DE3380651D1 - Missing or broken wafer sensor - Google Patents

Missing or broken wafer sensor

Info

Publication number
DE3380651D1
DE3380651D1 DE8383302954T DE3380651T DE3380651D1 DE 3380651 D1 DE3380651 D1 DE 3380651D1 DE 8383302954 T DE8383302954 T DE 8383302954T DE 3380651 T DE3380651 T DE 3380651T DE 3380651 D1 DE3380651 D1 DE 3380651D1
Authority
DE
Germany
Prior art keywords
missing
wafer sensor
broken wafer
broken
sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8383302954T
Other languages
German (de)
English (en)
Inventor
Mahasukh Vora
Rajender Malhotra
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Varian Semiconductor Equipment Associates Inc
Original Assignee
Varian Associates Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Varian Associates Inc filed Critical Varian Associates Inc
Application granted granted Critical
Publication of DE3380651D1 publication Critical patent/DE3380651D1/de
Expired legal-status Critical Current

Links

Classifications

    • H10P72/0616—
    • H10P72/00—
    • H10P72/0606—
DE8383302954T 1982-05-24 1983-05-23 Missing or broken wafer sensor Expired DE3380651D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/381,290 US4513430A (en) 1982-05-24 1982-05-24 Missing or broken wafer sensor

Publications (1)

Publication Number Publication Date
DE3380651D1 true DE3380651D1 (en) 1989-11-02

Family

ID=23504465

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8383302954T Expired DE3380651D1 (en) 1982-05-24 1983-05-23 Missing or broken wafer sensor

Country Status (4)

Country Link
US (1) US4513430A (OSRAM)
EP (1) EP0095371B1 (OSRAM)
JP (1) JPS58214844A (OSRAM)
DE (1) DE3380651D1 (OSRAM)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4665392A (en) * 1984-11-13 1987-05-12 Ppg Industries, Inc. Method of and apparatus for detecting presence of a mark on a transparent substrate
GB8432438D0 (en) * 1984-12-21 1985-02-06 De La Rue Syst Sensing sheets
JPH0334908Y2 (OSRAM) * 1986-10-29 1991-07-24
KR0177589B1 (en) * 1987-02-13 1999-04-15 Tokyo Electron Ltd Wafer accounting and processing system
US4756012A (en) * 1987-02-27 1988-07-05 Hewlett-Packard Company Surface mounted device parts counter
JPH077082B2 (ja) * 1988-01-27 1995-01-30 富士電機株式会社 センサ出力測定方式
US4987407A (en) * 1988-04-22 1991-01-22 Asq. Boats, Inc. Wafer interleaving with electro-optical safety features
US5428820A (en) * 1993-10-01 1995-06-27 Motorola Adaptive radio receiver controller method and apparatus
US5980194A (en) * 1996-07-15 1999-11-09 Applied Materials, Inc. Wafer position error detection and correction system
TW344847B (en) * 1996-08-29 1998-11-11 Tokyo Electron Co Ltd Substrate treatment system, substrate transfer system, and substrate transfer method
US6081733A (en) * 1997-04-16 2000-06-27 Motorola, Inc. Communication control apparatus and method
US6205870B1 (en) 1997-10-10 2001-03-27 Applied Komatsu Technology, Inc. Automated substrate processing systems and methods
US5948986A (en) * 1997-12-26 1999-09-07 Applied Materials, Inc. Monitoring of wafer presence and position in semiconductor processing operations
CH693726A5 (de) * 1998-07-09 2003-12-31 Tec Sem Ag Vorrichtung und Verfahren zur Bereitstellung eines vollständigen Waferstapels.
RU2182362C2 (ru) * 2000-05-30 2002-05-10 Ульяновский государственный технический университет Устройство для контроля времени работы объекта
KR100481178B1 (ko) * 2002-09-03 2005-04-07 삼성전자주식회사 기판유무검사장치
US6934595B1 (en) * 2003-02-26 2005-08-23 National Semiconductor Corp. Method and system for reducing semiconductor wafer breakage
US7750819B2 (en) * 2008-04-07 2010-07-06 Tech Semiconductor Singapore Pte Ltd Real-time detection of wafer shift/slide in a chamber
US10325796B2 (en) 2017-10-30 2019-06-18 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and system for detecting wafer damage
CN110957251B (zh) * 2019-11-20 2022-11-18 上海至纯洁净系统科技股份有限公司 一种计量晶圆片数的短行程升降装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5526483B2 (OSRAM) * 1973-05-22 1980-07-14
US4063820A (en) * 1975-11-10 1977-12-20 Rca Corporation Apparatus for measuring a dimension of an object
JPS5437976A (en) * 1977-08-30 1979-03-20 Toyoda Mach Works Ltd Method of detecting breakage in tools
GB1604841A (en) * 1978-05-26 1981-12-16 Gkn Fasteners Ltd Method of and apparatus for determining a dimension of an article
JPS5539021A (en) * 1978-09-14 1980-03-18 Hitachi Electronics Eng Co Ltd Automatic plate tester
JPS5549282A (en) * 1978-10-05 1980-04-09 Toshiba Corp Heat-sensitive recording device
DE2844912A1 (de) * 1978-10-14 1980-04-24 Bosch Gmbh Robert Einrichtung und verfahren zur bestimmung der abmasse und/oder der geschwindigkeit eines sich bewegenden teils
US4268843A (en) * 1979-02-21 1981-05-19 General Electric Company Solid state relay
JPS55124077A (en) * 1979-03-16 1980-09-24 Nec Corp Semiconductor wafer electric characteristic testing apparatus
US4311427A (en) * 1979-12-21 1982-01-19 Varian Associates, Inc. Wafer transfer system

Also Published As

Publication number Publication date
JPS58214844A (ja) 1983-12-14
JPH0370902B2 (OSRAM) 1991-11-11
EP0095371A3 (en) 1986-03-26
US4513430A (en) 1985-04-23
EP0095371B1 (en) 1989-09-27
EP0095371A2 (en) 1983-11-30

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC.(N.

8339 Ceased/non-payment of the annual fee