DE3475142D1 - Heat sink structure for an electronic package - Google Patents
Heat sink structure for an electronic packageInfo
- Publication number
- DE3475142D1 DE3475142D1 DE8484105835T DE3475142T DE3475142D1 DE 3475142 D1 DE3475142 D1 DE 3475142D1 DE 8484105835 T DE8484105835 T DE 8484105835T DE 3475142 T DE3475142 T DE 3475142T DE 3475142 D1 DE3475142 D1 DE 3475142D1
- Authority
- DE
- Germany
- Prior art keywords
- heat sink
- electronic package
- sink structure
- package
- electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/497,781 US4546405A (en) | 1983-05-25 | 1983-05-25 | Heat sink for electronic package |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3475142D1 true DE3475142D1 (en) | 1988-12-15 |
Family
ID=23978280
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8484105835T Expired DE3475142D1 (en) | 1983-05-25 | 1984-05-23 | Heat sink structure for an electronic package |
Country Status (4)
Country | Link |
---|---|
US (1) | US4546405A (de) |
EP (1) | EP0127115B1 (de) |
JP (1) | JPS59217345A (de) |
DE (1) | DE3475142D1 (de) |
Families Citing this family (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA1235528A (en) * | 1984-10-11 | 1988-04-19 | Teradyne, Inc. | Heat dissipation for electronic components on ceramic substrate |
US4695924A (en) * | 1986-07-17 | 1987-09-22 | Zenith Electronics Corporation | Two piece heat sink with serrated coupling |
US5063476A (en) * | 1989-12-05 | 1991-11-05 | Digital Equipment Corporation | Apparatus for controlled air-impingement module cooling |
SE467721B (sv) * | 1990-12-20 | 1992-08-31 | Ericsson Telefon Ab L M | Saett att tillverka vaermeoeverfoeringsorgan samt verktyg foer att genomfoera saettet |
US5288203A (en) * | 1992-10-23 | 1994-02-22 | Thomas Daniel L | Low profile fan body with heat transfer characteristics |
US5484262A (en) * | 1992-10-23 | 1996-01-16 | Nidec Corporation | Low profile fan body with heat transfer characteristics |
US5351748A (en) * | 1993-01-21 | 1994-10-04 | Baruch Dagan | Tubular pin fin heat sink for electronic components |
US5452181A (en) * | 1994-02-07 | 1995-09-19 | Nidec Corporation | Detachable apparatus for cooling integrated circuits |
DE9404266U1 (de) * | 1994-03-14 | 1994-05-19 | Siemens Nixdorf Informationssysteme AG, 33106 Paderborn | Kühl- und Abschirmvorrichtung für eine integrierte Schaltung |
US5532513A (en) * | 1994-07-08 | 1996-07-02 | Johnson Matthey Electronics, Inc. | Metal-ceramic composite lid |
US5701951A (en) * | 1994-12-20 | 1997-12-30 | Jean; Amigo | Heat dissipation device for an integrated circuit |
US6208513B1 (en) * | 1995-01-17 | 2001-03-27 | Compaq Computer Corporation | Independently mounted cooling fins for a low-stress semiconductor package |
US5673177A (en) * | 1995-08-01 | 1997-09-30 | International Business Machines Corporation | Heat sink structure with corrugated wound wire heat conductive elements |
US5785116A (en) * | 1996-02-01 | 1998-07-28 | Hewlett-Packard Company | Fan assisted heat sink device |
US5740013A (en) * | 1996-07-03 | 1998-04-14 | Hewlett-Packard Company | Electronic device enclosure having electromagnetic energy containment and heat removal characteristics |
US5794685A (en) * | 1996-12-17 | 1998-08-18 | Hewlett-Packard Company | Heat sink device having radial heat and airflow paths |
EP0883179A3 (de) * | 1997-06-04 | 2000-04-26 | Lsi Logic Corporation | Wärmesenke mit Spiralstiftrippen für elektronische Packungen |
TW444158B (en) * | 1998-07-08 | 2001-07-01 | Hon Hai Prec Ind Co Ltd | Heat sink device and its manufacture method |
US6176299B1 (en) | 1999-02-22 | 2001-01-23 | Agilent Technologies, Inc. | Cooling apparatus for electronic devices |
DE19912240A1 (de) * | 1999-03-18 | 2000-09-28 | Siemens Ag | Bauelement und Verfahren zur Herstellung des Bauelementes |
US6478082B1 (en) * | 2000-05-22 | 2002-11-12 | Jia Hao Li | Heat dissipating apparatus with nest wind duct |
TW566838U (en) * | 2003-04-25 | 2003-12-11 | Hon Hai Prec Ind Co Ltd | Heat sink |
US7714451B2 (en) * | 2005-02-18 | 2010-05-11 | Stats Chippac Ltd. | Semiconductor package system with thermal die bonding |
CN2875001Y (zh) * | 2005-12-23 | 2007-02-28 | 鸿富锦精密工业(深圳)有限公司 | 散热器 |
US20070247851A1 (en) * | 2006-04-21 | 2007-10-25 | Villard Russel G | Light Emitting Diode Lighting Package With Improved Heat Sink |
US7967062B2 (en) * | 2006-06-16 | 2011-06-28 | International Business Machines Corporation | Thermally conductive composite interface, cooled electronic assemblies employing the same, and methods of fabrication thereof |
US7362575B2 (en) * | 2006-07-17 | 2008-04-22 | Sun Microsystems, Inc. | Cooling method use diamond pins and heat pipes |
US7589968B1 (en) * | 2007-06-11 | 2009-09-15 | Majr Products Corp. | Heat-dissipating electromagnetic shield |
US8459053B2 (en) | 2007-10-08 | 2013-06-11 | Emerson Climate Technologies, Inc. | Variable speed compressor protection system and method |
US20090255658A1 (en) * | 2008-04-10 | 2009-10-15 | Asia Vital Components Co., Ltd. | Heat dissipation module |
US20090321045A1 (en) * | 2008-06-30 | 2009-12-31 | Alcatel-Lucent Technologies Inc. | Monolithic structurally complex heat sink designs |
US8148206B2 (en) * | 2009-10-27 | 2012-04-03 | Freescale Semiconductor, Inc. | Package for high power integrated circuits and method for forming |
US11094605B2 (en) | 2018-02-27 | 2021-08-17 | Ball Aerospace & Technologies Corp. | Systems and methods for supporting a component |
US10658262B2 (en) * | 2018-02-27 | 2020-05-19 | Ball Aerospace & Technologies Corp. | Pin flexure array |
US11206743B2 (en) | 2019-07-25 | 2021-12-21 | Emerson Climate Technolgies, Inc. | Electronics enclosure with heat-transfer element |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3030553A (en) * | 1958-12-29 | 1962-04-17 | Marcus G Comuntzis | Ruggedized electronic packaging |
US3198990A (en) * | 1961-12-01 | 1965-08-03 | Bunker Ramo | Electronic circuit modules having cellular bodies and method of making same |
US4057101A (en) * | 1976-03-10 | 1977-11-08 | Westinghouse Electric Corporation | Heat sink |
US4277816A (en) * | 1979-05-29 | 1981-07-07 | International Business Machines Corporation | Electronic circuit module cooling |
US4296455A (en) * | 1979-11-23 | 1981-10-20 | International Business Machines Corporation | Slotted heat sinks for high powered air cooled modules |
US4338621A (en) * | 1980-02-04 | 1982-07-06 | Burroughs Corporation | Hermetic integrated circuit package for high density high power applications |
SU983838A1 (ru) * | 1980-11-27 | 1982-12-23 | Предприятие П/Я Г-4213 | Охладитель дл полупроводниковых приборов |
EP0054597A1 (de) * | 1980-12-18 | 1982-06-30 | International Business Machines Corporation | Kühlanordnung für Modul-Steckerstifte |
-
1983
- 1983-05-25 US US06/497,781 patent/US4546405A/en not_active Expired - Lifetime
-
1984
- 1984-01-31 JP JP59014592A patent/JPS59217345A/ja active Granted
- 1984-05-23 DE DE8484105835T patent/DE3475142D1/de not_active Expired
- 1984-05-23 EP EP84105835A patent/EP0127115B1/de not_active Expired
Also Published As
Publication number | Publication date |
---|---|
EP0127115A2 (de) | 1984-12-05 |
EP0127115B1 (de) | 1988-11-09 |
JPS59217345A (ja) | 1984-12-07 |
JPH0325022B2 (de) | 1991-04-04 |
US4546405A (en) | 1985-10-08 |
EP0127115A3 (en) | 1986-11-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE3475142D1 (en) | Heat sink structure for an electronic package | |
GB2141580B (en) | Heat dissipator for semiconductor devices | |
DE3476296D1 (en) | Semiconductor package | |
DE3277756D1 (en) | Electronic package | |
GB2195056B (en) | Heat dissipation for electronic components | |
GB8421200D0 (en) | Semiconductor integrated circuit | |
GB8430880D0 (en) | Case for electronic devices | |
DE3380380D1 (en) | Power chip package | |
EP0144242A3 (en) | Compound semiconductor integrated circuit device | |
GB8619512D0 (en) | Semiconductor integrated circuit | |
EP0297894A3 (en) | Thermal package for electronic components | |
GB2163287B (en) | Electronic chip-carrier heat sinks | |
GB8426633D0 (en) | Packages for semi-conductor devices | |
EP0164794A3 (en) | Multi-layer heat sinking integrated circuit package | |
DE3464109D1 (en) | Integrated circuit package holder | |
GB2199650B (en) | Heat dissipating mounting for electronic components | |
EP0123795A3 (en) | Unitary heat sink for an electronic device module | |
GB2095033B (en) | Mounting integrated circuit packages | |
DE3377251D1 (en) | Heat exchanger for integrated circuit packages | |
GB2150918B (en) | Packaging tubes for electronic components | |
GB2165704B (en) | Heat dissipation for electronic components | |
GB8325995D0 (en) | Package mounting | |
GB8431534D0 (en) | Semiconductor integrated circuit | |
DE3476297D1 (en) | Flat package for integrated circuit memory chips | |
DE3472501D1 (en) | Apparatus for cooling integrated circuit chips |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |