DE3477455D1 - Manufacture of connection holes in plastic plates and application of the method - Google Patents

Manufacture of connection holes in plastic plates and application of the method

Info

Publication number
DE3477455D1
DE3477455D1 DE8484108324T DE3477455T DE3477455D1 DE 3477455 D1 DE3477455 D1 DE 3477455D1 DE 8484108324 T DE8484108324 T DE 8484108324T DE 3477455 T DE3477455 T DE 3477455T DE 3477455 D1 DE3477455 D1 DE 3477455D1
Authority
DE
Germany
Prior art keywords
manufacture
application
connection holes
plastic plates
plastic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8484108324T
Other languages
German (de)
English (en)
Inventor
Werner Cziep
Ulrich Dr Dipl Chem Kunzel
Wolf-Dieter Dipl Ing Ruh
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
IBM Deutschland GmbH
International Business Machines Corp
Original Assignee
IBM Deutschland GmbH
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by IBM Deutschland GmbH, International Business Machines Corp filed Critical IBM Deutschland GmbH
Application granted granted Critical
Publication of DE3477455D1 publication Critical patent/DE3477455D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0041—Etching of the substrate by chemical or physical means by plasma etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0554—Metal used as mask for etching vias, e.g. by laser ablation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • ing And Chemical Polishing (AREA)
DE8484108324T 1984-07-16 1984-07-16 Manufacture of connection holes in plastic plates and application of the method Expired DE3477455D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP84108324A EP0168509B1 (de) 1984-07-16 1984-07-16 Herstellung von Verbindungslöchern in Kunstoffplatten und Anwendung des Verfahrens

Publications (1)

Publication Number Publication Date
DE3477455D1 true DE3477455D1 (en) 1989-04-27

Family

ID=8192056

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8484108324T Expired DE3477455D1 (en) 1984-07-16 1984-07-16 Manufacture of connection holes in plastic plates and application of the method

Country Status (4)

Country Link
US (2) US5022956A (OSRAM)
EP (1) EP0168509B1 (OSRAM)
JP (1) JPS6132595A (OSRAM)
DE (1) DE3477455D1 (OSRAM)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE59208606D1 (de) * 1991-02-28 1997-07-17 Heinze Dyconex Patente Verfahren zur herstellung eines aus mikrosieben bestehenden verbundkörpers
US5698299A (en) * 1991-02-28 1997-12-16 Dyconex Patente Ag Thin laminated microstructure with precisely aligned openings
CH681758A5 (en) * 1991-02-28 1993-05-14 Dyconex Patente Ag C O Heinze Plastics foil micro-sieve
US5360948A (en) * 1992-08-14 1994-11-01 Ncr Corporation Via programming for multichip modules
JPH06334301A (ja) * 1993-05-19 1994-12-02 Murata Mfg Co Ltd スル−ホ−ル配線基板の加工方法
US5840402A (en) * 1994-06-24 1998-11-24 Sheldahl, Inc. Metallized laminate material having ordered distribution of conductive through holes
DE4438777A1 (de) * 1994-10-18 1996-05-02 Atotech Deutschland Gmbh Verfahren zur Herstellung elektrischer Schaltungsträger
US6820330B1 (en) * 1996-12-13 2004-11-23 Tessera, Inc. Method for forming a multi-layer circuit assembly
US6020049A (en) * 1997-12-02 2000-02-01 Cucinotta; Anthony J Product for producing viaholes in reinforced laminates and the related method for manufacturing viaholes
EP1318704A1 (en) * 2001-10-16 2003-06-11 Ultratera Corporation Printed circuit board micro hole processing method
KR20030033633A (ko) * 2001-10-24 2003-05-01 울트라테라 코포레이션 인쇄 회로 기판에 미세 구멍을 형성하는 방법
TW573327B (en) * 2002-12-27 2004-01-21 Ultratera Corp Plasma etching method
WO2005022556A2 (en) * 2003-09-02 2005-03-10 Integral Technologies, Inc. Very low resistance electrical interfaces to conductive loaded resin-based materials
NZ554892A (en) * 2004-10-21 2010-01-29 Englebienne & Associates Stable metal/conductive polymer composite colloids and methods for making and using the same
JP2010041045A (ja) * 2008-07-09 2010-02-18 Semiconductor Energy Lab Co Ltd 半導体装置及びその作製方法
US8603900B2 (en) * 2009-10-27 2013-12-10 Varian Semiconductor Equipment Associates, Inc. Reducing surface recombination and enhancing light trapping in solar cells
US9478428B2 (en) 2010-10-05 2016-10-25 Skyworks Solutions, Inc. Apparatus and methods for shielding a plasma etcher electrode
US20120083129A1 (en) 2010-10-05 2012-04-05 Skyworks Solutions, Inc. Apparatus and methods for focusing plasma
US8357263B2 (en) * 2010-10-05 2013-01-22 Skyworks Solutions, Inc. Apparatus and methods for electrical measurements in a plasma etcher
JP2017088467A (ja) * 2015-11-16 2017-05-25 旭硝子株式会社 ガラス基板に孔を形成する装置および方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3099608A (en) * 1959-12-30 1963-07-30 Ibm Method of electroplating on a dielectric base
US3778900A (en) * 1970-09-04 1973-12-18 Ibm Method for forming interconnections between circuit layers of a multi-layer package
US4012307A (en) * 1975-12-05 1977-03-15 General Dynamics Corporation Method for conditioning drilled holes in multilayer wiring boards
US4247600A (en) * 1978-07-28 1981-01-27 Minolta Camera Kabushiki Kaisha Metallized plastic camera housing and method
US4367119A (en) * 1980-08-18 1983-01-04 International Business Machines Corporation Planar multi-level metal process with built-in etch stop
US4447824A (en) * 1980-08-18 1984-05-08 International Business Machines Corporation Planar multi-level metal process with built-in etch stop
US4597828A (en) * 1985-03-25 1986-07-01 Firan Corporation Method of manufacturing printed circuit boards

Also Published As

Publication number Publication date
US5022956A (en) 1991-06-11
JPH0257356B2 (OSRAM) 1990-12-04
EP0168509A1 (de) 1986-01-22
EP0168509B1 (de) 1989-03-22
US4834835A (en) 1989-05-30
JPS6132595A (ja) 1986-02-15

Similar Documents

Publication Publication Date Title
EP0162603A3 (en) Electrochemical device and method of manufacturing the same
DE3568015D1 (en) Laminate structure and production of the same
EP0178606A3 (en) Molecular controlled structure and method of manufacturing the same
EP0332402A3 (en) Connection construction and method of manufacturing the same
PT80297A (en) Laminated material and method for manufacturing the same
EP0159165A3 (en) Water-absorbing laminate and production process thereof
GB2171047B (en) Method of molding and molding machine
EP0317838A3 (en) Ultra-black film and method of manufacturing the same
GB2164762B (en) Retroreflective particles and method of making the same
EP0220898A3 (en) Elastic mould and method for manufactring the same
ZA857957B (en) High strenght fastener and method
EP0133657A3 (en) Thermoplastic composition and process
EP0225176A3 (en) Composite and method of manufacturing the same
EP0184081A3 (en) Perfluoroalkylvinyl polymer and production and use thereof
ZA857124B (en) 13-halomilbemycins and 13-hydroxymilbemycins
EP0225802A3 (en) Adhesion structures and method of producing the same
GB2224742B (en) Polyanhydride-siloxanes and polymide-siloxanes obtained therefrom
DE3464860D1 (en) Structural members and methods of fabricating the same
DE3560036D1 (en) Process for the preparation of polyamines and their use in the preparation of polyisocyanates
DE3470076D1 (en) Obturating structures and parts thereof
DE3562486D1 (en) Arginyl-3-carboxy-4-hydroxyanilide and their use
DE3460788D1 (en) Pallet and method of manufacturing the same
GB2169028B (en) Hinge and method of producing the same
DE3475438D1 (en) Electrochemical cell and method of producing the same
GB8419509D0 (en) Penetrationresistant joints and assemblies

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee