DE3480985D1 - Waermesenke unter anwendung eines diamanten. - Google Patents

Waermesenke unter anwendung eines diamanten.

Info

Publication number
DE3480985D1
DE3480985D1 DE8484307061T DE3480985T DE3480985D1 DE 3480985 D1 DE3480985 D1 DE 3480985D1 DE 8484307061 T DE8484307061 T DE 8484307061T DE 3480985 T DE3480985 T DE 3480985T DE 3480985 D1 DE3480985 D1 DE 3480985D1
Authority
DE
Germany
Prior art keywords
diamond
heat sink
sink
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8484307061T
Other languages
English (en)
Inventor
Ralph Melville Eaton
Michael William Geen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Plessey Overseas Ltd
Original Assignee
Plessey Overseas Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Plessey Overseas Ltd filed Critical Plessey Overseas Ltd
Application granted granted Critical
Publication of DE3480985D1 publication Critical patent/DE3480985D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3732—Diamonds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE8484307061T 1983-10-26 1984-10-16 Waermesenke unter anwendung eines diamanten. Expired - Fee Related DE3480985D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB838328573A GB8328573D0 (en) 1983-10-26 1983-10-26 Diamond heatsink assemblies

Publications (1)

Publication Number Publication Date
DE3480985D1 true DE3480985D1 (de) 1990-02-08

Family

ID=10550749

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8484307061T Expired - Fee Related DE3480985D1 (de) 1983-10-26 1984-10-16 Waermesenke unter anwendung eines diamanten.

Country Status (4)

Country Link
US (1) US4582954A (de)
EP (1) EP0139517B1 (de)
DE (1) DE3480985D1 (de)
GB (2) GB8328573D0 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4688076A (en) * 1983-04-22 1987-08-18 The Charles Stark Draper Laboratory, Inc. Noise reducing heat sink for semiconductor laser diodes
JPS62194652A (ja) * 1986-02-21 1987-08-27 Hitachi Ltd 半導体装置
US5432535A (en) * 1992-12-18 1995-07-11 Xerox Corporation Method and apparatus for fabrication of multibeam lasers
US5388027A (en) * 1993-07-29 1995-02-07 Motorola, Inc. Electronic circuit assembly with improved heatsinking
US5566752A (en) * 1994-10-20 1996-10-22 Lockheed Fort Worth Company High heat density transfer device
US5859477A (en) * 1995-07-10 1999-01-12 International Packaging And Assembly Corporation Apparatus for encapsulating IC packages with diamond substrate thermal conductor
US5895972A (en) * 1996-12-31 1999-04-20 Intel Corporation Method and apparatus for cooling the backside of a semiconductor device using an infrared transparent heat slug
US5923086A (en) * 1997-05-14 1999-07-13 Intel Corporation Apparatus for cooling a semiconductor die
US6570247B1 (en) 1997-12-30 2003-05-27 Intel Corporation Integrated circuit device having an embedded heat slug
US7145998B1 (en) * 2002-07-29 2006-12-05 Bellsouth Intellectual Property Corporation Systems, methods, and devices for a callback/callback reminder feature
US7713839B2 (en) * 2004-10-06 2010-05-11 Intel Corporation Diamond substrate formation for electronic assemblies
US20070004216A1 (en) * 2005-06-30 2007-01-04 Chuan Hu Formation of assemblies with a diamond heat spreader
US20070295496A1 (en) * 2006-06-23 2007-12-27 Hall David R Diamond Composite Heat Spreader

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL6903862A (de) * 1969-03-13 1970-09-15
US3678995A (en) * 1970-06-22 1972-07-25 Rca Corp Support for electrical components and method of making the same
IL39936A (en) * 1971-07-30 1975-04-25 De Beers Ind Diamond A diamond particle particularly for use in heat sinks
US3872496A (en) * 1973-09-13 1975-03-18 Sperry Rand Corp High frequency diode having simultaneously formed high strength bonds with respect to a diamond heat sink and said diode
JPS5837713B2 (ja) * 1978-12-01 1983-08-18 富士通株式会社 半導体レ−ザ−装置の製造方法
SU855793A1 (ru) * 1979-07-02 1981-08-15 Одесский Ордена Трудового Красного Знамени Государственный Университет Им.И.И.Мечникова Способ получени теплоотвода дл полупроводниковых приборов
US4536469A (en) * 1981-11-23 1985-08-20 Raytheon Company Semiconductor structures and manufacturing methods
JPS60861A (ja) * 1983-06-16 1985-01-05 Toyota Motor Corp 多コ−ト１ベ−ク型塗料の塗装方法およびその塗装々置

Also Published As

Publication number Publication date
EP0139517B1 (de) 1990-01-03
EP0139517A3 (en) 1986-09-17
GB2149207B (en) 1987-08-12
US4582954A (en) 1986-04-15
GB8328573D0 (en) 1983-11-30
EP0139517A2 (de) 1985-05-02
GB8426433D0 (en) 1984-11-28
GB2149207A (en) 1985-06-05

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee