DE3481248D1 - Verfahren zur bildung eines substrats zur automatischen bandmontage elektronischer schaltungselemente. - Google Patents

Verfahren zur bildung eines substrats zur automatischen bandmontage elektronischer schaltungselemente.

Info

Publication number
DE3481248D1
DE3481248D1 DE8484115981T DE3481248T DE3481248D1 DE 3481248 D1 DE3481248 D1 DE 3481248D1 DE 8484115981 T DE8484115981 T DE 8484115981T DE 3481248 T DE3481248 T DE 3481248T DE 3481248 D1 DE3481248 D1 DE 3481248D1
Authority
DE
Germany
Prior art keywords
substrate
forming
electronic circuit
circuit elements
tape mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8484115981T
Other languages
English (en)
Inventor
Michael J Maxwell
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rogers Corp
Original Assignee
Rogers Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rogers Corp filed Critical Rogers Corp
Application granted granted Critical
Publication of DE3481248D1 publication Critical patent/DE3481248D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1056—Perforating lamina
    • Y10T156/1057—Subsequent to assembly of laminae
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y10T428/24322—Composite web or sheet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
DE8484115981T 1983-12-27 1984-12-20 Verfahren zur bildung eines substrats zur automatischen bandmontage elektronischer schaltungselemente. Expired - Fee Related DE3481248D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/565,463 US4571354A (en) 1983-12-27 1983-12-27 Tape automated bonding of integrated circuits

Publications (1)

Publication Number Publication Date
DE3481248D1 true DE3481248D1 (de) 1990-03-08

Family

ID=24258720

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8484115981T Expired - Fee Related DE3481248D1 (de) 1983-12-27 1984-12-20 Verfahren zur bildung eines substrats zur automatischen bandmontage elektronischer schaltungselemente.

Country Status (5)

Country Link
US (1) US4571354A (de)
EP (1) EP0147807B1 (de)
JP (1) JPS60221000A (de)
CA (1) CA1218761A (de)
DE (1) DE3481248D1 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4674808A (en) * 1985-11-12 1987-06-23 Fairchild Semiconductor Corporation Signal ground planes for tape bonded devices
US4681654A (en) * 1986-05-21 1987-07-21 International Business Machines Corporation Flexible film semiconductor chip carrier
IN171404B (de) * 1986-08-27 1992-10-03 Digital Equipment Corp
US4899207A (en) * 1986-08-27 1990-02-06 Digital Equipment Corporation Outer lead tape automated bonding
US4979663A (en) * 1986-08-27 1990-12-25 Digital Equipment Corporation Outer lead tape automated bonding system
US5311056A (en) * 1988-10-21 1994-05-10 Shinko Electric Industries Co., Ltd. Semiconductor device having a bi-level leadframe
US5106461A (en) * 1989-04-04 1992-04-21 Massachusetts Institute Of Technology High-density, multi-level interconnects, flex circuits, and tape for tab
US4980034A (en) * 1989-04-04 1990-12-25 Massachusetts Institute Of Technology High-density, multi-level interconnects, flex circuits, and tape for TAB
JP2617356B2 (ja) * 1989-06-07 1997-06-04 株式会社新川 タブテ−プボンディング装置
US4948645A (en) * 1989-08-01 1990-08-14 Rogers Corporation Tape automated bonding and method of making the same
US5061988A (en) * 1990-07-30 1991-10-29 Mcdonnell Douglas Corporation Integrated circuit chip interconnect
JP3520186B2 (ja) * 1996-09-30 2004-04-19 東芝マイクロエレクトロニクス株式会社 フィルムキャリアテープの製造方法、フィルムキャリアテープの製造装置
US20060031879A1 (en) * 2004-04-30 2006-02-09 Vulcan Inc. Management and non-linear presentation of news-related broadcasted or streamed multimedia content
US8356407B2 (en) * 2005-09-29 2013-01-22 Dow Corning Corporation Method of releasing high temperature films and/or devices from metallic substrates
JP5117243B2 (ja) * 2008-03-27 2013-01-16 株式会社オーク製作所 露光装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4089733A (en) * 1975-09-12 1978-05-16 Amp Incorporated Method of forming complex shaped metal-plastic composite lead frames for IC packaging
US4007479A (en) * 1976-03-29 1977-02-08 Honeywell Information Systems, Inc. Fixture for an integrated circuit chip
JPS5346276A (en) * 1976-10-08 1978-04-25 Hitachi Ltd Carrier tape
JPS53149763A (en) * 1977-06-01 1978-12-27 Citizen Watch Co Ltd Mounting method of semiconductor integrate circuit
US4195195A (en) * 1978-09-28 1980-03-25 The United States Of America As Represented By The Secretary Of The Army Tape automated bonding test board
JPS5924542B2 (ja) * 1979-07-23 1984-06-09 三菱電機株式会社 半導体装置用基板の製造方法
JPS5635452A (en) * 1979-08-30 1981-04-08 Nec Corp Connecting lead wire for semiconductor device
US4472762A (en) * 1980-09-25 1984-09-18 Texas Instruments Incorporated Electronic circuit interconnection system
GB2093401B (en) * 1981-01-17 1985-07-17 Sanyo Electric Co Composite film
US4407872A (en) * 1981-06-02 1983-10-04 Ricoh Co. Ltd. Sheet material and envelope for packaging electronic parts
US4459607A (en) * 1981-06-18 1984-07-10 Burroughs Corporation Tape automated wire bonded integrated circuit chip assembly
US4390598A (en) * 1982-04-05 1983-06-28 Fairchild Camera & Instrument Corp. Lead format for tape automated bonding
DE3219055A1 (de) * 1982-05-21 1983-11-24 Telefonbau Und Normalzeit Gmbh, 6000 Frankfurt Verfahren zur herstellung eines filmtraegers mit leiterstrukturen

Also Published As

Publication number Publication date
CA1218761A (en) 1987-03-03
US4571354A (en) 1986-02-18
EP0147807A3 (en) 1986-12-30
EP0147807B1 (de) 1990-01-31
JPS60221000A (ja) 1985-11-05
EP0147807A2 (de) 1985-07-10

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee