DE3373380D1 - Method of forming thick film circuit patterns with a sufficiently wide and uniformly thick strip - Google Patents
Method of forming thick film circuit patterns with a sufficiently wide and uniformly thick stripInfo
- Publication number
- DE3373380D1 DE3373380D1 DE8383307644T DE3373380T DE3373380D1 DE 3373380 D1 DE3373380 D1 DE 3373380D1 DE 8383307644 T DE8383307644 T DE 8383307644T DE 3373380 T DE3373380 T DE 3373380T DE 3373380 D1 DE3373380 D1 DE 3373380D1
- Authority
- DE
- Germany
- Prior art keywords
- circuit patterns
- film circuit
- sufficiently wide
- thick film
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/702—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof
- H01L21/705—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof of thick-film circuits or parts thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22143382A JPS59111387A (ja) | 1982-12-16 | 1982-12-16 | 厚膜回路パタ−ンの形成方法 |
JP22430782A JPS59113686A (ja) | 1982-12-20 | 1982-12-20 | 厚膜回路の形成方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3373380D1 true DE3373380D1 (en) | 1987-10-08 |
Family
ID=26524295
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8383307644T Expired DE3373380D1 (en) | 1982-12-16 | 1983-12-15 | Method of forming thick film circuit patterns with a sufficiently wide and uniformly thick strip |
Country Status (3)
Country | Link |
---|---|
US (1) | US4656048A (de) |
EP (1) | EP0113979B1 (de) |
DE (1) | DE3373380D1 (de) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4720914A (en) * | 1984-07-26 | 1988-01-26 | Matsushita Electric Industrial Co., Ltd. | Method for forming thick film circuit using rotatable nozzle having wide discharge hole |
FR2579856B1 (fr) * | 1985-03-28 | 1988-09-16 | Lignes Telegraph Telephon | Dispositif et procede d'ecriture pour la realisation de circuits electriques |
US5099090A (en) * | 1988-05-11 | 1992-03-24 | Ariel Electronics, Inc. | Circuit writer |
JPH01319990A (ja) * | 1988-06-22 | 1989-12-26 | Sumitomo Electric Ind Ltd | 厚膜形成方法 |
US5786306A (en) * | 1990-06-22 | 1998-07-28 | Massachusetts Institute Of Technology | Synthesis of high TC superconducting coatings and patterns by melt writing and oxidation of metallic precursor alloys |
US5143744A (en) * | 1991-06-19 | 1992-09-01 | Minnesota Mining And Manufacturing Company | Dynamic contact angle measurement system |
JP3583462B2 (ja) * | 1993-04-05 | 2004-11-04 | フォード モーター カンパニー | 電子成分のための微小はんだ付け装置および方法 |
US5478700A (en) * | 1993-12-21 | 1995-12-26 | International Business Machines Corporation | Method for applying bonding agents to pad and/or interconnection sites in the manufacture of electrical circuits using a bonding agent injection head |
JP3801674B2 (ja) | 1995-12-15 | 2006-07-26 | 松下電器産業株式会社 | 電子部品の実装方法 |
US5709905A (en) * | 1997-01-28 | 1998-01-20 | Motorola, Inc. | Apparatus and method for automatic monitoring and control of stencil printing |
US6045615A (en) * | 1998-01-28 | 2000-04-04 | International Business Machines Corporation | Homogeneous screening nozzle |
US6321438B1 (en) | 1998-05-01 | 2001-11-27 | Scimed Life Systems, Inc. | Method of applying a matching layer to a transducer |
JP3868674B2 (ja) * | 1999-08-09 | 2007-01-17 | 株式会社小糸製作所 | 光源バルブの製造方法 |
AUPQ790100A0 (en) * | 2000-06-01 | 2000-06-22 | Telstra R & D Management Pty Ltd | A validation system |
JP3958972B2 (ja) * | 2001-01-19 | 2007-08-15 | 矢崎総業株式会社 | 回路体の製造方法及び回路体の製造装置 |
US6706315B2 (en) * | 2001-09-17 | 2004-03-16 | Xerox Corporation | Coating process for coating die with laser position sensors |
KR100540633B1 (ko) * | 2003-06-20 | 2006-01-11 | 주식회사 탑 엔지니어링 | 페이스트 도포기 및 그 제어 방법 |
US20050121139A1 (en) * | 2003-12-03 | 2005-06-09 | Texas Instruments Incorporated | System and method used in attaching die for ball grid arrays |
JP2005347628A (ja) * | 2004-06-04 | 2005-12-15 | Sharp Corp | 電極形成方法、電極及び太陽電池 |
US20060228466A1 (en) * | 2004-12-30 | 2006-10-12 | Gang Yu | Solution dispense and patterning process and apparatus |
US20060193969A1 (en) * | 2005-02-25 | 2006-08-31 | Speedline Technologies, Inc. | Method and apparatus for streaming a viscous material on a substrate |
JP5114037B2 (ja) * | 2006-09-26 | 2013-01-09 | 富士フイルム株式会社 | 塗布装置及び塗布方法 |
US7980197B2 (en) * | 2006-11-03 | 2011-07-19 | Illinois Tool Works, Inc. | Method and apparatus for dispensing a viscous material on a substrate |
WO2010028020A1 (en) * | 2008-09-02 | 2010-03-11 | Nscrypt, Inc. | Dispensing patterns including lines and dots at high speeds |
JP5448030B2 (ja) * | 2008-11-19 | 2014-03-19 | 新日鐵住金株式会社 | 超音波探傷方法及び装置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4133910A (en) * | 1977-12-01 | 1979-01-09 | The United States Of America As Represented By The Secretary Of The Army | Thick film deposition of microelectronic circuit |
US4291642A (en) * | 1979-12-26 | 1981-09-29 | Rca Corporation | Nozzle for dispensing viscous fluid |
US4338351A (en) * | 1980-09-10 | 1982-07-06 | Cts Corporation | Apparatus and method for producing uniform fired resistors |
US4515297A (en) * | 1983-05-26 | 1985-05-07 | At&T Technologies, Inc. | Methods for multipoint dispensing of viscous material |
-
1983
- 1983-12-15 EP EP83307644A patent/EP0113979B1/de not_active Expired
- 1983-12-15 DE DE8383307644T patent/DE3373380D1/de not_active Expired
-
1985
- 1985-11-27 US US06/802,950 patent/US4656048A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US4656048A (en) | 1987-04-07 |
EP0113979B1 (de) | 1987-09-02 |
EP0113979A1 (de) | 1984-07-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |