DE3480984D1 - Verbindungseinrichtung mit knoepfen fuer einen chip und eine schaltungsplatte. - Google Patents

Verbindungseinrichtung mit knoepfen fuer einen chip und eine schaltungsplatte.

Info

Publication number
DE3480984D1
DE3480984D1 DE8484303285T DE3480984T DE3480984D1 DE 3480984 D1 DE3480984 D1 DE 3480984D1 DE 8484303285 T DE8484303285 T DE 8484303285T DE 3480984 T DE3480984 T DE 3480984T DE 3480984 D1 DE3480984 D1 DE 3480984D1
Authority
DE
Germany
Prior art keywords
buttons
chip
circuit board
connecting device
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8484303285T
Other languages
German (de)
English (en)
Inventor
Robert Smolley
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Northrop Grumman Space and Mission Systems Corp
Original Assignee
TRW Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TRW Inc filed Critical TRW Inc
Application granted granted Critical
Publication of DE3480984D1 publication Critical patent/DE3480984D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
  • Push-Button Switches (AREA)
DE8484303285T 1983-05-31 1984-05-15 Verbindungseinrichtung mit knoepfen fuer einen chip und eine schaltungsplatte. Expired - Fee Related DE3480984D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US49913783A 1983-05-31 1983-05-31

Publications (1)

Publication Number Publication Date
DE3480984D1 true DE3480984D1 (de) 1990-02-08

Family

ID=23983990

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8484303285T Expired - Fee Related DE3480984D1 (de) 1983-05-31 1984-05-15 Verbindungseinrichtung mit knoepfen fuer einen chip und eine schaltungsplatte.

Country Status (4)

Country Link
EP (1) EP0127377B1 (https=)
JP (1) JPS605534A (https=)
KR (1) KR910006953B1 (https=)
DE (1) DE3480984D1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8530098D0 (en) * 1985-12-06 1986-01-15 Boudry M R Image reproduction
US4733172A (en) * 1986-03-08 1988-03-22 Trw Inc. Apparatus for testing I.C. chip

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE31114E (en) * 1975-11-13 1982-12-28 Tektronix, Inc. Electrical connector
CA1073557A (en) * 1976-06-30 1980-03-11 Ven Y. Doo Multilayer interconnect system, and method of making
JPS536872A (en) * 1976-07-07 1978-01-21 Minnesota Mining & Mfg Connector
DE2912202B1 (de) * 1979-03-28 1980-10-02 Metz App Werke Inh Paul Metz Anordnung einer integrierten Schaltung auf einer Leiterplatte
US4387388A (en) * 1980-07-14 1983-06-07 Ncr Corporation Package and connector receptacle
JPS5792843A (en) * 1980-11-29 1982-06-09 Toshiba Corp Semiconductor device
US4395084A (en) * 1981-07-06 1983-07-26 Teledyne Industries, Inc. Electrical socket for leadless integrated circuit packages
US4437718A (en) * 1981-12-17 1984-03-20 Motorola Inc. Non-hermetically sealed stackable chip carrier package

Also Published As

Publication number Publication date
JPS605534A (ja) 1985-01-12
EP0127377A2 (en) 1984-12-05
KR850000905A (ko) 1985-03-09
EP0127377B1 (en) 1990-01-03
EP0127377A3 (en) 1985-04-10
KR910006953B1 (ko) 1991-09-14
JPH0240215B2 (https=) 1990-09-10

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee