DE3378091D1 - Semiconductor device comprising a ceramic base - Google Patents

Semiconductor device comprising a ceramic base

Info

Publication number
DE3378091D1
DE3378091D1 DE8383401542T DE3378091T DE3378091D1 DE 3378091 D1 DE3378091 D1 DE 3378091D1 DE 8383401542 T DE8383401542 T DE 8383401542T DE 3378091 T DE3378091 T DE 3378091T DE 3378091 D1 DE3378091 D1 DE 3378091D1
Authority
DE
Germany
Prior art keywords
semiconductor device
ceramic base
ceramic
base
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8383401542T
Other languages
German (de)
English (en)
Inventor
Tetsuhi Wakabayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Application granted granted Critical
Publication of DE3378091D1 publication Critical patent/DE3378091D1/de
Expired legal-status Critical Current

Links

Classifications

    • H10W70/635—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H10W70/682—
    • H10W70/685—
    • H10W72/5449—
    • H10W90/754—
DE8383401542T 1982-07-30 1983-07-27 Semiconductor device comprising a ceramic base Expired DE3378091D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57133113A JPS5923548A (ja) 1982-07-30 1982-07-30 半導体装置

Publications (1)

Publication Number Publication Date
DE3378091D1 true DE3378091D1 (en) 1988-10-27

Family

ID=15097105

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8383401542T Expired DE3378091D1 (en) 1982-07-30 1983-07-27 Semiconductor device comprising a ceramic base

Country Status (4)

Country Link
EP (1) EP0100727B1 (enExample)
JP (1) JPS5923548A (enExample)
DE (1) DE3378091D1 (enExample)
IE (1) IE54676B1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0756887B2 (ja) * 1988-04-04 1995-06-14 株式会社日立製作所 半導体パッケージ及びそれを用いたコンピュータ
EP0971405A3 (de) * 1994-09-23 2000-05-10 Siemens S.A. Verfahren zur Herstellung eines Substrates für ein Polymer Stud Grid Array
CN103811434A (zh) * 2014-02-26 2014-05-21 中国兵器工业集团第二一四研究所苏州研发中心 一种ltcc无引线封装

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2296988A1 (fr) * 1974-12-31 1976-07-30 Ibm France Perfectionnement aux procedes de fabrication d'un module de circuits multicouches en ceramique
JPS53119675A (en) * 1977-03-28 1978-10-19 Fujitsu Ltd Mounting structure of lsi
DE2938567C2 (de) * 1979-09-24 1982-04-29 Siemens AG, 1000 Berlin und 8000 München Gehäuse für hochintegrierte Schaltkreise
JPS5651846A (en) * 1979-10-04 1981-05-09 Fujitsu Ltd Ic package
JPS57134847U (enExample) * 1981-02-16 1982-08-23
JPS598361A (ja) * 1982-07-06 1984-01-17 Nec Corp 半導体集積回路装置の容器

Also Published As

Publication number Publication date
JPH0223031B2 (enExample) 1990-05-22
EP0100727B1 (en) 1988-09-21
JPS5923548A (ja) 1984-02-07
IE831822L (en) 1984-01-30
EP0100727A3 (en) 1985-08-14
EP0100727A2 (en) 1984-02-15
IE54676B1 (en) 1990-01-03

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee