DE3572564D1 - Tailoring of via-hole sidewall slope in an insulating layer - Google Patents

Tailoring of via-hole sidewall slope in an insulating layer

Info

Publication number
DE3572564D1
DE3572564D1 DE8585115907T DE3572564T DE3572564D1 DE 3572564 D1 DE3572564 D1 DE 3572564D1 DE 8585115907 T DE8585115907 T DE 8585115907T DE 3572564 T DE3572564 T DE 3572564T DE 3572564 D1 DE3572564 D1 DE 3572564D1
Authority
DE
Germany
Prior art keywords
tailoring
insulating layer
sidewall slope
hole sidewall
slope
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8585115907T
Other languages
English (en)
Inventor
Allan David Abrams
Robert Crowell Bausmith
Karey Lynn Holland
Steven Paul Holland
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE3572564D1 publication Critical patent/DE3572564D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31127—Etching organic layers
    • H01L21/31133—Etching organic layers by chemical means
    • H01L21/31138—Etching organic layers by chemical means by dry-etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31105—Etching inorganic layers
    • H01L21/31111—Etching inorganic layers by chemical means
    • H01L21/31116—Etching inorganic layers by chemical means by dry-etching
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/978—Semiconductor device manufacturing: process forming tapered edges on substrate or adjacent layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
DE8585115907T 1985-01-22 1985-12-13 Tailoring of via-hole sidewall slope in an insulating layer Expired DE3572564D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/693,698 US4624740A (en) 1985-01-22 1985-01-22 Tailoring of via-hole sidewall slope

Publications (1)

Publication Number Publication Date
DE3572564D1 true DE3572564D1 (en) 1989-09-28

Family

ID=24785728

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8585115907T Expired DE3572564D1 (en) 1985-01-22 1985-12-13 Tailoring of via-hole sidewall slope in an insulating layer

Country Status (4)

Country Link
US (1) US4624740A (de)
EP (1) EP0188735B1 (de)
JP (1) JPS61171132A (de)
DE (1) DE3572564D1 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4606998A (en) * 1985-04-30 1986-08-19 International Business Machines Corporation Barrierless high-temperature lift-off process
US4740800A (en) * 1986-02-18 1988-04-26 Canon Kabushiki Kaisha Liquid jet recording head
EP0286855A1 (de) * 1987-04-15 1988-10-19 BBC Brown Boveri AG Verfahren zum Aetzen von Vertiefungen in ein Siliziumsubstrat
US5320979A (en) * 1987-07-20 1994-06-14 Nippon Telegraph And Telephone Corporation Method of connecting wirings through connection hole
US4935278A (en) * 1988-04-28 1990-06-19 International Business Machines Corporation Thin film magnetic recording disk and fabrication process
US4883744A (en) * 1988-05-17 1989-11-28 International Business Machines Corporation Forming a polymide pattern on a substrate
US4846929A (en) * 1988-07-13 1989-07-11 Ibm Corporation Wet etching of thermally or chemically cured polyimide
EP0410635A1 (de) * 1989-07-28 1991-01-30 AT&T Corp. Verfahren zum Aetzen von Oeffnungen mit abgeschrägten Flanken bei der Herstellung von Integrierten Halbleiterschaltungsbauelementen
US5342736A (en) * 1992-01-16 1994-08-30 Industrial Technology Research Institute Method of wet etching of polyimide
US5364816A (en) * 1993-01-29 1994-11-15 The United States Of America As Represented By The Secretary Of The Navy Fabrication method for III-V heterostructure field-effect transistors
US6127276A (en) * 1998-06-02 2000-10-03 United Microelectronics Corp Method of formation for a via opening
US7060624B2 (en) * 2003-08-13 2006-06-13 International Business Machines Corporation Deep filled vias
TW201026513A (en) * 2009-01-08 2010-07-16 Univ Nat Cheng Kung Imprinting process of polyimide

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1230421A (de) * 1967-09-15 1971-05-05
US3880684A (en) * 1973-08-03 1975-04-29 Mitsubishi Electric Corp Process for preparing semiconductor
DE2636351C2 (de) * 1976-08-12 1984-01-26 Siemens AG, 1000 Berlin und 8000 München Verfahren zum Herstellen einer strukturierten Schicht auf einem Substrat
US4352870A (en) * 1979-11-27 1982-10-05 Bell Telephone Laboratories, Incorporated High resolution two-layer resists
US4369090A (en) * 1980-11-06 1983-01-18 Texas Instruments Incorporated Process for etching sloped vias in polyimide insulators
DE3175488D1 (en) * 1981-02-07 1986-11-20 Ibm Deutschland Process for the formation and the filling of holes in a layer applied to a substrate
JPS5896632A (ja) * 1981-12-02 1983-06-08 Sumitomo Bakelite Co Ltd ポリイミド系樹脂のエツチング方法
DE3225963A1 (de) * 1982-07-10 1984-01-12 Engl, Walter L., Prof. Dr.rer.nat., 5120 Herzogenrath Verfahren zur strukturierung von polyimideschichten auf halbleitersystemen
US4461672A (en) * 1982-11-18 1984-07-24 Texas Instruments, Inc. Process for etching tapered vias in silicon dioxide
JPS6018923A (ja) * 1983-07-13 1985-01-31 Hitachi Ltd ポリイミド系樹脂層のテ−パエツチング方法
US4495220A (en) * 1983-10-07 1985-01-22 Trw Inc. Polyimide inter-metal dielectric process
US4487652A (en) * 1984-03-30 1984-12-11 Motorola, Inc. Slope etch of polyimide
US4484979A (en) * 1984-04-16 1984-11-27 At&T Bell Laboratories Two-step anisotropic etching process for patterning a layer without penetrating through an underlying thinner layer
US4523976A (en) * 1984-07-02 1985-06-18 Motorola, Inc. Method for forming semiconductor devices

Also Published As

Publication number Publication date
EP0188735A1 (de) 1986-07-30
JPS61171132A (ja) 1986-08-01
EP0188735B1 (de) 1989-08-23
JPH0445974B2 (de) 1992-07-28
US4624740A (en) 1986-11-25

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee