DE3379620D1 - Plastic encapsulated semiconductor power device means and method - Google Patents

Plastic encapsulated semiconductor power device means and method

Info

Publication number
DE3379620D1
DE3379620D1 DE8383306799T DE3379620T DE3379620D1 DE 3379620 D1 DE3379620 D1 DE 3379620D1 DE 8383306799 T DE8383306799 T DE 8383306799T DE 3379620 T DE3379620 T DE 3379620T DE 3379620 D1 DE3379620 D1 DE 3379620D1
Authority
DE
Germany
Prior art keywords
power device
semiconductor power
encapsulated semiconductor
device means
plastic encapsulated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8383306799T
Other languages
German (de)
English (en)
Inventor
Martin Aaron Kalfus
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Application granted granted Critical
Publication of DE3379620D1 publication Critical patent/DE3379620D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
DE8383306799T 1982-11-08 1983-11-08 Plastic encapsulated semiconductor power device means and method Expired DE3379620D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/440,117 US4568962A (en) 1982-11-08 1982-11-08 Plastic encapsulated semiconductor power device means and method

Publications (1)

Publication Number Publication Date
DE3379620D1 true DE3379620D1 (en) 1989-05-18

Family

ID=23747511

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8383306799T Expired DE3379620D1 (en) 1982-11-08 1983-11-08 Plastic encapsulated semiconductor power device means and method

Country Status (5)

Country Link
US (1) US4568962A (enExample)
EP (1) EP0108646B1 (enExample)
JP (1) JPS5999744A (enExample)
DE (1) DE3379620D1 (enExample)
HK (1) HK102889A (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3508456C2 (de) * 1985-03-09 1987-01-08 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungshalbleitermodul und Verfahren zur Herstellung eines solchen Moduls
DE3521572A1 (de) * 1985-06-15 1986-12-18 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungshalbleitermodul mit keramiksubstrat
US5378928A (en) * 1993-04-27 1995-01-03 Motorola, Inc. Plastic encapsulated microelectronic device and method
US5344296A (en) * 1993-07-06 1994-09-06 Motorola, Inc. Method and apparatus for forming a runner in a mold assembly
JP2991010B2 (ja) * 1993-09-29 1999-12-20 富士電機株式会社 半導体装置およびその製造方法
US6078103A (en) * 1998-10-29 2000-06-20 Mcdonnell Douglas Corporation Dimpled contacts for metal-to-semiconductor connections, and methods for fabricating same

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3723836A (en) * 1972-03-15 1973-03-27 Motorola Inc High power semiconductor device included in a standard outline housing
GB1506735A (en) * 1975-03-21 1978-04-12 Westinghouse Brake & Signal Semiconductor devices
US4106052A (en) * 1975-04-19 1978-08-08 Semikron Gesellschaft Fur Gleichrichterbau Und Elektronik M.B.H. Semiconductor rectifier unit having a base plate with means for maintaining insulating wafers in a desired position
DE7512573U (de) * 1975-04-19 1975-09-04 Semikron Gesellschaft Fuer Gleichri Halbleitergleichrichteranordnung
DE2603813C2 (de) * 1976-02-02 1982-11-18 Brown, Boveri & Cie Ag, 6800 Mannheim Spannvorrichtung für ein thermisch und elektrisch druckkontaktiertes Halbleiterbauelement in Scheibenzellenbauweise
US4332537A (en) * 1978-07-17 1982-06-01 Dusan Slepcevic Encapsulation mold with removable cavity plates
US4249034A (en) * 1978-11-27 1981-02-03 General Electric Company Semiconductor package having strengthening and sealing upper chamber
DE2930760A1 (de) * 1979-07-28 1981-02-12 Itt Ind Gmbh Deutsche Verfahren zum umhuellen von halbleiterbauelementen mittels spritzgiessens
DE2942401C2 (de) * 1979-10-19 1984-09-06 Siemens AG, 1000 Berlin und 8000 München Halbleiterbauelement mit mehreren Halbleiterkörpern
DE2942409A1 (de) * 1979-10-19 1981-04-23 Siemens AG, 1000 Berlin und 8000 München Halbleiterbauelement mit mehreren halbleiterkoerpern

Also Published As

Publication number Publication date
HK102889A (en) 1990-01-05
EP0108646A2 (en) 1984-05-16
US4568962A (en) 1986-02-04
JPH027186B2 (enExample) 1990-02-15
EP0108646A3 (en) 1985-07-03
JPS5999744A (ja) 1984-06-08
EP0108646B1 (en) 1989-04-12

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee