DE3586080D1 - Verfahren zum herstellen von gruenen mehrschicht-keramikfolien. - Google Patents

Verfahren zum herstellen von gruenen mehrschicht-keramikfolien.

Info

Publication number
DE3586080D1
DE3586080D1 DE8585109845T DE3586080T DE3586080D1 DE 3586080 D1 DE3586080 D1 DE 3586080D1 DE 8585109845 T DE8585109845 T DE 8585109845T DE 3586080 T DE3586080 T DE 3586080T DE 3586080 D1 DE3586080 D1 DE 3586080D1
Authority
DE
Germany
Prior art keywords
multilayer ceramic
ceramic films
producing green
green multilayer
producing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8585109845T
Other languages
English (en)
Inventor
Lawrence V Gregor
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE3586080D1 publication Critical patent/DE3586080D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0029—Etching of the substrate by chemical or physical means by laser ablation of inorganic insulating material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4857—Multilayer substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0112—Absorbing light, e.g. dielectric layer with carbon filler for laser processing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
DE8585109845T 1984-10-19 1985-08-06 Verfahren zum herstellen von gruenen mehrschicht-keramikfolien. Expired - Fee Related DE3586080D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/662,488 US4581098A (en) 1984-10-19 1984-10-19 MLC green sheet process

Publications (1)

Publication Number Publication Date
DE3586080D1 true DE3586080D1 (de) 1992-06-25

Family

ID=24657924

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8585109845T Expired - Fee Related DE3586080D1 (de) 1984-10-19 1985-08-06 Verfahren zum herstellen von gruenen mehrschicht-keramikfolien.

Country Status (4)

Country Link
US (1) US4581098A (de)
EP (1) EP0178409B1 (de)
JP (1) JPS6197991A (de)
DE (1) DE3586080D1 (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4907066A (en) * 1986-12-05 1990-03-06 Cornell Research Foundation, Inc. Planar tungsten interconnect with implanted silicon
US4746621A (en) * 1986-12-05 1988-05-24 Cornell Research Foundation, Inc. Planar tungsten interconnect
JPS63240096A (ja) * 1987-03-27 1988-10-05 富士通株式会社 グリ−ンシ−ト多層法
GB2212332A (en) * 1987-11-11 1989-07-19 Gen Electric Co Plc Fabrication of electrical circuits
US4897676A (en) * 1988-01-05 1990-01-30 Max Levy Autograph, Inc. High-density circuit and method of its manufacture
US5162191A (en) * 1988-01-05 1992-11-10 Max Levy Autograph, Inc. High-density circuit and method of its manufacture
US5488394A (en) * 1988-01-05 1996-01-30 Max Levy Autograph, Inc. Print head and method of making same
US5531020A (en) * 1989-11-14 1996-07-02 Poly Flex Circuits, Inc. Method of making subsurface electronic circuits
US5194698A (en) * 1990-09-11 1993-03-16 Hughes Aircraft Company Apparatus and method using a permanent mandrel for manufacture of electrical circuitry
US5087322A (en) * 1990-10-24 1992-02-11 Cornell Research Foundation, Inc. Selective metallization for high temperature semiconductors
JP2794960B2 (ja) * 1991-02-19 1998-09-10 松下電器産業株式会社 焼結導体配線基板とその製造方法
US5240671A (en) * 1992-06-01 1993-08-31 Microelectronics And Computer Technology Corporation Method of forming recessed patterns in insulating substrates
US5948200A (en) * 1996-07-26 1999-09-07 Taiyo Yuden Co., Ltd. Method of manufacturing laminated ceramic electronic parts
US6321438B1 (en) 1998-05-01 2001-11-27 Scimed Life Systems, Inc. Method of applying a matching layer to a transducer
DE19963281A1 (de) * 1999-12-27 2001-06-28 Tridonic Bauelemente Verfahren zum Herstellen von Leiterbahnen
JP4721025B2 (ja) * 2001-03-12 2011-07-13 Ｔｏｔｏ株式会社 洗浄装置
WO2006124625A2 (en) * 2005-05-12 2006-11-23 Nanosys, Inc. Use of nanoparticles in film formation and as solder
CN101123197B (zh) * 2006-08-09 2010-05-12 日月光半导体制造股份有限公司 用于承载导线架的加热治具
CN101683011B (zh) * 2008-03-28 2013-01-09 株式会社村田制作所 多层陶瓷基板的制造方法及复合片材
JP5574038B2 (ja) 2011-03-07 2014-08-20 株式会社村田製作所 セラミック多層基板およびその製造方法
EP3406113B1 (de) * 2016-01-20 2020-09-09 Jaquet Technology Group AG Herstellungsverfahren für ein messgegenstand und messgerät
CN109890133A (zh) * 2019-03-11 2019-06-14 河南博美通电子科技有限公司 一种基于导电浆的柔性电路板结构及制备工艺

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE19839E (en) * 1934-11-30 1936-01-28 Decalcomania
US3481760A (en) * 1964-04-13 1969-12-02 Minnesota Mining & Mfg Thermographic copying sheets
US3260584A (en) * 1964-06-29 1966-07-12 Libbey Owens Ford Glass Co Method of controlling temperatures in sheet glass with heat absorptive material
US3770529A (en) * 1970-08-25 1973-11-06 Ibm Method of fabricating multilayer circuits
GB1321545A (en) * 1971-12-08 1973-06-27 Ibm Method of fabricating multilayer circuits
JPS5543268B2 (de) * 1972-12-21 1980-11-05
US3948706A (en) * 1973-12-13 1976-04-06 International Business Machines Corporation Method for metallizing ceramic green sheets
US3956052A (en) * 1974-02-11 1976-05-11 International Business Machines Corporation Recessed metallurgy for dielectric substrates
JPS5287661A (en) * 1976-01-17 1977-07-21 Nippon Electric Co Method of producing hybrid integrated circuit substrate
US4109377A (en) * 1976-02-03 1978-08-29 International Business Machines Corporation Method for preparing a multilayer ceramic
JPS52111097A (en) * 1976-03-13 1977-09-17 Toshiba Corp Laser processing method
FR2421156A1 (fr) * 1978-03-30 1979-10-26 Commissariat Energie Atomique Procede de preparation d'une piece en ceramique, comportant sur sa surface des inclusions de materiau conducteur de l'electricite
US4500389A (en) * 1981-04-14 1985-02-19 Kollmorgen Technologies Corporation Process for the manufacture of substrates to interconnect electronic components

Also Published As

Publication number Publication date
EP0178409B1 (de) 1992-05-20
JPH024153B2 (de) 1990-01-26
US4581098A (en) 1986-04-08
EP0178409A2 (de) 1986-04-23
JPS6197991A (ja) 1986-05-16
EP0178409A3 (en) 1987-10-28

Similar Documents

Publication Publication Date Title
DE3586080D1 (de) Verfahren zum herstellen von gruenen mehrschicht-keramikfolien.
DE3578614D1 (de) Verfahren zum herstellen von chip-einfuegungsschichten.
DE3675080D1 (de) Verfahren zum herstellen von graphitfolien.
DE3881860D1 (de) Verfahren zum herstellen von profilelementen.
DE3784836D1 (de) Verfahren zum herstellen von schichtstoffteilen.
DE3381509D1 (de) Verfahren zum herstellen von halbleiteranordnungen.
DE3667496D1 (de) Verfahren zum herstellen von metallischen produkten.
DE3485930D1 (de) Mehrschichtiges keramisches substrat und verfahren zum herstellen desselben.
DE3671580D1 (de) Verfahren zum herstellen eines mehrschicht-keramiksubstrats.
DE3576900D1 (de) Verfahren zum herstellen von gedruckten schaltungen.
DE3483280D1 (de) Verfahren zum herstellen einer mehrschicht-halbleiteranordnung.
ATA220283A (de) Verfahren zum herstellen von neuen 3-benzyliden- campher-verbindungen
DE3684676D1 (de) Verfahren zum herstellen von halbleitersubstraten.
DE3483501D1 (de) Verfahren zur herstellung von keramischen koerpern.
DE3784516D1 (de) Verfahren zum herstellen von formteilen.
DE3483258D1 (de) Verfahren zum herstellen von polster-artikeln.
ATA365584A (de) Verfahren zur herstellung von 7-carboxymethoxyfuro-(3,4-c)-pyridinderivaten
DE3771670D1 (de) Verfahren zum entschleimen von triglyceridoelen.
DE3481371D1 (de) Verfahren zum herstellen kornorientierter silizium-stahlbleche.
DE3574963D1 (de) Verfahren zum verstaerken von keramischen koerpern.
DE3764554D1 (de) Verfahren zum niederschlagen von phosphorsilikatglasschichten.
DE3381293D1 (de) Verfahren zum herstellen von anisotrop leitenden schichten.
AT373258B (de) Verfahren zum herstellen von neuen 4-alkyl-8aminoalkyl-psoralenen
DE3686738D1 (de) Verfahren zum herstellen von hochreinem niob.
DE3483520D1 (de) Verfahren zum herstellen bedruckter formkoerper.

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee