DE3378241D1 - Electronic circuit chip connection assembly and method - Google Patents

Electronic circuit chip connection assembly and method

Info

Publication number
DE3378241D1
DE3378241D1 DE8383902413T DE3378241T DE3378241D1 DE 3378241 D1 DE3378241 D1 DE 3378241D1 DE 8383902413 T DE8383902413 T DE 8383902413T DE 3378241 T DE3378241 T DE 3378241T DE 3378241 D1 DE3378241 D1 DE 3378241D1
Authority
DE
Germany
Prior art keywords
plate
circuit chip
electronic circuit
rib
cover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8383902413T
Other languages
English (en)
Inventor
Jon Schroeder
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SILICON CONNECTION Inc
Original Assignee
SILICON CONNECTION Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SILICON CONNECTION Inc filed Critical SILICON CONNECTION Inc
Application granted granted Critical
Publication of DE3378241D1 publication Critical patent/DE3378241D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/365—Assembling flexible printed circuits with other printed circuits by abutting, i.e. without alloying process
DE8383902413T 1983-07-11 1983-07-11 Electronic circuit chip connection assembly and method Expired DE3378241D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US1983/001069 WO1985000467A1 (en) 1983-07-11 1983-07-11 Electronic circuit chip connection assembly and method

Publications (1)

Publication Number Publication Date
DE3378241D1 true DE3378241D1 (en) 1988-11-17

Family

ID=22175347

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8383902413T Expired DE3378241D1 (en) 1983-07-11 1983-07-11 Electronic circuit chip connection assembly and method

Country Status (5)

Country Link
EP (1) EP0148820B1 (de)
JP (1) JPH01500705A (de)
AT (1) ATE37966T1 (de)
DE (1) DE3378241D1 (de)
WO (1) WO1985000467A1 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4719696A (en) * 1984-10-19 1988-01-19 Burr-Brown Corporation Package for an expandable remote interface unit
US5014161A (en) * 1985-07-22 1991-05-07 Digital Equipment Corporation System for detachably mounting semiconductors on conductor substrate
US4658330A (en) * 1985-09-09 1987-04-14 Tektronix, Inc. Mounting a hybrid circuit to a circuit board
AU598253B2 (en) * 1986-05-07 1990-06-21 Digital Equipment Corporation System for detachably mounting semi-conductors on conductor substrates
US4969828A (en) * 1989-05-17 1990-11-13 Amp Incorporated Electrical socket for TAB IC's
US5345365A (en) * 1992-05-05 1994-09-06 Massachusetts Institute Of Technology Interconnection system for high performance electronic hybrids
GB9209912D0 (en) * 1992-05-08 1992-06-24 Winslow Int Ltd Mounting arrangement for an intergrated circuit chip carrier

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3335327A (en) * 1965-01-06 1967-08-08 Augat Inc Holder for attaching flat pack to printed circuit board
CA1021066A (en) * 1974-10-17 1977-11-15 James B. Morris (Sr.) Semiconductor chip interconnect package
USRE31114E (en) * 1975-11-13 1982-12-28 Tektronix, Inc. Electrical connector
US4063791A (en) * 1976-12-27 1977-12-20 Cutchaw John M Connector for leadless integrated circuit packages
FR2518813A1 (fr) * 1981-12-22 1983-06-24 Socapex Support d'interconnexion d'un boitier de circuit integre sur un circuit imprime et systeme d'interconnexion utilisant un tel support

Also Published As

Publication number Publication date
EP0148820A1 (de) 1985-07-24
JPH01500705A (ja) 1989-03-09
WO1985000467A1 (en) 1985-01-31
ATE37966T1 (de) 1988-10-15
EP0148820B1 (de) 1988-10-12

Similar Documents

Publication Publication Date Title
US3851294A (en) Connector for sealingly interconnecting a multiple core electric cable and a printed circuit
US4945633A (en) Method of mounting a printed circuit board and securing the earthing to a casing
KR920704554A (ko) 전자회로용 하우징
KR880003457A (ko) 전화 잭
JPS5416978A (en) Elastic cover for electric connector
CA2149540A1 (en) Compliant stacking connector for printed circuit boards
JPS6466990A (en) Molded circuit board
EP0380125A3 (de) Dichtungsstruktur für ein Endteil
EP0375271A3 (de) Elektrische Verbindungsanordnung und Verfahren zur Herstellung einer elektrischen Verbindung
MY111967A (en) Apparatus for interconnecting electrical contacts
SE7713147L (sv) Elektrisk anslutningsbox
EP0228278A3 (de) Elektrische Verbinderanordnung
JPS5427984A (en) Electric connector
DE3565036D1 (en) Mechanical and electrical assembling device for highly integrated electronic computer circuit boards
GB2008333A (en) Electrical connector
KR850000144A (ko) 간이 전기스위치
DE3378241D1 (en) Electronic circuit chip connection assembly and method
US4208642A (en) Modular microstrip transmission line circuitry
EP0192468A3 (de) Fassung zur Aufnahme einer integrierten elektronischen Schaltung und zusätzlicher Schaltkreis dafür
ES273365U (es) Un ensamble de componente electronico
US5148135A (en) Electronic hardware package
KR940008167A (ko) 소켓
ES270123U (es) Mejoras en los conjuntos de circuito impreso de insercion en los bloques ensamblados de portatarjetas.
JPH08222877A (ja) シールドカバー取付構造
DE3365144D1 (en) Electrical connector for an electronic package

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee