GB2105516B - Heat sink for semi-conductor devices - Google Patents

Heat sink for semi-conductor devices

Info

Publication number
GB2105516B
GB2105516B GB8222464A GB8222464A GB2105516B GB 2105516 B GB2105516 B GB 2105516B GB 8222464 A GB8222464 A GB 8222464A GB 8222464 A GB8222464 A GB 8222464A GB 2105516 B GB2105516 B GB 2105516B
Authority
GB
United Kingdom
Prior art keywords
semi
heat sink
conductor devices
conductor
devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB8222464A
Other versions
GB2105516A (en
Inventor
Colin Birks
Paul Stuart Ridout
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lucas Chloride EV Systems Ltd
Original Assignee
Lucas Chloride EV Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lucas Chloride EV Systems Ltd filed Critical Lucas Chloride EV Systems Ltd
Priority to GB8222464A priority Critical patent/GB2105516B/en
Publication of GB2105516A publication Critical patent/GB2105516A/en
Application granted granted Critical
Publication of GB2105516B publication Critical patent/GB2105516B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4031—Packaged discrete devices, e.g. to-3 housings, diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
GB8222464A 1981-08-26 1982-08-04 Heat sink for semi-conductor devices Expired GB2105516B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB8222464A GB2105516B (en) 1981-08-26 1982-08-04 Heat sink for semi-conductor devices

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB8125996 1981-08-26
GB8222464A GB2105516B (en) 1981-08-26 1982-08-04 Heat sink for semi-conductor devices

Publications (2)

Publication Number Publication Date
GB2105516A GB2105516A (en) 1983-03-23
GB2105516B true GB2105516B (en) 1985-10-09

Family

ID=26280571

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8222464A Expired GB2105516B (en) 1981-08-26 1982-08-04 Heat sink for semi-conductor devices

Country Status (1)

Country Link
GB (1) GB2105516B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4546408A (en) * 1983-05-16 1985-10-08 Illinois Tool Works Inc. Electrically insulated heat sink assemblies and insulators used therein

Also Published As

Publication number Publication date
GB2105516A (en) 1983-03-23

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee