DE3381543D1 - Verfahren zur erkennung von kuegelchen-mustern. - Google Patents
Verfahren zur erkennung von kuegelchen-mustern.Info
- Publication number
- DE3381543D1 DE3381543D1 DE8383109392T DE3381543T DE3381543D1 DE 3381543 D1 DE3381543 D1 DE 3381543D1 DE 8383109392 T DE8383109392 T DE 8383109392T DE 3381543 T DE3381543 T DE 3381543T DE 3381543 D1 DE3381543 D1 DE 3381543D1
- Authority
- DE
- Germany
- Prior art keywords
- detecting ball
- ball patterns
- patterns
- detecting
- ball
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57163827A JPH0722166B2 (ja) | 1982-09-22 | 1982-09-22 | ダイボンダ等におけるペレツト認識方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3381543D1 true DE3381543D1 (de) | 1990-06-13 |
Family
ID=15781489
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8383109392T Expired - Lifetime DE3381543D1 (de) | 1982-09-22 | 1983-09-21 | Verfahren zur erkennung von kuegelchen-mustern. |
Country Status (4)
Country | Link |
---|---|
US (1) | US4543659A (de) |
EP (1) | EP0108893B1 (de) |
JP (1) | JPH0722166B2 (de) |
DE (1) | DE3381543D1 (de) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60200379A (ja) * | 1984-03-26 | 1985-10-09 | Hitachi Ltd | 画像処理用セグメンテ−シヨン装置 |
JPH0810709B2 (ja) * | 1985-06-20 | 1996-01-31 | ロ−ム株式会社 | ペレツトピツクアツプ方法および装置 |
CH670211A5 (de) * | 1986-06-25 | 1989-05-31 | Lasarray Holding Ag | |
JPS6387832U (de) * | 1986-11-26 | 1988-06-08 | ||
DE3728818A1 (de) * | 1987-08-28 | 1989-03-16 | Muet Gmbh | Anordnung zum ermitteln und beseitigen von fertigungsfehlern einer elektrischen baugruppe |
JPH01284743A (ja) * | 1988-05-10 | 1989-11-16 | Toshiba Corp | 半導体装置の樹脂モールドの外観検査方法とその検査装置 |
US4975863A (en) * | 1988-06-16 | 1990-12-04 | Louisiana State University And Agricultural And Mechanical College | System and process for grain examination |
JPH0821601B2 (ja) * | 1988-12-26 | 1996-03-04 | 株式会社東芝 | 半導体ペレットのダイボンディング方法 |
US4945766A (en) * | 1989-09-08 | 1990-08-07 | General Motors Corporation | Method and apparatus for ultrasonic inspection |
JPH06105741B2 (ja) * | 1989-11-24 | 1994-12-21 | 株式会社東芝 | インナーリードボンディング検査方法 |
US5086477A (en) * | 1990-08-07 | 1992-02-04 | Northwest Technology Corp. | Automated system for extracting design and layout information from an integrated circuit |
US5279669A (en) * | 1991-12-13 | 1994-01-18 | International Business Machines Corporation | Plasma reactor for processing substrates comprising means for inducing electron cyclotron resonance (ECR) and ion cyclotron resonance (ICR) conditions |
JP2804178B2 (ja) * | 1994-04-18 | 1998-09-24 | マイクロン、テクノロジー、インコーポレーテッド | 電子ダイを部品パッケージ内に自動的に位置決めするための方法及び装置 |
JP3298795B2 (ja) * | 1996-07-16 | 2002-07-08 | 株式会社新川 | リードフレームの搬送データ設定方法 |
JP2000068296A (ja) * | 1998-08-19 | 2000-03-03 | Nichiden Mach Ltd | ダイボンダ |
US6730998B1 (en) | 2000-02-10 | 2004-05-04 | Micron Technology, Inc. | Stereolithographic method for fabricating heat sinks, stereolithographically fabricated heat sinks, and semiconductor devices including same |
US6426552B1 (en) * | 2000-05-19 | 2002-07-30 | Micron Technology, Inc. | Methods employing hybrid adhesive materials to secure components of semiconductor device assemblies and packages to one another and assemblies and packages including components secured to one another with such hybrid adhesive materials |
US6432752B1 (en) * | 2000-08-17 | 2002-08-13 | Micron Technology, Inc. | Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages |
SG97164A1 (en) | 2000-09-21 | 2003-07-18 | Micron Technology Inc | Individual selective rework of defective bga solder balls |
US20040164461A1 (en) * | 2002-11-11 | 2004-08-26 | Ahmad Syed Sajid | Programmed material consolidation systems including multiple fabrication sites and associated methods |
US7216009B2 (en) * | 2004-06-14 | 2007-05-08 | Micron Technology, Inc. | Machine vision systems for use with programmable material consolidation system and associated methods and structures |
US8000826B2 (en) * | 2006-01-24 | 2011-08-16 | Synopsys, Inc. | Predicting IC manufacturing yield by considering both systematic and random intra-die process variations |
JP4777923B2 (ja) * | 2007-03-05 | 2011-09-21 | カヤバ工業株式会社 | 緩衝器のバルブ構造 |
JP5789436B2 (ja) * | 2011-07-13 | 2015-10-07 | ファスフォードテクノロジ株式会社 | ダイボンダ |
JP5797492B2 (ja) * | 2011-08-18 | 2015-10-21 | キヤノンマシナリー株式会社 | ボンディング方法およびボンディング装置 |
CN104900558A (zh) * | 2015-05-21 | 2015-09-09 | 佛山市蓝箭电子股份有限公司 | 一种芯片图像识别装置和方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3617744A (en) * | 1969-07-01 | 1971-11-02 | Bell Telephone Labor Inc | Method and apparatus for circuit module testing by comparison of a fluorescent image with a standard pattern |
US3909602A (en) * | 1973-09-27 | 1975-09-30 | California Inst Of Techn | Automatic visual inspection system for microelectronics |
JPS52140278A (en) * | 1976-05-19 | 1977-11-22 | Hitachi Ltd | Position detector |
JPS54158874A (en) * | 1978-06-06 | 1979-12-15 | Matsushita Electronics Corp | Dies bonding unit |
JPS5768042A (en) * | 1980-10-15 | 1982-04-26 | Hitachi Ltd | Pellet pickup method |
JPS5944778B2 (ja) * | 1980-11-29 | 1984-11-01 | 日本電気ホームエレクトロニクス株式会社 | 半導体ペレツト外観検査方法 |
US4496056A (en) * | 1982-03-25 | 1985-01-29 | General Electric Company | Automated inspection system |
-
1982
- 1982-09-22 JP JP57163827A patent/JPH0722166B2/ja not_active Expired - Lifetime
-
1983
- 1983-09-21 EP EP83109392A patent/EP0108893B1/de not_active Expired - Lifetime
- 1983-09-21 DE DE8383109392T patent/DE3381543D1/de not_active Expired - Lifetime
- 1983-09-21 US US06/534,496 patent/US4543659A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0108893A2 (de) | 1984-05-23 |
JPS5954236A (ja) | 1984-03-29 |
US4543659A (en) | 1985-09-24 |
EP0108893A3 (en) | 1987-06-03 |
JPH0722166B2 (ja) | 1995-03-08 |
EP0108893B1 (de) | 1990-05-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8320 | Willingness to grant licences declared (paragraph 23) | ||
8339 | Ceased/non-payment of the annual fee |