DE3568670D1 - Encapsulating housing with thermal dissipation for electric circuits - Google Patents

Encapsulating housing with thermal dissipation for electric circuits

Info

Publication number
DE3568670D1
DE3568670D1 DE8585400844T DE3568670T DE3568670D1 DE 3568670 D1 DE3568670 D1 DE 3568670D1 DE 8585400844 T DE8585400844 T DE 8585400844T DE 3568670 T DE3568670 T DE 3568670T DE 3568670 D1 DE3568670 D1 DE 3568670D1
Authority
DE
Germany
Prior art keywords
electric circuits
thermal dissipation
encapsulating housing
cooling
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8585400844T
Other languages
English (en)
Inventor
Jean-Claude Taverdet
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
XERAM
Original Assignee
XERAM
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by XERAM filed Critical XERAM
Application granted granted Critical
Publication of DE3568670D1 publication Critical patent/DE3568670D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Casings For Electric Apparatus (AREA)
  • Motor Or Generator Frames (AREA)
DE8585400844T 1984-05-11 1985-04-29 Encapsulating housing with thermal dissipation for electric circuits Expired DE3568670D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8407297A FR2564243B1 (fr) 1984-05-11 1984-05-11 Boitier a dissipation thermique d'encapsulation de circuits electriques

Publications (1)

Publication Number Publication Date
DE3568670D1 true DE3568670D1 (en) 1989-04-13

Family

ID=9303885

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8585400844T Expired DE3568670D1 (en) 1984-05-11 1985-04-29 Encapsulating housing with thermal dissipation for electric circuits

Country Status (6)

Country Link
US (1) US4680673A (de)
EP (1) EP0165829B1 (de)
JP (1) JPS60250657A (de)
AT (1) ATE41266T1 (de)
DE (1) DE3568670D1 (de)
FR (1) FR2564243B1 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT392186B (de) * 1987-09-25 1991-02-11 Siemens Ag Oesterreich Vorrichtung zur kuehlung von bauelementen der leistungselektronik
EP0341950B1 (de) * 1988-05-09 1994-09-14 Nec Corporation Flache Kühlungsstruktur für integrierte Schaltung
MY115676A (en) * 1996-08-06 2003-08-30 Advantest Corp Printed circuit board with electronic devices mounted thereon
US6167952B1 (en) 1998-03-03 2001-01-02 Hamilton Sundstrand Corporation Cooling apparatus and method of assembling same
US6141219A (en) * 1998-12-23 2000-10-31 Sundstrand Corporation Modular power electronics die having integrated cooling apparatus
WO2002035899A1 (de) * 2000-10-24 2002-05-02 Siemens Aktiengesellschaft Kühlvorrichtung
US20050123418A1 (en) * 2003-12-08 2005-06-09 Manole Dan M. Compact compressors and refrigeration systems
US7617696B2 (en) * 2004-11-12 2009-11-17 Tecumseh Products Company Compact refrigeration system and power supply unit including dynamic insulation
US7478541B2 (en) * 2004-11-01 2009-01-20 Tecumseh Products Company Compact refrigeration system for providing multiple levels of cooling
EP3032227B1 (de) * 2014-12-08 2020-10-21 Sensirion AG Flusssensorpaket

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE760031A (fr) * 1969-12-11 1971-05-17 Rca Corp Boitier pour module de puissance hybride a semiconducteurs
DD104895A1 (de) * 1973-02-19 1974-03-20
US4180414A (en) * 1978-07-10 1979-12-25 Optical Coating Laboratory, Inc. Concentrator solar cell array module
US4266090A (en) * 1978-09-14 1981-05-05 Isotronics, Incorporated All metal flat package
JPS56150841A (en) * 1980-04-23 1981-11-21 Hitachi Ltd Cooling material for electric parts
FR2500215A1 (fr) * 1981-02-13 1982-08-20 Thomson Csf Dispositif de refroidissement d'un composant electronique de puissance, et composant encapsule dans un boitier muni d'un tel dispositif
US4450472A (en) * 1981-03-02 1984-05-22 The Board Of Trustees Of The Leland Stanford Junior University Method and means for improved heat removal in compact semiconductor integrated circuits and similar devices utilizing coolant chambers and microscopic channels
JPS5839044A (ja) * 1981-08-14 1983-03-07 ゼロツクス・コ−ポレ−シヨン 半導体装置用集積パツケ−ジ・薄膜熱交換器
FR2526585A1 (fr) * 1982-05-07 1983-11-10 Thomson Csf Boitier d'encapsulation de circuit microelectronique a haute dissipation thermique et son procede de fabrication

Also Published As

Publication number Publication date
US4680673A (en) 1987-07-14
EP0165829A1 (de) 1985-12-27
JPS60250657A (ja) 1985-12-11
EP0165829B1 (de) 1989-03-08
FR2564243A1 (fr) 1985-11-15
ATE41266T1 (de) 1989-03-15
FR2564243B1 (fr) 1987-02-20

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee