DE3482673D1 - Waermesenkeinheiten und dabei verwendete elektrische isolatoren. - Google Patents

Waermesenkeinheiten und dabei verwendete elektrische isolatoren.

Info

Publication number
DE3482673D1
DE3482673D1 DE8484303258T DE3482673T DE3482673D1 DE 3482673 D1 DE3482673 D1 DE 3482673D1 DE 8484303258 T DE8484303258 T DE 8484303258T DE 3482673 T DE3482673 T DE 3482673T DE 3482673 D1 DE3482673 D1 DE 3482673D1
Authority
DE
Germany
Prior art keywords
used therefor
electrical insulators
heat units
insulators used
units
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8484303258T
Other languages
English (en)
Inventor
William G Rodseth
Francis C Peterson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Illinois Tool Works Inc
Original Assignee
Illinois Tool Works Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Illinois Tool Works Inc filed Critical Illinois Tool Works Inc
Application granted granted Critical
Publication of DE3482673D1 publication Critical patent/DE3482673D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
DE8484303258T 1983-05-16 1984-05-14 Waermesenkeinheiten und dabei verwendete elektrische isolatoren. Expired - Fee Related DE3482673D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/495,324 US4546408A (en) 1983-05-16 1983-05-16 Electrically insulated heat sink assemblies and insulators used therein

Publications (1)

Publication Number Publication Date
DE3482673D1 true DE3482673D1 (de) 1990-08-16

Family

ID=23968199

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8484303258T Expired - Fee Related DE3482673D1 (de) 1983-05-16 1984-05-14 Waermesenkeinheiten und dabei verwendete elektrische isolatoren.

Country Status (7)

Country Link
US (1) US4546408A (de)
EP (1) EP0126606B1 (de)
JP (1) JPS59213199A (de)
BR (1) BR8402278A (de)
CA (1) CA1211862A (de)
DE (1) DE3482673D1 (de)
MX (1) MX154703A (de)

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US4853828A (en) * 1985-08-22 1989-08-01 Dart Controls, Inc. Solid state device package mounting apparatus
US4756081A (en) * 1985-08-22 1988-07-12 Dart Controls, Inc. Solid state device package mounting method
DE3633625A1 (de) * 1985-12-04 1987-06-11 Vdo Schindling Traegerplatte
US5019940A (en) * 1987-02-24 1991-05-28 Thermalloy Incorporated Mounting apparatus for electronic device packages
JPH01199497A (ja) * 1987-11-10 1989-08-10 Ibiden Co Ltd 電子部品塔載用基板
FR2639476B1 (fr) * 1988-11-24 1992-12-04 Commissariat Energie Atomique Elements composites isolants electriques et bons conducteurs thermiques et assemblages mettant en oeuvre de tels elements
DE4037488A1 (de) * 1990-11-24 1992-05-27 Bosch Gmbh Robert Leistungsbausteine mit elektrisch isolierender thermischer ankopplung
US5712517A (en) * 1992-09-15 1998-01-27 Ford Motor Company Epoxy insulator coating on an alternator heat sink
DE4237763C2 (de) * 1992-11-09 1996-01-25 Siemens Ag Vorrichtung zur isolierten Befestigung von wärmeerzeugenden Halbleiter-Bauteilen
US6369333B1 (en) * 1998-02-13 2002-04-09 Intel Corporation Flexible connection system
US6113425A (en) * 1998-02-13 2000-09-05 Intel Corporation Electro-magnetic interference shielding
US6560119B1 (en) * 1998-06-23 2003-05-06 Fujitsu Limited Fastening parts suitable for recycling
US6215667B1 (en) * 1999-12-13 2001-04-10 Motorola Inc. Mounting system and method
US6206726B1 (en) * 2000-02-17 2001-03-27 Yazaki North America, Inc. Tolerance accommodating mounting pad for junction box cover
US6487995B2 (en) * 2000-11-30 2002-12-03 Detroit Diesel Corporation Engine controller and enclosure assembly
TW527011U (en) * 2002-04-01 2003-04-01 Delta Electronics Inc Insulation device
US20040238947A1 (en) * 2003-05-28 2004-12-02 Intel Corporation Package and method for attaching an integrated heat spreader
US7158381B2 (en) * 2003-06-27 2007-01-02 Intel Corporation Heat sink assembly and method of attaching a heat sink to an electronic device on a motherboard
US20050161195A1 (en) * 2003-07-22 2005-07-28 Hein Gerald K. System for reliably removing heat from a semiconductor junction
US7170748B2 (en) * 2003-07-24 2007-01-30 Schweltzer Engineering Laboratories, Inc. Heat sink assembly for integrated circuits having a slidable contact capability with a mounting member portion of an electronic equipment chassis
US7023702B2 (en) * 2003-10-09 2006-04-04 Intel Corporation Apparatus including circuit board and heat sink and method of making the apparatus
US20050272307A1 (en) * 2004-06-02 2005-12-08 Wei-Chen Chen Mounting element
TWI339789B (en) * 2006-09-29 2011-04-01 Delta Electronics Inc Device and heat sink
US8453467B2 (en) * 2006-10-13 2013-06-04 Dell Products, Lp Hybrid heat exchanger
US7564683B2 (en) * 2007-08-30 2009-07-21 Dell Products, Lp Cooling subsystem with easily adjustable mounting assembly
US7893635B2 (en) * 2008-05-08 2011-02-22 Dell Products, Lp Liquid cooling system with automatic pump speed control
JP2010135622A (ja) * 2008-12-05 2010-06-17 Tokai Rika Co Ltd 回路基板およびこの回路基板を備えた電子機器
US7835153B2 (en) * 2008-12-30 2010-11-16 Oracle America, Inc. Heat sink mount for providing non-rigid support of overhanging portions of heat sink
CN102088833A (zh) * 2009-12-08 2011-06-08 鸿富锦精密工业（深圳）有限公司 电子装置
DE102010010926A1 (de) * 2010-03-10 2011-09-15 Knorr-Bremse Systeme für Nutzfahrzeuge GmbH Verbindungseinrichtung zum Verbinden einer elektronischen Komponente mit einem Gehäuseteil und elektronisches Steuergerät
CN102955521A (zh) * 2011-08-19 2013-03-06 鸿富锦精密工业（深圳）有限公司 主板固定装置
JP5831239B2 (ja) * 2012-01-16 2015-12-09 Tdk株式会社 バスバー及び電子機器
TW201334678A (zh) * 2012-02-15 2013-08-16 Hon Hai Prec Ind Co Ltd 散熱器組件
US9184493B2 (en) * 2012-07-24 2015-11-10 Blackberry Limited Transmission line for mobile electronic device
DE102013103815A1 (de) * 2013-04-16 2014-10-16 Bender & Wirth Gmbh & Co. LED-Halter
US11291115B2 (en) 2018-03-30 2022-03-29 Intel Corporation Server microprocessor carrier with guiding alignment anti-tilt and automatic thermal interface material separation features for use in land grid array sockets
US11557529B2 (en) * 2018-03-30 2023-01-17 Intel Corporation Mechanism combining fastener captivation and assembly tilt control for microprocessor thermal solutions
US11296009B2 (en) 2018-03-30 2022-04-05 Intel Corporation Method and apparatus for detaching a microprocessor from a heat sink
US11449111B2 (en) 2018-03-30 2022-09-20 Intel Corporation Scalable, high load, low stiffness, and small footprint loading mechanism
US11387163B2 (en) 2018-03-30 2022-07-12 Intel Corporation Scalable debris-free socket loading mechanism
CN109275304B (zh) * 2018-10-23 2020-12-22 四川深北电路科技有限公司 一种电路板安装结构
US11394227B2 (en) * 2020-05-01 2022-07-19 Lenovo (Singapore) Pte. Ltd. Power management during system startup at low temperatures
CN112053999B (zh) * 2020-08-10 2022-05-13 浙江艾罗网络能源技术股份有限公司 一种用于固定逆变器晶体管的高强度绝缘压块

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA659585A (en) * 1963-03-19 Bendix Aviation Corporation Electrically insulated, heat conducting washer
US1229911A (en) * 1915-03-27 1917-06-12 Flannery Bolt Co Nut.
US1931649A (en) * 1932-04-22 1933-10-24 Morgan & Wright Valve stem
US2305654A (en) * 1939-07-20 1942-12-22 Fram Corp Filter casing
US2432986A (en) * 1945-05-01 1947-12-23 Benjamin G Forman Nonconductive fastener
US2993950A (en) * 1959-06-17 1961-07-25 Formar Ind Inc Self-tapping non-conductive fastener
US3102571A (en) * 1960-12-12 1963-09-03 Scovill Manufacturing Co Screw fasteners
US3249680A (en) * 1964-04-14 1966-05-03 Nat Beryllia Corp Insulating, heat-sink holder for transistors
US3272952A (en) * 1965-03-17 1966-09-13 Automatic Elect Lab Mounting arrangement for an electrical component
US3369597A (en) * 1965-06-18 1968-02-20 Motorola Inc Method and apparatus for heat conduction from a flat surface of a conductor on an electrical component
US3350975A (en) * 1965-12-23 1967-11-07 Chrysler Corp Self-threading nut
US3415943A (en) * 1966-08-02 1968-12-10 Westinghouse Electric Corp Stud type base design for high power semiconductors
US3494243A (en) * 1967-06-28 1970-02-10 Standard Pressed Steel Co Sealing fastener
US3457824A (en) * 1967-09-14 1969-07-29 California Ind Prod Inc Cap nut
DE2749896A1 (de) * 1977-11-08 1979-05-10 Licentia Gmbh Gedruckte leiterplatte mit einem bauteil fuer ein elektrisches geraet, insbesondere einen rundfunkempfaenger
US4403102A (en) * 1979-11-13 1983-09-06 Thermalloy Incorporated Heat sink mounting
US4266267A (en) * 1979-11-19 1981-05-05 General Electric Company Mounting arrangement for transistors and the like
US4321423A (en) * 1980-05-15 1982-03-23 Aavid Engineering, Inc. Heat sink fastenings
DE3028722C2 (de) * 1980-07-29 1985-02-21 Siemens AG, 1000 Berlin und 8000 München Einrichtung zur Befestigung eines Hochspannungs-Leistungstransistors an einem Kühlkörper
US4446504A (en) * 1981-06-08 1984-05-01 Thermalloy Incorporated Mounting means with solderable studs
GB2105516B (en) * 1981-08-26 1985-10-09 Lucas Chloride Ev Syst Ltd Heat sink for semi-conductor devices
US4523883A (en) * 1982-10-18 1985-06-18 Illinois Tool Works Inc. Printed circuit board fastener

Also Published As

Publication number Publication date
EP0126606A3 (en) 1987-04-01
BR8402278A (pt) 1984-12-26
JPS59213199A (ja) 1984-12-03
EP0126606B1 (de) 1990-07-11
US4546408A (en) 1985-10-08
EP0126606A2 (de) 1984-11-28
MX154703A (es) 1987-12-01
CA1211862A (en) 1986-09-23

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee