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee