DE3650709T2 - Kühlmodule für Vorrichtungen mit elektronischem Schaltkreis - Google Patents
Kühlmodule für Vorrichtungen mit elektronischem SchaltkreisInfo
- Publication number
- DE3650709T2 DE3650709T2 DE19863650709 DE3650709T DE3650709T2 DE 3650709 T2 DE3650709 T2 DE 3650709T2 DE 19863650709 DE19863650709 DE 19863650709 DE 3650709 T DE3650709 T DE 3650709T DE 3650709 T2 DE3650709 T2 DE 3650709T2
- Authority
- DE
- Germany
- Prior art keywords
- electronic circuit
- circuit devices
- cooling modules
- modules
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4332—Bellows
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
- H01L23/4735—Jet impingement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1703186A JPS62282452A (ja) | 1986-01-28 | 1986-01-28 | 集積回路冷却装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3650709D1 DE3650709D1 (de) | 1999-03-04 |
DE3650709T2 true DE3650709T2 (de) | 1999-05-27 |
Family
ID=11932628
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19863650709 Expired - Fee Related DE3650709T2 (de) | 1986-01-28 | 1986-10-03 | Kühlmodule für Vorrichtungen mit elektronischem Schaltkreis |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP0483107B1 (US06566495-20030520-M00011.png) |
JP (1) | JPS62282452A (US06566495-20030520-M00011.png) |
DE (1) | DE3650709T2 (US06566495-20030520-M00011.png) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4217597C2 (de) * | 1992-05-27 | 1994-09-08 | Siemens Nixdorf Inf Syst | Einbausystem für auf Leiterplatten montierte hochintegrierte gehäuselose Bausteine |
DE10243026B3 (de) * | 2002-09-13 | 2004-06-03 | Oliver Laing | Vorrichtung zur lokalen Kühlung oder Erwärmung eines Gegenstandes |
JP5250325B2 (ja) * | 2008-07-24 | 2013-07-31 | 株式会社日立製作所 | 電子機器冷却装置並びに電子機器冷却装置のポンプ一体型冷却モジュール |
CN105704983B (zh) * | 2016-02-25 | 2017-11-21 | 上海斐讯数据通信技术有限公司 | 一种辅助散热装置及家用电子设备 |
CN106170192A (zh) * | 2016-07-05 | 2016-11-30 | 联想(北京)有限公司 | 一种电子设备 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60160149A (ja) * | 1984-01-26 | 1985-08-21 | Fujitsu Ltd | 集積回路装置の冷却方式 |
-
1986
- 1986-01-28 JP JP1703186A patent/JPS62282452A/ja active Granted
- 1986-10-03 DE DE19863650709 patent/DE3650709T2/de not_active Expired - Fee Related
- 1986-10-03 EP EP92100516A patent/EP0483107B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPS62282452A (ja) | 1987-12-08 |
EP0483107B1 (en) | 1999-01-20 |
DE3650709D1 (de) | 1999-03-04 |
EP0483107A2 (en) | 1992-04-29 |
EP0483107A3 (US06566495-20030520-M00011.png) | 1995-05-17 |
JPH046099B2 (US06566495-20030520-M00011.png) | 1992-02-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |