DE3480677D1 - Fokussierende magneten-zerstaeubungsvorrichtung. - Google Patents

Fokussierende magneten-zerstaeubungsvorrichtung.

Info

Publication number
DE3480677D1
DE3480677D1 DE8484301651T DE3480677T DE3480677D1 DE 3480677 D1 DE3480677 D1 DE 3480677D1 DE 8484301651 T DE8484301651 T DE 8484301651T DE 3480677 T DE3480677 T DE 3480677T DE 3480677 D1 DE3480677 D1 DE 3480677D1
Authority
DE
Germany
Prior art keywords
sprayer
focusing magnetic
focusing
magnetic
magnetic sprayer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8484301651T
Other languages
English (en)
Inventor
Walter H Class
Robert G Hieronymi
Steven D Hurwitt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Materials Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Materials Research Corp filed Critical Materials Research Corp
Application granted granted Critical
Publication of DE3480677D1 publication Critical patent/DE3480677D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/34Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411Constructional aspects of the reactor
    • H01J37/3414Targets
    • H01J37/3423Shape
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/34Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405Magnetron sputtering
    • H01J37/3408Planar magnetron sputtering

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
DE8484301651T 1983-05-25 1984-03-12 Fokussierende magneten-zerstaeubungsvorrichtung. Expired - Lifetime DE3480677D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/497,798 US4428816A (en) 1983-05-25 1983-05-25 Focusing magnetron sputtering apparatus

Publications (1)

Publication Number Publication Date
DE3480677D1 true DE3480677D1 (de) 1990-01-11

Family

ID=23978358

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8484301651T Expired - Lifetime DE3480677D1 (de) 1983-05-25 1984-03-12 Fokussierende magneten-zerstaeubungsvorrichtung.

Country Status (5)

Country Link
US (1) US4428816A (de)
EP (1) EP0127272B1 (de)
JP (1) JPS59229481A (de)
CA (1) CA1206119A (de)
DE (1) DE3480677D1 (de)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5976875A (ja) * 1982-10-22 1984-05-02 Hitachi Ltd マグネトロン型スパッタ装置とそれに用いるターゲット
JPS60152671A (ja) * 1984-01-20 1985-08-10 Anelva Corp スパツタリング電極
US4606806A (en) * 1984-05-17 1986-08-19 Varian Associates, Inc. Magnetron sputter device having planar and curved targets
US4627904A (en) * 1984-05-17 1986-12-09 Varian Associates, Inc. Magnetron sputter device having separate confining magnetic fields to separate targets and magnetically enhanced R.F. bias
EP0163445B1 (de) * 1984-05-17 1991-01-30 Varian Associates, Inc. Magnetron-Zerstäubungs-Vorrichtung mit ebenen und konkaven Auftreffplatten
CH664303A5 (de) * 1985-04-03 1988-02-29 Balzers Hochvakuum Haltevorrichtung fuer targets fuer kathodenzerstaeubung.
CH669242A5 (de) * 1985-07-10 1989-02-28 Balzers Hochvakuum Targetplatte fuer kathodenzerstaeubung.
US4828668A (en) * 1986-03-10 1989-05-09 Semiconductor Energy Laboratory Co., Ltd. Sputtering system for deposition on parallel substrates
US4855033A (en) * 1986-04-04 1989-08-08 Materials Research Corporation Cathode and target design for a sputter coating apparatus
CA1308060C (en) * 1986-04-04 1992-09-29 Tokyo Electron Limited Cathode and target design for a sputter coating apparatus
US4738761A (en) * 1986-10-06 1988-04-19 Microelectronics Center Of North Carolina Shared current loop, multiple field apparatus and process for plasma processing
IT1211938B (it) * 1987-11-27 1989-11-08 Siv Soc Italiana Vetro Apparecchiatura e procedimento per la deposizione di uno strato sottile su un substrato trasparente, particolarmente per la realizzazione di vetrature
US4842703A (en) * 1988-02-23 1989-06-27 Eaton Corporation Magnetron cathode and method for sputter coating
US4892633A (en) * 1988-11-14 1990-01-09 Vac-Tec Systems, Inc. Magnetron sputtering cathode
US4865708A (en) * 1988-11-14 1989-09-12 Vac-Tec Systems, Inc. Magnetron sputtering cathode
US4915805A (en) * 1988-11-21 1990-04-10 At&T Bell Laboratories Hollow cathode type magnetron apparatus construction
US5045166A (en) * 1990-05-21 1991-09-03 Mcnc Magnetron method and apparatus for producing high density ionic gas discharge
US5490914A (en) * 1995-02-14 1996-02-13 Sony Corporation High utilization sputtering target for cathode assembly
DE19648390A1 (de) * 1995-09-27 1998-05-28 Leybold Materials Gmbh Target für die Sputterkathode einer Vakuumbeschichtungsanlage
US5863399A (en) * 1996-04-13 1999-01-26 Singulus Technologies Gmbh Device for cathode sputtering
DE19614599A1 (de) * 1996-04-13 1997-10-16 Singulus Technologies Gmbh Vorrichtung zur Kathodenzerstäubung
DE19614595A1 (de) * 1996-04-13 1997-10-16 Singulus Technologies Gmbh Vorrichtung zur Kathodenzerstäubung
US6045670A (en) * 1997-01-08 2000-04-04 Applied Materials, Inc. Back sputtering shield
DE19806879A1 (de) * 1998-02-19 1999-08-26 Leybold Materials Gmbh Target für die Sputterkathode einer Vakuumbeschichtungsanlage und Verfahren zu seiner Herstellung
US6217716B1 (en) 1998-05-06 2001-04-17 Novellus Systems, Inc. Apparatus and method for improving target erosion in hollow cathode magnetron sputter source
JP3076311B2 (ja) * 1998-10-06 2000-08-14 株式会社日鉱マテリアルズ 酸化物焼結体スパッタリングターゲット組立体
US6444100B1 (en) 2000-02-11 2002-09-03 Seagate Technology Llc Hollow cathode sputter source
US20060102871A1 (en) * 2003-04-08 2006-05-18 Xingwu Wang Novel composition
US20080017501A1 (en) * 2006-07-21 2008-01-24 Makoto Inagawa Cooled dark space shield for multi-cathode design
US20080173541A1 (en) * 2007-01-22 2008-07-24 Eal Lee Target designs and related methods for reduced eddy currents, increased resistance and resistivity, and enhanced cooling
TWI338721B (en) * 2009-10-16 2011-03-11 Suntek Prec Corp A sputtering apparatus with a side target and a method for sputtering a workpiece having non-planer surfaces
CN108422151B (zh) * 2017-06-15 2019-05-31 甘肃虹光电子有限责任公司 一种捷变频磁控管“热卡”的解决方法
US20240258087A1 (en) * 2022-12-12 2024-08-01 Intevac, Inc. Cylindrical cathode and chamber using same for sputtering

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
HU179482B (en) * 1979-02-19 1982-10-28 Mikroelektronikai Valalat Penning pulverizel source

Also Published As

Publication number Publication date
EP0127272A2 (de) 1984-12-05
EP0127272A3 (en) 1987-01-07
US4428816A (en) 1984-01-31
JPH0381256B2 (de) 1991-12-27
EP0127272B1 (de) 1989-12-06
CA1206119A (en) 1986-06-17
JPS59229481A (ja) 1984-12-22

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee
8327 Change in the person/name/address of the patent owner

Owner name: TOKYO ELECTRON LTD., TOKIO/TOKYO, JP

8328 Change in the person/name/address of the agent

Free format text: EISENFUEHR, SPEISER & PARTNER, 28195 BREMEN